CN1203726C - 基于硅的传感器系统 - Google Patents

基于硅的传感器系统 Download PDF

Info

Publication number
CN1203726C
CN1203726C CNB008153809A CN00815380A CN1203726C CN 1203726 C CN1203726 C CN 1203726C CN B008153809 A CNB008153809 A CN B008153809A CN 00815380 A CN00815380 A CN 00815380A CN 1203726 C CN1203726 C CN 1203726C
Authority
CN
China
Prior art keywords
transducer
sensing system
carrier body
contact element
active parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB008153809A
Other languages
English (en)
Chinese (zh)
Other versions
CN1387741A (zh
Inventor
M·米伦博恩
J·F·库曼
P·U·舍尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Shengyang Lingbi Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by Shengyang Lingbi Co ltd filed Critical Shengyang Lingbi Co ltd
Publication of CN1387741A publication Critical patent/CN1387741A/zh
Application granted granted Critical
Publication of CN1203726C publication Critical patent/CN1203726C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
CNB008153809A 1999-09-06 2000-09-06 基于硅的传感器系统 Expired - Lifetime CN1203726C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DKPA1999/01254 1999-09-06
DKPA199901254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/391,628 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system
US09/570,434 2000-05-12

Publications (2)

Publication Number Publication Date
CN1387741A CN1387741A (zh) 2002-12-25
CN1203726C true CN1203726C (zh) 2005-05-25

Family

ID=27221189

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008153809A Expired - Lifetime CN1203726C (zh) 1999-09-06 2000-09-06 基于硅的传感器系统

Country Status (10)

Country Link
EP (1) EP1214864B1 (da)
JP (2) JP4459498B2 (da)
CN (1) CN1203726C (da)
AT (1) ATE242587T1 (da)
AU (1) AU6984100A (da)
CA (1) CA2383740C (da)
DE (1) DE60003199T2 (da)
DK (1) DK1214864T3 (da)
PL (1) PL209935B1 (da)
WO (1) WO2001019134A2 (da)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106716636A (zh) * 2014-09-17 2017-05-24 英特尔公司 具有使用穿硅过孔(tsv)的集成麦克风器件的管芯
CN108807657A (zh) * 2017-04-26 2018-11-13 矽品精密工业股份有限公司 封装结构及其制法

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
CN100515119C (zh) * 2003-08-12 2009-07-15 中国科学院声学研究所 一种用于硅微电容传声器中的芯片及其制备方法
CN100499877C (zh) * 2003-12-17 2009-06-10 中国科学院声学研究所 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法
DE102004011203B4 (de) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
JP4553611B2 (ja) * 2004-03-15 2010-09-29 三洋電機株式会社 回路装置
JP4539450B2 (ja) * 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005056759A1 (de) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
CN101005718B (zh) * 2006-01-16 2011-04-20 财团法人工业技术研究院 微型声学传感器及其制造方法
JP4771290B2 (ja) * 2006-07-19 2011-09-14 ヤマハ株式会社 圧力センサの製造方法
DE112007003083B4 (de) * 2006-12-22 2019-05-09 Tdk Corp. Mikrofonbaugruppe mit Unterfüllmittel mit niedrigem Wärmeausdehnungskoeffizienten
JP4893380B2 (ja) * 2007-03-09 2012-03-07 ヤマハ株式会社 コンデンサマイク装置
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
US8767983B2 (en) * 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (ja) * 2007-09-26 2009-04-16 Rohm Co Ltd 半導体センサ装置
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
CN102187685B (zh) * 2008-10-14 2015-03-11 美商楼氏电子有限公司 具有多个换能器元件的传声器
US20100303274A1 (en) * 2009-05-18 2010-12-02 William Ryan Microphone Having Reduced Vibration Sensitivity
KR101609270B1 (ko) 2009-08-12 2016-04-06 삼성전자주식회사 압전형 마이크로 스피커 및 그 제조 방법
DE102009047592B4 (de) * 2009-12-07 2019-06-19 Robert Bosch Gmbh Verfahren zur Herstellung eines Siliziumzwischenträgers
IT1397976B1 (it) * 2009-12-23 2013-02-04 St Microelectronics Rousset Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
JP2013093637A (ja) * 2010-02-24 2013-05-16 Panasonic Corp 半導体装置及びその製造方法
TWI491009B (zh) 2010-10-08 2015-07-01 晶片級電磁干擾屏蔽結構及製造方法
CN102456669B (zh) * 2010-10-25 2015-07-22 环旭电子股份有限公司 芯片级电磁干扰屏蔽结构及制造方法
WO2012088688A1 (en) * 2010-12-30 2012-07-05 Goertek Inc. A mems microphone and method for packaging the same
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型ｍｅｍｓセンサ
JP5799619B2 (ja) 2011-06-24 2015-10-28 船井電機株式会社 マイクロホンユニット
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (de) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
WO2014094831A1 (en) * 2012-12-18 2014-06-26 Epcos Ag Top-port mems microphone and method of manufacturing the same
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (it) * 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
US9264832B2 (en) 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2543443B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
CN104780490A (zh) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 一种mems麦克风的封装结构及其制造方法
CN111711903B (zh) * 2020-06-24 2021-10-01 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533795A (en) * 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106716636A (zh) * 2014-09-17 2017-05-24 英特尔公司 具有使用穿硅过孔(tsv)的集成麦克风器件的管芯
CN106716636B (zh) * 2014-09-17 2021-05-28 英特尔公司 具有使用穿硅过孔(tsv)的集成麦克风器件的管芯
CN108807657A (zh) * 2017-04-26 2018-11-13 矽品精密工业股份有限公司 封装结构及其制法
CN108807657B (zh) * 2017-04-26 2022-01-04 矽品精密工业股份有限公司 封装结构及其制法

Also Published As

Publication number Publication date
JP2007028671A (ja) 2007-02-01
CN1387741A (zh) 2002-12-25
WO2001019134A2 (en) 2001-03-15
CA2383740A1 (en) 2001-03-15
WO2001019134A3 (en) 2001-09-07
DE60003199D1 (de) 2003-07-10
DK1214864T3 (da) 2003-08-25
EP1214864A2 (en) 2002-06-19
AU6984100A (en) 2001-04-10
PL354095A1 (en) 2003-12-29
EP1214864B1 (en) 2003-06-04
DE60003199T2 (de) 2004-07-01
JP4303742B2 (ja) 2009-07-29
ATE242587T1 (de) 2003-06-15
JP4459498B2 (ja) 2010-04-28
CA2383740C (en) 2005-04-05
JP2003508998A (ja) 2003-03-04
PL209935B1 (pl) 2011-11-30

Similar Documents

Publication Publication Date Title
CN1203726C (zh) 基于硅的传感器系统
CN1205841C (zh) 压力传感器
US7447323B2 (en) Surface mountable transducer system
US6732588B1 (en) Pressure transducer
US9056760B2 (en) Miniaturized electrical component comprising an MEMS and an ASIC and production method
US7933428B2 (en) Microphone apparatus
US20110198714A1 (en) Packages and methods for packaging mems microphone devices
US7994618B2 (en) Sensor module and method for manufacturing same
CN102685657A (zh) 部件
CN1795699A (zh) 声音检测机构
WO2012103087A1 (en) Packaged microphone with reduced parasitics
US11265641B2 (en) Microelectromechanical systems vibration sensor
CN210579221U (zh) 硅麦克风
WO2014085611A1 (en) Mems pressure sensor assembly with electromagnetic shield
CN213818178U (zh) 微机电系统振动传感器管芯
US8575550B2 (en) Apparatus having a screened structure for detecting thermal radiation
US7572660B2 (en) Electrical through-plating of semiconductor chips
CN110620978A (zh) 硅麦克风
KR101472297B1 (ko) 1칩형 mems 마이크로폰 및 그 제작 방법
US20230345184A1 (en) Micro-electro-mechanical system microphone package
KR20220001373A (ko) 마이크로폰 장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SHENGYANG MENSI CO., LTD.

Free format text: FORMER OWNER: MICROTRONICS A/S

Effective date: 20030424

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20030424

Address after: Danish kongens Lyngby

Applicant after: Sonion Clemens Limited by Share Ltd.

Address before: Roskilde

Applicant before: MICROTRONIC A/S

C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: EPCOS PRIVATE LIMITED

Free format text: FORMER OWNER: PARS MEMS CO., LTD.

Effective date: 20121113

C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee

Owner name: PARS MEMS CO., LTD.

Free format text: FORMER NAME: SONION LYNGBY A/S

CP03 Change of name, title or address

Address after: Roskilde

Patentee after: MEMS Co.,Ltd.

Address before: Denmark Frilandsmuseet

Patentee before: Shengyang Lingbi Co.,Ltd.

TR01 Transfer of patent right

Effective date of registration: 20121113

Address after: Singapore Singapore

Patentee after: Epp Kos Private Ltd.

Address before: Roskilde

Patentee before: MEMS Co.,Ltd.

TR01 Transfer of patent right

Effective date of registration: 20170523

Address after: Tokyo, Japan

Patentee after: TDK Corp.

Address before: Singapore Singapore

Patentee before: Epp Kos Private Ltd.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20050525

CX01 Expiry of patent term