JP4459498B2 - シリコンベースのセンサーシステム - Google Patents

シリコンベースのセンサーシステム Download PDF

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Publication number
JP4459498B2
JP4459498B2 JP2001522196A JP2001522196A JP4459498B2 JP 4459498 B2 JP4459498 B2 JP 4459498B2 JP 2001522196 A JP2001522196 A JP 2001522196A JP 2001522196 A JP2001522196 A JP 2001522196A JP 4459498 B2 JP4459498 B2 JP 4459498B2
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JP
Japan
Prior art keywords
sensor system
contact
transducer
transducer element
active
Prior art date
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Expired - Fee Related
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JP2001522196A
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English (en)
Japanese (ja)
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JP2003508998A5 (da
JP2003508998A (ja
Inventor
マティアス・ミューレンボルン
ヨッヘン・エフ・クーマン
ペーター・ウ・シェール
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Pulse Mems ApS
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Pulse Mems ApS
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Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by Pulse Mems ApS filed Critical Pulse Mems ApS
Publication of JP2003508998A publication Critical patent/JP2003508998A/ja
Publication of JP2003508998A5 publication Critical patent/JP2003508998A5/ja
Application granted granted Critical
Publication of JP4459498B2 publication Critical patent/JP4459498B2/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
JP2001522196A 1999-09-06 2000-09-06 シリコンベースのセンサーシステム Expired - Fee Related JP4459498B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DK1999/01254 1999-09-06
DKPA199901254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/391,628 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system
US09/570,434 2000-05-12
PCT/DK2000/000491 WO2001019134A2 (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006273173A Division JP4303742B2 (ja) 1999-09-06 2006-10-04 シリコンコンデンサーマイクロフォン

Publications (3)

Publication Number Publication Date
JP2003508998A JP2003508998A (ja) 2003-03-04
JP2003508998A5 JP2003508998A5 (da) 2006-12-07
JP4459498B2 true JP4459498B2 (ja) 2010-04-28

Family

ID=27221189

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2001522196A Expired - Fee Related JP4459498B2 (ja) 1999-09-06 2000-09-06 シリコンベースのセンサーシステム
JP2006273173A Expired - Fee Related JP4303742B2 (ja) 1999-09-06 2006-10-04 シリコンコンデンサーマイクロフォン

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006273173A Expired - Fee Related JP4303742B2 (ja) 1999-09-06 2006-10-04 シリコンコンデンサーマイクロフォン

Country Status (10)

Country Link
EP (1) EP1214864B1 (da)
JP (2) JP4459498B2 (da)
CN (1) CN1203726C (da)
AT (1) ATE242587T1 (da)
AU (1) AU6984100A (da)
CA (1) CA2383740C (da)
DE (1) DE60003199T2 (da)
DK (1) DK1214864T3 (da)
PL (1) PL209935B1 (da)
WO (1) WO2001019134A2 (da)

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US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
CN100515119C (zh) * 2003-08-12 2009-07-15 中国科学院声学研究所 一种用于硅微电容传声器中的芯片及其制备方法
CN100499877C (zh) * 2003-12-17 2009-06-10 中国科学院声学研究所 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法
DE102004011203B4 (de) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
JP4553611B2 (ja) * 2004-03-15 2010-09-29 三洋電機株式会社 回路装置
JP4539450B2 (ja) * 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005056759A1 (de) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
CN101005718B (zh) * 2006-01-16 2011-04-20 财团法人工业技术研究院 微型声学传感器及其制造方法
JP4771290B2 (ja) * 2006-07-19 2011-09-14 ヤマハ株式会社 圧力センサの製造方法
DE112007003083B4 (de) * 2006-12-22 2019-05-09 Tdk Corp. Mikrofonbaugruppe mit Unterfüllmittel mit niedrigem Wärmeausdehnungskoeffizienten
JP4893380B2 (ja) * 2007-03-09 2012-03-07 ヤマハ株式会社 コンデンサマイク装置
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
US8767983B2 (en) * 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (ja) * 2007-09-26 2009-04-16 Rohm Co Ltd 半導体センサ装置
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
CN102187685B (zh) * 2008-10-14 2015-03-11 美商楼氏电子有限公司 具有多个换能器元件的传声器
US20100303274A1 (en) * 2009-05-18 2010-12-02 William Ryan Microphone Having Reduced Vibration Sensitivity
KR101609270B1 (ko) 2009-08-12 2016-04-06 삼성전자주식회사 압전형 마이크로 스피커 및 그 제조 방법
DE102009047592B4 (de) * 2009-12-07 2019-06-19 Robert Bosch Gmbh Verfahren zur Herstellung eines Siliziumzwischenträgers
IT1397976B1 (it) * 2009-12-23 2013-02-04 St Microelectronics Rousset Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
JP2013093637A (ja) * 2010-02-24 2013-05-16 Panasonic Corp 半導体装置及びその製造方法
TWI491009B (zh) 2010-10-08 2015-07-01 晶片級電磁干擾屏蔽結構及製造方法
CN102456669B (zh) * 2010-10-25 2015-07-22 环旭电子股份有限公司 芯片级电磁干扰屏蔽结构及制造方法
WO2012088688A1 (en) * 2010-12-30 2012-07-05 Goertek Inc. A mems microphone and method for packaging the same
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型ｍｅｍｓセンサ
JP5799619B2 (ja) 2011-06-24 2015-10-28 船井電機株式会社 マイクロホンユニット
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (de) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
WO2014094831A1 (en) * 2012-12-18 2014-06-26 Epcos Ag Top-port mems microphone and method of manufacturing the same
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (it) * 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
US9264832B2 (en) 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2543443B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
CN106716636B (zh) * 2014-09-17 2021-05-28 英特尔公司 具有使用穿硅过孔(tsv)的集成麦克风器件的管芯
CN104780490A (zh) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 一种mems麦克风的封装结构及其制造方法
TWI660466B (zh) * 2017-04-26 2019-05-21 矽品精密工業股份有限公司 封裝結構及其製法
CN111711903B (zh) * 2020-06-24 2021-10-01 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

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US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone

Also Published As

Publication number Publication date
JP2007028671A (ja) 2007-02-01
CN1387741A (zh) 2002-12-25
WO2001019134A2 (en) 2001-03-15
CA2383740A1 (en) 2001-03-15
WO2001019134A3 (en) 2001-09-07
DE60003199D1 (de) 2003-07-10
DK1214864T3 (da) 2003-08-25
EP1214864A2 (en) 2002-06-19
AU6984100A (en) 2001-04-10
PL354095A1 (en) 2003-12-29
CN1203726C (zh) 2005-05-25
EP1214864B1 (en) 2003-06-04
DE60003199T2 (de) 2004-07-01
JP4303742B2 (ja) 2009-07-29
ATE242587T1 (de) 2003-06-15
CA2383740C (en) 2005-04-05
JP2003508998A (ja) 2003-03-04
PL209935B1 (pl) 2011-11-30

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