DE60003199T2 - Silikon basierte sensor-systeme - Google Patents
Silikon basierte sensor-systeme Download PDFInfo
- Publication number
- DE60003199T2 DE60003199T2 DE60003199T DE60003199T DE60003199T2 DE 60003199 T2 DE60003199 T2 DE 60003199T2 DE 60003199 T DE60003199 T DE 60003199T DE 60003199 T DE60003199 T DE 60003199T DE 60003199 T2 DE60003199 T2 DE 60003199T2
- Authority
- DE
- Germany
- Prior art keywords
- sensor system
- transducer element
- contact
- transducer
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DKPA199901254 | 1999-09-06 | ||
DK125499 | 1999-09-06 | ||
US39162899A | 1999-09-07 | 1999-09-07 | |
US391628 | 1999-09-07 | ||
US570434 | 2000-05-12 | ||
US09/570,434 US6522762B1 (en) | 1999-09-07 | 2000-05-12 | Silicon-based sensor system |
PCT/DK2000/000491 WO2001019134A2 (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60003199D1 DE60003199D1 (de) | 2003-07-10 |
DE60003199T2 true DE60003199T2 (de) | 2004-07-01 |
Family
ID=27221189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60003199T Expired - Lifetime DE60003199T2 (de) | 1999-09-06 | 2000-09-06 | Silikon basierte sensor-systeme |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1214864B1 (da) |
JP (2) | JP4459498B2 (da) |
CN (1) | CN1203726C (da) |
AT (1) | ATE242587T1 (da) |
AU (1) | AU6984100A (da) |
CA (1) | CA2383740C (da) |
DE (1) | DE60003199T2 (da) |
DK (1) | DK1214864T3 (da) |
PL (1) | PL209935B1 (da) |
WO (1) | WO2001019134A2 (da) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007008518A1 (de) * | 2007-02-21 | 2008-08-28 | Infineon Technologies Ag | Modul mit einem ein bewegliches Element umfassenden Halbleiterchip |
US7557417B2 (en) | 2007-02-21 | 2009-07-07 | Infineon Technologies Ag | Module comprising a semiconductor chip comprising a movable element |
DE102008007682B4 (de) * | 2007-06-01 | 2014-05-28 | Infineon Technologies Ag | Modul mit einem Mikro-Elektromechanischen Mikrofon |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US6696645B2 (en) * | 2002-05-08 | 2004-02-24 | The Regents Of The University Of Michigan | On-wafer packaging for RF-MEMS |
US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
US7466835B2 (en) | 2003-03-18 | 2008-12-16 | Sonion A/S | Miniature microphone with balanced termination |
JP2004356708A (ja) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | 音響検出機構及びその製造方法 |
CN100515119C (zh) * | 2003-08-12 | 2009-07-15 | 中国科学院声学研究所 | 一种用于硅微电容传声器中的芯片及其制备方法 |
CN100499877C (zh) * | 2003-12-17 | 2009-06-10 | 中国科学院声学研究所 | 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法 |
DE102004011203B4 (de) * | 2004-03-04 | 2010-09-16 | Robert Bosch Gmbh | Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung |
JP4553611B2 (ja) * | 2004-03-15 | 2010-09-29 | 三洋電機株式会社 | 回路装置 |
JP4539450B2 (ja) * | 2004-11-04 | 2010-09-08 | オムロン株式会社 | 容量型振動センサ及びその製造方法 |
DE102005008512B4 (de) | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
DE102005008511B4 (de) | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
DE102005053765B4 (de) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
DE102005053767B4 (de) | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
DE102005056759A1 (de) * | 2005-11-29 | 2007-05-31 | Robert Bosch Gmbh | Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur |
CN101005718B (zh) * | 2006-01-16 | 2011-04-20 | 财团法人工业技术研究院 | 微型声学传感器及其制造方法 |
JP4771290B2 (ja) * | 2006-07-19 | 2011-09-14 | ヤマハ株式会社 | 圧力センサの製造方法 |
DE112007003083B4 (de) * | 2006-12-22 | 2019-05-09 | Tdk Corp. | Mikrofonbaugruppe mit Unterfüllmittel mit niedrigem Wärmeausdehnungskoeffizienten |
JP4893380B2 (ja) * | 2007-03-09 | 2012-03-07 | ヤマハ株式会社 | コンデンサマイク装置 |
JP2009081624A (ja) * | 2007-09-26 | 2009-04-16 | Rohm Co Ltd | 半導体センサ装置 |
TWI336770B (en) * | 2007-11-05 | 2011-02-01 | Ind Tech Res Inst | Sensor |
TWI365525B (en) * | 2007-12-24 | 2012-06-01 | Ind Tech Res Inst | An ultra thin package for a sensor chip of a micro electro mechanical system |
EP2094028B8 (en) * | 2008-02-22 | 2017-03-29 | TDK Corporation | Miniature microphone assembly with solder sealing ring |
CN102187685B (zh) * | 2008-10-14 | 2015-03-11 | 美商楼氏电子有限公司 | 具有多个换能器元件的传声器 |
US20100303274A1 (en) * | 2009-05-18 | 2010-12-02 | William Ryan | Microphone Having Reduced Vibration Sensitivity |
KR101609270B1 (ko) | 2009-08-12 | 2016-04-06 | 삼성전자주식회사 | 압전형 마이크로 스피커 및 그 제조 방법 |
DE102009047592B4 (de) * | 2009-12-07 | 2019-06-19 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Siliziumzwischenträgers |
IT1397976B1 (it) * | 2009-12-23 | 2013-02-04 | St Microelectronics Rousset | Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio. |
JP2013093637A (ja) * | 2010-02-24 | 2013-05-16 | Panasonic Corp | 半導体装置及びその製造方法 |
TWI491009B (zh) | 2010-10-08 | 2015-07-01 | 晶片級電磁干擾屏蔽結構及製造方法 | |
CN102456669B (zh) * | 2010-10-25 | 2015-07-22 | 环旭电子股份有限公司 | 芯片级电磁干扰屏蔽结构及制造方法 |
WO2012088688A1 (en) * | 2010-12-30 | 2012-07-05 | Goertek Inc. | A mems microphone and method for packaging the same |
JP5721452B2 (ja) * | 2011-01-27 | 2015-05-20 | ローム株式会社 | 静電容量型memsセンサ |
JP5799619B2 (ja) | 2011-06-24 | 2015-10-28 | 船井電機株式会社 | マイクロホンユニット |
DE102011086722A1 (de) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren |
US20130147040A1 (en) * | 2011-12-09 | 2013-06-13 | Robert Bosch Gmbh | Mems chip scale package |
DE102012203373A1 (de) * | 2012-03-05 | 2013-09-05 | Robert Bosch Gmbh | Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren |
US20140090485A1 (en) * | 2012-10-02 | 2014-04-03 | Robert Bosch Gmbh | MEMS Pressure Sensor Assembly |
WO2014094831A1 (en) * | 2012-12-18 | 2014-06-26 | Epcos Ag | Top-port mems microphone and method of manufacturing the same |
US20140312439A1 (en) * | 2013-04-19 | 2014-10-23 | Infineon Technologies Ag | Microphone Module and Method of Manufacturing Thereof |
ITTO20130350A1 (it) * | 2013-04-30 | 2014-10-31 | St Microelectronics Srl | Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems |
US9264832B2 (en) | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
GB2543443B (en) * | 2014-06-10 | 2017-09-13 | Cirrus Logic Int Semiconductor Ltd | Packaging for MEMS transducers |
CN106716636B (zh) * | 2014-09-17 | 2021-05-28 | 英特尔公司 | 具有使用穿硅过孔(tsv)的集成麦克风器件的管芯 |
CN104780490A (zh) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | 一种mems麦克风的封装结构及其制造方法 |
TWI660466B (zh) * | 2017-04-26 | 2019-05-21 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
CN111711903B (zh) * | 2020-06-24 | 2021-10-01 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
US5856914A (en) * | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
-
2000
- 2000-09-06 CA CA002383740A patent/CA2383740C/en not_active Expired - Fee Related
- 2000-09-06 AU AU69841/00A patent/AU6984100A/en not_active Abandoned
- 2000-09-06 WO PCT/DK2000/000491 patent/WO2001019134A2/en active IP Right Grant
- 2000-09-06 AT AT00958265T patent/ATE242587T1/de active
- 2000-09-06 DK DK00958265T patent/DK1214864T3/da active
- 2000-09-06 EP EP00958265A patent/EP1214864B1/en not_active Expired - Lifetime
- 2000-09-06 CN CNB008153809A patent/CN1203726C/zh not_active Expired - Lifetime
- 2000-09-06 PL PL354095A patent/PL209935B1/pl unknown
- 2000-09-06 JP JP2001522196A patent/JP4459498B2/ja not_active Expired - Fee Related
- 2000-09-06 DE DE60003199T patent/DE60003199T2/de not_active Expired - Lifetime
-
2006
- 2006-10-04 JP JP2006273173A patent/JP4303742B2/ja not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007008518A1 (de) * | 2007-02-21 | 2008-08-28 | Infineon Technologies Ag | Modul mit einem ein bewegliches Element umfassenden Halbleiterchip |
US7557417B2 (en) | 2007-02-21 | 2009-07-07 | Infineon Technologies Ag | Module comprising a semiconductor chip comprising a movable element |
DE102008007682B4 (de) * | 2007-06-01 | 2014-05-28 | Infineon Technologies Ag | Modul mit einem Mikro-Elektromechanischen Mikrofon |
US8767983B2 (en) | 2007-06-01 | 2014-07-01 | Infineon Technologies Ag | Module including a micro-electro-mechanical microphone |
Also Published As
Publication number | Publication date |
---|---|
JP2007028671A (ja) | 2007-02-01 |
CN1387741A (zh) | 2002-12-25 |
WO2001019134A2 (en) | 2001-03-15 |
CA2383740A1 (en) | 2001-03-15 |
WO2001019134A3 (en) | 2001-09-07 |
DE60003199D1 (de) | 2003-07-10 |
DK1214864T3 (da) | 2003-08-25 |
EP1214864A2 (en) | 2002-06-19 |
AU6984100A (en) | 2001-04-10 |
PL354095A1 (en) | 2003-12-29 |
CN1203726C (zh) | 2005-05-25 |
EP1214864B1 (en) | 2003-06-04 |
JP4303742B2 (ja) | 2009-07-29 |
ATE242587T1 (de) | 2003-06-15 |
JP4459498B2 (ja) | 2010-04-28 |
CA2383740C (en) | 2005-04-05 |
JP2003508998A (ja) | 2003-03-04 |
PL209935B1 (pl) | 2011-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de | ||
8370 | Indication related to discontinuation of the patent is to be deleted | ||
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCHAFT |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: EPCOS PTE LTD, SINGAPORE, SG |