CN1387741A - 基于硅的传感器系统 - Google Patents
基于硅的传感器系统 Download PDFInfo
- Publication number
- CN1387741A CN1387741A CN00815380A CN00815380A CN1387741A CN 1387741 A CN1387741 A CN 1387741A CN 00815380 A CN00815380 A CN 00815380A CN 00815380 A CN00815380 A CN 00815380A CN 1387741 A CN1387741 A CN 1387741A
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- sensing system
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Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 241000500881 Lepisma Species 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 21
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 238000010923 batch production Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 10
- 230000035945 sensitivity Effects 0.000 description 5
- 230000004224 protection Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007600 charging Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Air Bags (AREA)
- Silicon Polymers (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DKPA199901254 | 1999-09-06 | ||
DKPA1999/01254 | 1999-09-06 | ||
US39162899A | 1999-09-07 | 1999-09-07 | |
US09/391,628 | 1999-09-07 | ||
US09/570,434 US6522762B1 (en) | 1999-09-07 | 2000-05-12 | Silicon-based sensor system |
US09/570,434 | 2000-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1387741A true CN1387741A (zh) | 2002-12-25 |
CN1203726C CN1203726C (zh) | 2005-05-25 |
Family
ID=27221189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008153809A Expired - Lifetime CN1203726C (zh) | 1999-09-06 | 2000-09-06 | 基于硅的传感器系统 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1214864B1 (zh) |
JP (2) | JP4459498B2 (zh) |
CN (1) | CN1203726C (zh) |
AT (1) | ATE242587T1 (zh) |
AU (1) | AU6984100A (zh) |
CA (1) | CA2383740C (zh) |
DE (1) | DE60003199T2 (zh) |
DK (1) | DK1214864T3 (zh) |
PL (1) | PL209935B1 (zh) |
WO (1) | WO2001019134A2 (zh) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100499877C (zh) * | 2003-12-17 | 2009-06-10 | 中国科学院声学研究所 | 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法 |
CN100515119C (zh) * | 2003-08-12 | 2009-07-15 | 中国科学院声学研究所 | 一种用于硅微电容传声器中的芯片及其制备方法 |
CN101552941A (zh) * | 2008-02-22 | 2009-10-07 | 帕尔斯微机电系统私人有限公司 | 具有焊料密封环的微型麦克风组件 |
CN101005718B (zh) * | 2006-01-16 | 2011-04-20 | 财团法人工业技术研究院 | 微型声学传感器及其制造方法 |
CN102428711A (zh) * | 2009-05-18 | 2012-04-25 | 美商楼氏电子有限公司 | 具有降低的振动灵敏度的麦克风 |
CN102456669A (zh) * | 2010-10-25 | 2012-05-16 | 环旭电子股份有限公司 | 芯片级电磁干扰屏蔽结构及制造方法 |
CN102742301A (zh) * | 2009-12-23 | 2012-10-17 | 意法半导体股份有限公司 | 微机电换能器及对应组装工艺 |
CN103130176A (zh) * | 2011-11-21 | 2013-06-05 | 罗伯特·博世有限公司 | 微机械功能装置、尤其扬声器装置、以及相应的制造方法 |
CN103313172A (zh) * | 2012-03-05 | 2013-09-18 | 罗伯特·博世有限公司 | 微机械声变换器装置和相应的制造方法 |
CN104113808A (zh) * | 2013-04-19 | 2014-10-22 | 英飞凌科技股份有限公司 | 麦克风模块及其制造方法 |
CN104136364A (zh) * | 2011-12-09 | 2014-11-05 | 罗伯特·博世有限公司 | 微机电系统芯片尺寸封装 |
CN104140071A (zh) * | 2013-04-30 | 2014-11-12 | 意法半导体股份有限公司 | Mems传感器器件和相关mems传感器器件的晶片级组件 |
CN102187685B (zh) * | 2008-10-14 | 2015-03-11 | 美商楼氏电子有限公司 | 具有多个换能器元件的传声器 |
CN104591075A (zh) * | 2013-10-30 | 2015-05-06 | 鑫创科技股份有限公司 | 保护微机电系统麦克风声音端口及其在晶片级形成的方法 |
CN104780490A (zh) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | 一种mems麦克风的封装结构及其制造方法 |
CN105102952A (zh) * | 2012-10-02 | 2015-11-25 | 罗伯特·博世有限公司 | Mems压力传感器组件 |
US9287218B2 (en) | 2010-10-08 | 2016-03-15 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Chip level EMI shielding structure and manufacture method thereof |
CN106794980A (zh) * | 2014-06-10 | 2017-05-31 | 思睿逻辑国际半导体有限公司 | 用于mems传感器的封装 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US6696645B2 (en) * | 2002-05-08 | 2004-02-24 | The Regents Of The University Of Michigan | On-wafer packaging for RF-MEMS |
US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
US7466835B2 (en) | 2003-03-18 | 2008-12-16 | Sonion A/S | Miniature microphone with balanced termination |
JP2004356708A (ja) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | 音響検出機構及びその製造方法 |
DE102004011203B4 (de) * | 2004-03-04 | 2010-09-16 | Robert Bosch Gmbh | Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung |
JP4553611B2 (ja) * | 2004-03-15 | 2010-09-29 | 三洋電機株式会社 | 回路装置 |
JP4539450B2 (ja) * | 2004-11-04 | 2010-09-08 | オムロン株式会社 | 容量型振動センサ及びその製造方法 |
DE102005008511B4 (de) | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
DE102005053767B4 (de) | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
DE102005053765B4 (de) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
DE102005056759A1 (de) * | 2005-11-29 | 2007-05-31 | Robert Bosch Gmbh | Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur |
JP4771290B2 (ja) * | 2006-07-19 | 2011-09-14 | ヤマハ株式会社 | 圧力センサの製造方法 |
WO2008077517A1 (en) * | 2006-12-22 | 2008-07-03 | Sonion Mems A/S | Microphone assembly with underfill agent having a low coefficient of thermal expansion |
JP4893380B2 (ja) * | 2007-03-09 | 2012-03-07 | ヤマハ株式会社 | コンデンサマイク装置 |
US7557417B2 (en) | 2007-02-21 | 2009-07-07 | Infineon Technologies Ag | Module comprising a semiconductor chip comprising a movable element |
DE102007008518A1 (de) * | 2007-02-21 | 2008-08-28 | Infineon Technologies Ag | Modul mit einem ein bewegliches Element umfassenden Halbleiterchip |
US8767983B2 (en) | 2007-06-01 | 2014-07-01 | Infineon Technologies Ag | Module including a micro-electro-mechanical microphone |
JP2009081624A (ja) * | 2007-09-26 | 2009-04-16 | Rohm Co Ltd | 半導体センサ装置 |
TWI336770B (en) * | 2007-11-05 | 2011-02-01 | Ind Tech Res Inst | Sensor |
TWI365525B (en) * | 2007-12-24 | 2012-06-01 | Ind Tech Res Inst | An ultra thin package for a sensor chip of a micro electro mechanical system |
KR101609270B1 (ko) | 2009-08-12 | 2016-04-06 | 삼성전자주식회사 | 압전형 마이크로 스피커 및 그 제조 방법 |
DE102009047592B4 (de) * | 2009-12-07 | 2019-06-19 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Siliziumzwischenträgers |
JP2013093637A (ja) * | 2010-02-24 | 2013-05-16 | Panasonic Corp | 半導体装置及びその製造方法 |
WO2012088688A1 (en) * | 2010-12-30 | 2012-07-05 | Goertek Inc. | A mems microphone and method for packaging the same |
JP5721452B2 (ja) * | 2011-01-27 | 2015-05-20 | ローム株式会社 | 静電容量型memsセンサ |
JP5799619B2 (ja) | 2011-06-24 | 2015-10-28 | 船井電機株式会社 | マイクロホンユニット |
DE112012007235T5 (de) * | 2012-12-18 | 2015-09-24 | Epcos Ag | Top-Port-Mems-Mikrofon und Verfahren zu dessen Herstellung |
EP3195358A4 (en) * | 2014-09-17 | 2018-04-25 | Intel Corporation | DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs) |
TWI660466B (zh) * | 2017-04-26 | 2019-05-21 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
CN111711903B (zh) * | 2020-06-24 | 2021-10-01 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
US5856914A (en) * | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
-
2000
- 2000-09-06 AU AU69841/00A patent/AU6984100A/en not_active Abandoned
- 2000-09-06 WO PCT/DK2000/000491 patent/WO2001019134A2/en active IP Right Grant
- 2000-09-06 PL PL354095A patent/PL209935B1/pl unknown
- 2000-09-06 AT AT00958265T patent/ATE242587T1/de active
- 2000-09-06 JP JP2001522196A patent/JP4459498B2/ja not_active Expired - Fee Related
- 2000-09-06 DK DK00958265T patent/DK1214864T3/da active
- 2000-09-06 CN CNB008153809A patent/CN1203726C/zh not_active Expired - Lifetime
- 2000-09-06 DE DE60003199T patent/DE60003199T2/de not_active Expired - Lifetime
- 2000-09-06 EP EP00958265A patent/EP1214864B1/en not_active Expired - Lifetime
- 2000-09-06 CA CA002383740A patent/CA2383740C/en not_active Expired - Fee Related
-
2006
- 2006-10-04 JP JP2006273173A patent/JP4303742B2/ja not_active Expired - Fee Related
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100515119C (zh) * | 2003-08-12 | 2009-07-15 | 中国科学院声学研究所 | 一种用于硅微电容传声器中的芯片及其制备方法 |
CN100499877C (zh) * | 2003-12-17 | 2009-06-10 | 中国科学院声学研究所 | 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法 |
CN101005718B (zh) * | 2006-01-16 | 2011-04-20 | 财团法人工业技术研究院 | 微型声学传感器及其制造方法 |
CN101552941A (zh) * | 2008-02-22 | 2009-10-07 | 帕尔斯微机电系统私人有限公司 | 具有焊料密封环的微型麦克风组件 |
CN101552941B (zh) * | 2008-02-22 | 2016-04-06 | 爱普科斯私人投资有限公司 | 具有焊料密封环的微型麦克风组件 |
CN102187685B (zh) * | 2008-10-14 | 2015-03-11 | 美商楼氏电子有限公司 | 具有多个换能器元件的传声器 |
CN102428711A (zh) * | 2009-05-18 | 2012-04-25 | 美商楼氏电子有限公司 | 具有降低的振动灵敏度的麦克风 |
CN102742301A (zh) * | 2009-12-23 | 2012-10-17 | 意法半导体股份有限公司 | 微机电换能器及对应组装工艺 |
CN102742301B (zh) * | 2009-12-23 | 2015-09-02 | 意法半导体股份有限公司 | 微机电换能器及对应组装工艺 |
US9287218B2 (en) | 2010-10-08 | 2016-03-15 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Chip level EMI shielding structure and manufacture method thereof |
CN102456669A (zh) * | 2010-10-25 | 2012-05-16 | 环旭电子股份有限公司 | 芯片级电磁干扰屏蔽结构及制造方法 |
CN103130176A (zh) * | 2011-11-21 | 2013-06-05 | 罗伯特·博世有限公司 | 微机械功能装置、尤其扬声器装置、以及相应的制造方法 |
CN104136364A (zh) * | 2011-12-09 | 2014-11-05 | 罗伯特·博世有限公司 | 微机电系统芯片尺寸封装 |
CN103313172A (zh) * | 2012-03-05 | 2013-09-18 | 罗伯特·博世有限公司 | 微机械声变换器装置和相应的制造方法 |
CN105102952A (zh) * | 2012-10-02 | 2015-11-25 | 罗伯特·博世有限公司 | Mems压力传感器组件 |
CN104113808A (zh) * | 2013-04-19 | 2014-10-22 | 英飞凌科技股份有限公司 | 麦克风模块及其制造方法 |
CN104140071A (zh) * | 2013-04-30 | 2014-11-12 | 意法半导体股份有限公司 | Mems传感器器件和相关mems传感器器件的晶片级组件 |
US9628919B2 (en) | 2013-04-30 | 2017-04-18 | Stmicroelectronics S.R.L. | Wafer level assembly of a MEMS sensor device and related MEMS sensor device |
CN104140071B (zh) * | 2013-04-30 | 2017-06-30 | 意法半导体股份有限公司 | Mems传感器器件和相关mems传感器器件的晶片级组件 |
CN104591075A (zh) * | 2013-10-30 | 2015-05-06 | 鑫创科技股份有限公司 | 保护微机电系统麦克风声音端口及其在晶片级形成的方法 |
US9264832B2 (en) | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
CN104591075B (zh) * | 2013-10-30 | 2017-07-21 | 鑫创科技股份有限公司 | 保护微机电系统麦克风声音端口及其在晶片级形成的方法 |
CN106794980A (zh) * | 2014-06-10 | 2017-05-31 | 思睿逻辑国际半导体有限公司 | 用于mems传感器的封装 |
CN104780490A (zh) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | 一种mems麦克风的封装结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE60003199T2 (de) | 2004-07-01 |
DE60003199D1 (de) | 2003-07-10 |
EP1214864B1 (en) | 2003-06-04 |
JP4303742B2 (ja) | 2009-07-29 |
JP2003508998A (ja) | 2003-03-04 |
WO2001019134A3 (en) | 2001-09-07 |
CN1203726C (zh) | 2005-05-25 |
WO2001019134A2 (en) | 2001-03-15 |
JP4459498B2 (ja) | 2010-04-28 |
DK1214864T3 (da) | 2003-08-25 |
ATE242587T1 (de) | 2003-06-15 |
EP1214864A2 (en) | 2002-06-19 |
JP2007028671A (ja) | 2007-02-01 |
AU6984100A (en) | 2001-04-10 |
PL354095A1 (en) | 2003-12-29 |
PL209935B1 (pl) | 2011-11-30 |
CA2383740C (en) | 2005-04-05 |
CA2383740A1 (en) | 2001-03-15 |
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