JP4433564B2 - 回路接続用接着剤 - Google Patents

回路接続用接着剤 Download PDF

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Publication number
JP4433564B2
JP4433564B2 JP2000144270A JP2000144270A JP4433564B2 JP 4433564 B2 JP4433564 B2 JP 4433564B2 JP 2000144270 A JP2000144270 A JP 2000144270A JP 2000144270 A JP2000144270 A JP 2000144270A JP 4433564 B2 JP4433564 B2 JP 4433564B2
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JP
Japan
Prior art keywords
adhesive
connection
circuit connection
film
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000144270A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001323249A5 (enExample
JP2001323249A (ja
Inventor
幸寿 廣澤
伊津夫 渡辺
泰史 後藤
潤 竹田津
正規 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2000144270A priority Critical patent/JP4433564B2/ja
Publication of JP2001323249A publication Critical patent/JP2001323249A/ja
Publication of JP2001323249A5 publication Critical patent/JP2001323249A5/ja
Application granted granted Critical
Publication of JP4433564B2 publication Critical patent/JP4433564B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP2000144270A 2000-05-17 2000-05-17 回路接続用接着剤 Expired - Fee Related JP4433564B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000144270A JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000144270A JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2005238698A Division JP2006028521A (ja) 2005-08-19 2005-08-19 回路接続用接着剤
JP2005331857A Division JP4626495B2 (ja) 2005-11-16 2005-11-16 回路接続用接着剤

Publications (3)

Publication Number Publication Date
JP2001323249A JP2001323249A (ja) 2001-11-22
JP2001323249A5 JP2001323249A5 (enExample) 2005-11-04
JP4433564B2 true JP4433564B2 (ja) 2010-03-17

Family

ID=18650948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000144270A Expired - Fee Related JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Country Status (1)

Country Link
JP (1) JP4433564B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7618713B2 (en) 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
JP4970767B2 (ja) * 2005-10-26 2012-07-11 リンテック株式会社 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法
JP4626495B2 (ja) * 2005-11-16 2011-02-09 日立化成工業株式会社 回路接続用接着剤
JP4650456B2 (ja) 2006-08-25 2011-03-16 日立化成工業株式会社 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
JP5115553B2 (ja) 2007-05-09 2013-01-09 日立化成工業株式会社 導電体接続用部材、接続構造及び太陽電池モジュール
KR101081706B1 (ko) 2007-05-09 2011-11-09 히다치 가세고교 가부시끼가이샤 도전체의 접속 방법, 도전체 접속용 부재, 접속 구조 및 태양 전지 모듈
KR101139749B1 (ko) * 2007-08-10 2012-04-26 아사히 가세이 이-매터리얼즈 가부시키가이샤 접착제 및 접합체
WO2009051043A1 (ja) 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. 回路接続用接着フィルム及び回路接続構造体
JP5779895B2 (ja) * 2011-02-08 2015-09-16 東レ株式会社 半導体用絶縁性接着剤
JP5868823B2 (ja) * 2012-10-01 2016-02-24 日立化成株式会社 異方導電フィルム
CN110461984A (zh) * 2017-03-29 2019-11-15 日立化成株式会社 粘接剂组合物及结构体
JP7234032B2 (ja) * 2019-05-15 2023-03-07 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法

Also Published As

Publication number Publication date
JP2001323249A (ja) 2001-11-22

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