JP2006137954A5 - - Google Patents
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- Publication number
- JP2006137954A5 JP2006137954A5 JP2005331857A JP2005331857A JP2006137954A5 JP 2006137954 A5 JP2006137954 A5 JP 2006137954A5 JP 2005331857 A JP2005331857 A JP 2005331857A JP 2005331857 A JP2005331857 A JP 2005331857A JP 2006137954 A5 JP2006137954 A5 JP 2006137954A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit connection
- particle size
- particles
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 15
- 230000001070 adhesive effect Effects 0.000 claims 13
- 239000002245 particle Substances 0.000 claims 13
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000000113 differential scanning calorimetry Methods 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 230000020169 heat generation Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005331857A JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005331857A JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000144270A Division JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006137954A JP2006137954A (ja) | 2006-06-01 |
| JP2006137954A5 true JP2006137954A5 (enExample) | 2009-06-25 |
| JP4626495B2 JP4626495B2 (ja) | 2011-02-09 |
Family
ID=36618960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005331857A Expired - Fee Related JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4626495B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI476266B (zh) * | 2007-03-19 | 2015-03-11 | 納美仕有限公司 | 異方性導電膏 |
| JP5337034B2 (ja) * | 2007-08-10 | 2013-11-06 | 旭化成イーマテリアルズ株式会社 | 接着剤及び接合体 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1150032A (ja) * | 1997-08-04 | 1999-02-23 | Hitachi Chem Co Ltd | 回路用接続部材及び回路板 |
| JP3508558B2 (ja) * | 1998-07-22 | 2004-03-22 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
| JP4433564B2 (ja) * | 2000-05-17 | 2010-03-17 | 日立化成工業株式会社 | 回路接続用接着剤 |
-
2005
- 2005-11-16 JP JP2005331857A patent/JP4626495B2/ja not_active Expired - Fee Related