JP2009096851A5 - - Google Patents

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Publication number
JP2009096851A5
JP2009096851A5 JP2007268149A JP2007268149A JP2009096851A5 JP 2009096851 A5 JP2009096851 A5 JP 2009096851A5 JP 2007268149 A JP2007268149 A JP 2007268149A JP 2007268149 A JP2007268149 A JP 2007268149A JP 2009096851 A5 JP2009096851 A5 JP 2009096851A5
Authority
JP
Japan
Prior art keywords
conductive adhesive
wiring board
fine particles
adhesive film
organic elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007268149A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009096851A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007268149A priority Critical patent/JP2009096851A/ja
Priority claimed from JP2007268149A external-priority patent/JP2009096851A/ja
Priority to KR1020107010589A priority patent/KR20100100792A/ko
Priority to PCT/US2008/078936 priority patent/WO2009051980A1/en
Priority to CN200880111727A priority patent/CN101827908A/zh
Priority to US12/682,333 priority patent/US20100206623A1/en
Priority to EP08839823A priority patent/EP2203536A4/en
Priority to TW097139403A priority patent/TW200925233A/zh
Publication of JP2009096851A publication Critical patent/JP2009096851A/ja
Publication of JP2009096851A5 publication Critical patent/JP2009096851A5/ja
Pending legal-status Critical Current

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JP2007268149A 2007-10-15 2007-10-15 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法 Pending JP2009096851A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007268149A JP2009096851A (ja) 2007-10-15 2007-10-15 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
KR1020107010589A KR20100100792A (ko) 2007-10-15 2008-10-06 비전도성 접착제 조성물 및 필름 및 제조 방법
PCT/US2008/078936 WO2009051980A1 (en) 2007-10-15 2008-10-06 Nonconductive adhesive composition and film and methods of making
CN200880111727A CN101827908A (zh) 2007-10-15 2008-10-06 非导电粘合剂组合物和非导电粘合剂膜以及制备方法
US12/682,333 US20100206623A1 (en) 2007-10-15 2008-10-06 Nonconductive adhesive composition and film and methods of making
EP08839823A EP2203536A4 (en) 2007-10-15 2008-10-06 NON-APPLICABLE ADHESIVE MATERIAL AND FOIL AND MANUFACTURING METHOD
TW097139403A TW200925233A (en) 2007-10-15 2008-10-14 Nonconductive adhesive composition and film and methods of making

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007268149A JP2009096851A (ja) 2007-10-15 2007-10-15 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法

Publications (2)

Publication Number Publication Date
JP2009096851A JP2009096851A (ja) 2009-05-07
JP2009096851A5 true JP2009096851A5 (enExample) 2010-12-02

Family

ID=40567737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007268149A Pending JP2009096851A (ja) 2007-10-15 2007-10-15 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法

Country Status (7)

Country Link
US (1) US20100206623A1 (enExample)
EP (1) EP2203536A4 (enExample)
JP (1) JP2009096851A (enExample)
KR (1) KR20100100792A (enExample)
CN (1) CN101827908A (enExample)
TW (1) TW200925233A (enExample)
WO (1) WO2009051980A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105169A1 (ja) * 2007-02-28 2008-09-04 Sumitomo Bakelite Co., Ltd. 半導体用接着フィルムおよびそれを用いた半導体装置
JP4816750B2 (ja) * 2009-03-13 2011-11-16 住友電気工業株式会社 プリント配線基板の接続方法
KR101178712B1 (ko) * 2010-09-28 2012-08-30 주식회사 케이씨씨 반도체 제조용 접착제 조성물 및 필름
KR101176957B1 (ko) * 2010-09-30 2012-09-07 주식회사 케이씨씨 반도체 패키지 제작용 접착제 조성물 및 접착시트
US20130026660A1 (en) * 2011-07-29 2013-01-31 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
US8584331B2 (en) * 2011-09-14 2013-11-19 Xerox Corporation In situ flexible circuit embossing to form an electrical interconnect
KR101403865B1 (ko) 2011-12-16 2014-06-10 제일모직주식회사 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치
US9303192B2 (en) 2012-07-05 2016-04-05 Three Bond Fine Chemical Co., Ltd. Sheet-like adhesive and organic EL panel using the same
CN104231956B (zh) * 2013-06-20 2018-09-28 中山市云创知识产权服务有限公司 胶带
US11224131B2 (en) * 2018-04-04 2022-01-11 Lenovo (Singapore) Pte. Ltd. Systems and methods for surface mounting cable connections
CN109830485B (zh) * 2019-02-27 2020-10-30 武汉天马微电子有限公司 一种显示面板、其制备方法及显示装置
TW202317705A (zh) * 2021-07-21 2023-05-01 德商漢高智慧財產控股公司 用於具有優異高溫性質之供3d矽穿孔(tsv)封裝用之非傳導性薄膜的樹脂組合物
US20240322194A1 (en) * 2021-08-03 2024-09-26 Schunk Kohlenstofftechnik Gmbh Process for manufacturing a graphite bipolar plate by adhesively bonding monopolar plates, and bipolar plate and fuel cell or redox flow battery comprising same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3035021B2 (ja) * 1991-08-29 2000-04-17 株式会社リコー 液晶表示素子およびその製造方法
JP3777734B2 (ja) * 1996-10-15 2006-05-24 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JPH10178251A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
JP2001031943A (ja) * 1999-07-26 2001-02-06 Tomoegawa Paper Co Ltd 半導体用接着剤及び半導体用接着テープ
JP4556260B2 (ja) * 1999-10-27 2010-10-06 日立化成工業株式会社 アディティブ法プリント配線板用絶縁フィルム
KR100889101B1 (ko) * 2000-02-15 2009-03-17 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름,반도체 탑재용 기판 및 반도체 장치
KR100315158B1 (ko) * 2000-08-02 2001-11-26 윤덕용 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법
US6624213B2 (en) * 2001-11-08 2003-09-23 3M Innovative Properties Company High temperature epoxy adhesive films
US20050224978A1 (en) * 2002-06-24 2005-10-13 Kohichiro Kawate Heat curable adhesive composition, article, semiconductor apparatus and method
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
JP2006061802A (ja) * 2004-08-26 2006-03-09 Chukyo Yushi Kk イソシアネート含有マイクロカプセル及びその製造方法、並びに、イソシアネート含有マイクロカプセルを含有する塗料組成物、接着剤組成物及びプラスチック改質剤
KR100601762B1 (ko) * 2004-11-09 2006-07-19 삼성전자주식회사 비전도성 접착제를 사용하는 플립 칩 본딩 제조 방법
JP2006216758A (ja) * 2005-02-03 2006-08-17 Three M Innovative Properties Co プリント回路基板の接続方法
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
US20070212551A1 (en) * 2006-03-10 2007-09-13 Andrew Collins Adhesive composition

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