JP2010530017A - 難燃剤組成物 - Google Patents

難燃剤組成物 Download PDF

Info

Publication number
JP2010530017A
JP2010530017A JP2010511590A JP2010511590A JP2010530017A JP 2010530017 A JP2010530017 A JP 2010530017A JP 2010511590 A JP2010511590 A JP 2010511590A JP 2010511590 A JP2010511590 A JP 2010511590A JP 2010530017 A JP2010530017 A JP 2010530017A
Authority
JP
Japan
Prior art keywords
composition
epoxy resin
flame retardant
poly
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010511590A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010530017A5 (https=
Inventor
カプリニディス ニコラス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of JP2010530017A publication Critical patent/JP2010530017A/ja
Publication of JP2010530017A5 publication Critical patent/JP2010530017A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fireproofing Substances (AREA)
JP2010511590A 2007-06-14 2008-06-06 難燃剤組成物 Pending JP2010530017A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93459807P 2007-06-14 2007-06-14
PCT/EP2008/057053 WO2008151986A1 (en) 2007-06-14 2008-06-06 Flame retardant compositions

Publications (2)

Publication Number Publication Date
JP2010530017A true JP2010530017A (ja) 2010-09-02
JP2010530017A5 JP2010530017A5 (https=) 2011-12-15

Family

ID=39705019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010511590A Pending JP2010530017A (ja) 2007-06-14 2008-06-06 難燃剤組成物

Country Status (7)

Country Link
US (1) US7678852B2 (https=)
EP (1) EP2152793A1 (https=)
JP (1) JP2010530017A (https=)
KR (1) KR20100019570A (https=)
CN (2) CN103254465A (https=)
TW (1) TWI450921B (https=)
WO (1) WO2008151986A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009108301A (ja) * 2007-10-09 2009-05-21 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2012507599A (ja) * 2008-10-29 2012-03-29 アイシーエル−アイピー アメリカ インコーポレイテッド リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板
JP2015529714A (ja) * 2012-07-30 2015-10-08 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 高熱耐性組成物
JP2021502459A (ja) * 2017-11-13 2021-01-28 クラリアント・プラスティクス・アンド・コーティングス・リミテッド ポリオレフィンのための新規な難燃剤組成物

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110269880A1 (en) * 2008-12-17 2011-11-03 Basf Se Layered silicate flame retardant compositions
EP2385967A4 (en) * 2009-01-08 2012-06-13 Clariant Int Ltd FLAME RETARDANT COMBINATIONS FOR POLYESTERS AND FLAME RETARDANT POLYESTER MOLDING COMPOSITIONS DERIVED THEREFROM
US8058363B2 (en) * 2009-04-09 2011-11-15 Iteq Corporation Varnish and prepreg, and substrates thereof
JP2012525477A (ja) * 2009-04-29 2012-10-22 ポリワン コーポレイション 難燃性熱可塑性エラストマー
US8658719B2 (en) 2009-06-11 2014-02-25 Arlon Low loss pre-pregs and laminates and compositions useful for the preparation thereof
KR101346970B1 (ko) * 2009-07-24 2014-01-02 바스프 에스이 방향족 및/또는 헤테로방향족 에폭시 수지에서 난연제로서 디포스핀 유도체
TWI471350B (zh) * 2010-05-12 2015-02-01 Taiwan Union Technology Corp 無鹵素的阻燃性環氧樹脂組成物及由其製成的預浸材和印刷電路板
CN102250447B (zh) * 2010-05-21 2014-10-22 台燿科技股份有限公司 无卤素的阻燃性环氧树脂组合物及由其制成的预浸材和印刷电路板
US8604105B2 (en) 2010-09-03 2013-12-10 Eastman Chemical Company Flame retardant copolyester compositions
KR101215315B1 (ko) * 2011-01-07 2013-01-04 (주)시너지매트리얼 할로겐 비함유 난연성 수지 조성물
US20130081850A1 (en) 2011-09-30 2013-04-04 Ticona Llc Fire-Resisting Thermoplastic Composition for Plenum Raceways and Other Conduits
CN102863746A (zh) * 2012-09-20 2013-01-09 常熟市永祥机电有限公司 阻燃的酚醛环氧复合材料
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
WO2014176119A1 (en) 2013-04-25 2014-10-30 Polyone Corporation Flame retardant thermoplastic elastomers
US20160145447A1 (en) * 2013-07-09 2016-05-26 United Technologies Corporation Plated polymers with intumescent compositions and temperature indicators
CA2917916A1 (en) 2013-07-09 2015-02-05 United Technologies Corporation Plated polymer nosecone
EP3019705B1 (en) 2013-07-09 2019-01-30 United Technologies Corporation High-modulus coating for local stiffening of airfoil trailing edges
WO2015006421A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Metal-encapsulated polymeric article
US11268526B2 (en) 2013-07-09 2022-03-08 Raytheon Technologies Corporation Plated polymer fan
EP3019723A4 (en) 2013-07-09 2017-05-10 United Technologies Corporation Plated polymer compressor
WO2015006487A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Erosion and wear protection for composites and plated polymers
US10190051B2 (en) * 2014-06-10 2019-01-29 Alexium, Inc. Emulsification of hydrophobic organophosphorous compounds
CN105801814B (zh) 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
US20190010308A1 (en) * 2015-07-20 2019-01-10 Basf Se Flame Retardant Polyolefin Articles
TWI614325B (zh) * 2015-12-07 2018-02-11 臻鼎科技股份有限公司 樹脂組合物及應用該樹脂組合物的膠片及電路板
CN105585537B (zh) * 2015-12-24 2018-06-29 上海微谱化工技术服务有限公司 Sebs中三嗪类紫外吸收剂的分离及检测方法
CN111572129B (zh) * 2020-05-26 2021-01-08 北京福润达化工有限责任公司 三聚氰胺改性环氧树脂玻璃布层压板的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006504831A (ja) * 2002-11-04 2006-02-09 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド 難燃性組成物
JP2007502904A (ja) * 2003-05-22 2007-02-15 スプレスタ エルエルシー ポリエキシ樹脂用ポリホスホネート難燃硬化剤
JP2007530769A (ja) * 2004-04-01 2007-11-01 スプレスタ エルエルシー 低熱放出性低煙性強化繊維／エポキシ組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166283A (en) * 1987-04-15 1992-11-24 Hitachi Ltd. Polymer having dihydropyridine rings or dihydrotriazine rings, process for producing the same, and applications thereof
JP3288185B2 (ja) * 1994-10-07 2002-06-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置
TW521548B (en) * 2000-10-13 2003-02-21 Zeon Corp Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry
US7094819B2 (en) * 2001-08-09 2006-08-22 Asahi Kasei Chemicals Corporation Flame-retardant polytrimethylene terephthalate resin composition
EP1432719A1 (en) * 2001-10-04 2004-06-30 Akzo Nobel N.V. Oligomeric, hydroxy-terminated phosphonates
DE60230922D1 (de) * 2001-12-10 2009-03-05 Ciba Holding Inc Flammhemmende zusammensetzungen
DE10244579A1 (de) * 2002-09-25 2004-04-08 Clariant Gmbh Flammwidrige duroplastische Massen
DE10300462A1 (de) * 2003-01-07 2004-07-15 Bakelite Ag Phosphormodifiziertes Epoxidharz
DE10331887A1 (de) * 2003-07-14 2005-02-17 Clariant Gmbh Flammschutzmittel-Zubereitung
US8268916B2 (en) * 2006-09-25 2012-09-18 Federal-Mogul World Wide, Inc. Flame-retardant compound and method of forming a continuous material therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006504831A (ja) * 2002-11-04 2006-02-09 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド 難燃性組成物
JP2007502904A (ja) * 2003-05-22 2007-02-15 スプレスタ エルエルシー ポリエキシ樹脂用ポリホスホネート難燃硬化剤
JP2007530769A (ja) * 2004-04-01 2007-11-01 スプレスタ エルエルシー 低熱放出性低煙性強化繊維／エポキシ組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009108301A (ja) * 2007-10-09 2009-05-21 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2012507599A (ja) * 2008-10-29 2012-03-29 アイシーエル−アイピー アメリカ インコーポレイテッド リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板
JP2015529714A (ja) * 2012-07-30 2015-10-08 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 高熱耐性組成物
JP2021502459A (ja) * 2017-11-13 2021-01-28 クラリアント・プラスティクス・アンド・コーティングス・リミテッド ポリオレフィンのための新規な難燃剤組成物

Also Published As

Publication number Publication date
CN103254465A (zh) 2013-08-21
WO2008151986A1 (en) 2008-12-18
EP2152793A1 (en) 2010-02-17
TW200914516A (en) 2009-04-01
US20090082494A1 (en) 2009-03-26
KR20100019570A (ko) 2010-02-18
TWI450921B (zh) 2014-09-01
CN101679675A (zh) 2010-03-24
US7678852B2 (en) 2010-03-16
CN101679675B (zh) 2013-06-05

Similar Documents

Publication Publication Date Title
US7678852B2 (en) Flame retardant compositions
CN100387645C (zh) 阻燃剂组合物
JP6914140B2 (ja) 難燃剤としてのｎｏｒ−ｈａｌｓ化合物
JP4490276B2 (ja) 難燃性組成物
JP5651169B2 (ja) エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
WO2014179688A1 (en) Butadien2,3-diyl linked di-dopo derivatives as flame retardants
JP2014533323A (ja) 難燃剤としてのｐ−ピペラジン化合物
JP2015502421A (ja) 難燃剤としてのｐ−ｎ化合物
TW201335171A (zh) 至少一種二烷膦酸與至少一種其他不同的二烷膦酸之混合物、彼之製法及彼之用途
JP2012511069A (ja) フェニルホスホン酸メラミン難燃剤組成物
EP1948735B1 (en) Flame retardant prepregs and laminates for printed circuit boards
WO2013174791A1 (en) Phosphinyliminophosphoranes as flame retardants
TW201609900A (zh) 作為阻燃劑之七磷衍生化合物
JP5909693B2 (ja) 高耐熱性エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
JP2015086328A (ja) 熱硬化性組成物、プリプレグ、金属張積層板、及びプリント配線板
JP2006182991A (ja) プリント配線板用樹脂組成物、それを用いた樹脂ワニス、プリプレグおよび積層板
JP2013087253A (ja) エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
TW201336858A (zh) 作為阻燃劑之磷－氮－化合物
WO2025225599A1 (ja) 樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ
CN119998407A (zh) 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
TW201333026A (zh) 作為阻燃劑之磷－哌□化合物

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110603

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110603

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111028

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120802

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120808

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121022

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130319

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130613

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130620

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130711

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130723

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140414

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140805

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20140812

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20140905