KR20100019570A - 난연 조성물 - Google Patents

난연 조성물 Download PDF

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Publication number
KR20100019570A
KR20100019570A KR1020107000609A KR20107000609A KR20100019570A KR 20100019570 A KR20100019570 A KR 20100019570A KR 1020107000609 A KR1020107000609 A KR 1020107000609A KR 20107000609 A KR20107000609 A KR 20107000609A KR 20100019570 A KR20100019570 A KR 20100019570A
Authority
KR
South Korea
Prior art keywords
epoxy resin
flame retardant
composition
copolymers
melamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107000609A
Other languages
English (en)
Korean (ko)
Inventor
니콜라스 카프리니디스
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20100019570A publication Critical patent/KR20100019570A/ko
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • C08K5/3492Triazines
    • C08K5/34928Salts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317Phosphonic compounds, e.g. R—P(:O)(OR')2
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/012Flame-retardant; Preventing of inflammation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fireproofing Substances (AREA)
KR1020107000609A 2007-06-14 2008-06-06 난연 조성물 Ceased KR20100019570A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93459807P 2007-06-14 2007-06-14
US60/934,598 2007-06-14

Publications (1)

Publication Number Publication Date
KR20100019570A true KR20100019570A (ko) 2010-02-18

Family

ID=39705019

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107000609A Ceased KR20100019570A (ko) 2007-06-14 2008-06-06 난연 조성물

Country Status (7)

Country Link
US (1) US7678852B2 (https=)
EP (1) EP2152793A1 (https=)
JP (1) JP2010530017A (https=)
KR (1) KR20100019570A (https=)
CN (2) CN103254465A (https=)
TW (1) TWI450921B (https=)
WO (1) WO2008151986A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101215315B1 (ko) * 2011-01-07 2013-01-04 (주)시너지매트리얼 할로겐 비함유 난연성 수지 조성물

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540485B2 (ja) * 2007-10-09 2014-07-02 日立化成株式会社 封止用エポキシ樹脂組成物及び電子部品装置
WO2010051182A1 (en) * 2008-10-29 2010-05-06 Icl-Ip America Inc. Phosphorus-containing flame retardant epoxy resin composition, prepeg and laminate thereof
US20110269880A1 (en) * 2008-12-17 2011-11-03 Basf Se Layered silicate flame retardant compositions
EP2385967A4 (en) * 2009-01-08 2012-06-13 Clariant Int Ltd FLAME RETARDANT COMBINATIONS FOR POLYESTERS AND FLAME RETARDANT POLYESTER MOLDING COMPOSITIONS DERIVED THEREFROM
US8058363B2 (en) * 2009-04-09 2011-11-15 Iteq Corporation Varnish and prepreg, and substrates thereof
JP2012525477A (ja) * 2009-04-29 2012-10-22 ポリワン コーポレイション 難燃性熱可塑性エラストマー
US8658719B2 (en) 2009-06-11 2014-02-25 Arlon Low loss pre-pregs and laminates and compositions useful for the preparation thereof
KR101346970B1 (ko) * 2009-07-24 2014-01-02 바스프 에스이 방향족 및/또는 헤테로방향족 에폭시 수지에서 난연제로서 디포스핀 유도체
TWI471350B (zh) * 2010-05-12 2015-02-01 Taiwan Union Technology Corp 無鹵素的阻燃性環氧樹脂組成物及由其製成的預浸材和印刷電路板
CN102250447B (zh) * 2010-05-21 2014-10-22 台燿科技股份有限公司 无卤素的阻燃性环氧树脂组合物及由其制成的预浸材和印刷电路板
US8604105B2 (en) 2010-09-03 2013-12-10 Eastman Chemical Company Flame retardant copolyester compositions
US20130081850A1 (en) 2011-09-30 2013-04-04 Ticona Llc Fire-Resisting Thermoplastic Composition for Plenum Raceways and Other Conduits
AU2013298680C1 (en) * 2012-07-30 2016-11-10 Akzo Nobel Coatings International B.V. High heat resistant composition
CN102863746A (zh) * 2012-09-20 2013-01-09 常熟市永祥机电有限公司 阻燃的酚醛环氧复合材料
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
WO2014176119A1 (en) 2013-04-25 2014-10-30 Polyone Corporation Flame retardant thermoplastic elastomers
US20160145447A1 (en) * 2013-07-09 2016-05-26 United Technologies Corporation Plated polymers with intumescent compositions and temperature indicators
CA2917916A1 (en) 2013-07-09 2015-02-05 United Technologies Corporation Plated polymer nosecone
EP3019705B1 (en) 2013-07-09 2019-01-30 United Technologies Corporation High-modulus coating for local stiffening of airfoil trailing edges
WO2015006421A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Metal-encapsulated polymeric article
US11268526B2 (en) 2013-07-09 2022-03-08 Raytheon Technologies Corporation Plated polymer fan
EP3019723A4 (en) 2013-07-09 2017-05-10 United Technologies Corporation Plated polymer compressor
WO2015006487A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Erosion and wear protection for composites and plated polymers
US10190051B2 (en) * 2014-06-10 2019-01-29 Alexium, Inc. Emulsification of hydrophobic organophosphorous compounds
CN105801814B (zh) 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
US20190010308A1 (en) * 2015-07-20 2019-01-10 Basf Se Flame Retardant Polyolefin Articles
TWI614325B (zh) * 2015-12-07 2018-02-11 臻鼎科技股份有限公司 樹脂組合物及應用該樹脂組合物的膠片及電路板
CN105585537B (zh) * 2015-12-24 2018-06-29 上海微谱化工技术服务有限公司 Sebs中三嗪类紫外吸收剂的分离及检测方法
TW201930570A (zh) * 2017-11-13 2019-08-01 瑞士商科萊恩塑料和塗料公司 用於聚烯烴之新穎阻燃劑組成物
CN111572129B (zh) * 2020-05-26 2021-01-08 北京福润达化工有限责任公司 三聚氰胺改性环氧树脂玻璃布层压板的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166283A (en) * 1987-04-15 1992-11-24 Hitachi Ltd. Polymer having dihydropyridine rings or dihydrotriazine rings, process for producing the same, and applications thereof
JP3288185B2 (ja) * 1994-10-07 2002-06-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置
TW521548B (en) * 2000-10-13 2003-02-21 Zeon Corp Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry
US7094819B2 (en) * 2001-08-09 2006-08-22 Asahi Kasei Chemicals Corporation Flame-retardant polytrimethylene terephthalate resin composition
EP1432719A1 (en) * 2001-10-04 2004-06-30 Akzo Nobel N.V. Oligomeric, hydroxy-terminated phosphonates
DE60230922D1 (de) * 2001-12-10 2009-03-05 Ciba Holding Inc Flammhemmende zusammensetzungen
DE10244579A1 (de) * 2002-09-25 2004-04-08 Clariant Gmbh Flammwidrige duroplastische Massen
US7138448B2 (en) * 2002-11-04 2006-11-21 Ciba Specialty Chemicals Corporation Flame retardant compositions
DE10300462A1 (de) * 2003-01-07 2004-07-15 Bakelite Ag Phosphormodifiziertes Epoxidharz
CN1795223A (zh) * 2003-05-22 2006-06-28 苏普雷斯塔有限责任公司 用于环氧树脂的聚膦酸酯阻燃固化剂
DE10331887A1 (de) * 2003-07-14 2005-02-17 Clariant Gmbh Flammschutzmittel-Zubereitung
US20080057314A1 (en) * 2004-04-01 2008-03-06 Supresta U.S. Llc. Low Heat Release and Low Smoke Reinforcing Fiber/Epoxy Composites
US8268916B2 (en) * 2006-09-25 2012-09-18 Federal-Mogul World Wide, Inc. Flame-retardant compound and method of forming a continuous material therefrom

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101215315B1 (ko) * 2011-01-07 2013-01-04 (주)시너지매트리얼 할로겐 비함유 난연성 수지 조성물

Also Published As

Publication number Publication date
CN103254465A (zh) 2013-08-21
WO2008151986A1 (en) 2008-12-18
EP2152793A1 (en) 2010-02-17
TW200914516A (en) 2009-04-01
US20090082494A1 (en) 2009-03-26
JP2010530017A (ja) 2010-09-02
TWI450921B (zh) 2014-09-01
CN101679675A (zh) 2010-03-24
US7678852B2 (en) 2010-03-16
CN101679675B (zh) 2013-06-05

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