JP2010524208A5 - - Google Patents
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- JP2010524208A5 JP2010524208A5 JP2010501279A JP2010501279A JP2010524208A5 JP 2010524208 A5 JP2010524208 A5 JP 2010524208A5 JP 2010501279 A JP2010501279 A JP 2010501279A JP 2010501279 A JP2010501279 A JP 2010501279A JP 2010524208 A5 JP2010524208 A5 JP 2010524208A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- ether
- optionally
- glycol
- chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US90942807P | 2007-03-31 | 2007-03-31 | |
| US94373607P | 2007-06-13 | 2007-06-13 | |
| PCT/US2008/058878 WO2008121952A1 (en) | 2007-03-31 | 2008-03-31 | Methods for stripping material for wafer reclamation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010524208A JP2010524208A (ja) | 2010-07-15 |
| JP2010524208A5 true JP2010524208A5 (cg-RX-API-DMAC7.html) | 2011-05-12 |
Family
ID=39577853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010501279A Pending JP2010524208A (ja) | 2007-03-31 | 2008-03-31 | ウエハ再生のために材料を剥離する方法 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1975987A3 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2010524208A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20100015974A (cg-RX-API-DMAC7.html) |
| CN (1) | CN101681130A (cg-RX-API-DMAC7.html) |
| SG (1) | SG166102A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TW200908148A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2008121952A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100301010A1 (en) * | 2007-10-08 | 2010-12-02 | Basf Se | ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo |
| WO2010039936A2 (en) * | 2008-10-02 | 2010-04-08 | Advanced Technology Materials, Inc. | Use of surfactant/defoamer mixtures for enhanced metals loading and surface passivation of silicon substrates |
| US8398779B2 (en) * | 2009-03-02 | 2013-03-19 | Applied Materials, Inc. | Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates |
| TWI480360B (zh) * | 2009-04-03 | 2015-04-11 | 杜邦股份有限公司 | 蝕刻劑組成物及方法 |
| CN101957563B (zh) * | 2009-07-13 | 2014-09-24 | 安集微电子(上海)有限公司 | 一种含氟等离子刻蚀残留物清洗液 |
| DE102010019079A1 (de) * | 2010-04-30 | 2011-11-03 | Gp Solar Gmbh | Additiv für alkalische Ätzlösungen, insbesondere für Texturätzlösungen, sowie Verfahren zu dessen Herstellung |
| CN102337102B (zh) * | 2010-07-21 | 2013-06-05 | 凤凰光学股份有限公司 | 一种化学研磨去除钢铁件毛刺的工艺方法 |
| KR101150857B1 (ko) * | 2010-10-22 | 2012-06-13 | 주식회사 티씨케이 | 세라믹 코팅층의 리페어방법 |
| CN102010797B (zh) * | 2010-12-23 | 2011-12-28 | 西安隆基硅材料股份有限公司 | 硅料清洗剂及硅料清洗的方法 |
| CN102115915B (zh) * | 2010-12-31 | 2012-08-22 | 百力达太阳能股份有限公司 | 一种单晶硅制绒添加剂以及单晶硅制绒工艺 |
| CN102533124A (zh) * | 2010-12-31 | 2012-07-04 | 上海硅酸盐研究所中试基地 | 碳化硅衬底用抛光液 |
| DE102011000322A1 (de) | 2011-01-25 | 2012-07-26 | saperatec GmbH | Trennmedium, Verfahren und Anlage zum Trennen von Mehrschichtsystemen |
| JP2012238849A (ja) * | 2011-04-21 | 2012-12-06 | Rohm & Haas Electronic Materials Llc | 改良された多結晶テクスチャ化組成物および方法 |
| US20130053291A1 (en) * | 2011-08-22 | 2013-02-28 | Atsushi Otake | Composition for cleaning substrates post-chemical mechanical polishing |
| CN103975052B (zh) | 2011-10-05 | 2016-11-09 | 安万托特性材料股份有限公司 | 具有铜/唑类聚合物抑制作用的微电子衬底清洁组合物 |
| JP2013102089A (ja) * | 2011-11-09 | 2013-05-23 | Adeka Corp | チタン酸鉛系材料用エッチング剤組成物 |
| KR101349975B1 (ko) * | 2011-11-17 | 2014-01-15 | 주식회사 이엔에프테크놀로지 | 몰리브덴 합금막 및 인듐 산화막 식각액 조성물 |
| KR102058485B1 (ko) * | 2012-03-13 | 2019-12-23 | 가부시키가이샤 아데카 | 에칭액 조성물 및 에칭방법 |
| WO2013137192A1 (ja) | 2012-03-16 | 2013-09-19 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN103076725A (zh) * | 2013-01-31 | 2013-05-01 | 北京七星华创电子股份有限公司 | 一种去除光刻胶的溶液及其应用 |
| KR102091543B1 (ko) * | 2013-08-01 | 2020-03-23 | 동우 화인켐 주식회사 | 망상형 고분자 용해용 조성물 |
| US9633831B2 (en) * | 2013-08-26 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same |
| WO2015095726A1 (en) | 2013-12-20 | 2015-06-25 | Entegris, Inc. | Use of non-oxidizing strong acids for the removal of ion-implanted resist |
| WO2015119925A1 (en) | 2014-02-05 | 2015-08-13 | Advanced Technology Materials, Inc. | Non-amine post-cmp compositions and method of use |
| CN103839885B (zh) * | 2014-03-17 | 2016-09-07 | 上海华虹宏力半导体制造有限公司 | 去除缺陷的方法 |
| CN103972052B (zh) * | 2014-05-21 | 2018-05-04 | 上海华力微电子有限公司 | 应用晶边扫描预防线状分布缺陷发生的方法 |
| KR102405063B1 (ko) * | 2014-06-30 | 2022-06-07 | 엔테그리스, 아이엔씨. | 텅스텐 및 코발트 상용성을 갖는 에치후 잔류물을 제거하기 위한 수성 및 반-수성 세정제 |
| CN104120040B (zh) * | 2014-08-08 | 2017-08-01 | 常州时创能源科技有限公司 | 多晶硅链式制绒设备的清洗液添加剂及其应用 |
| JP6589883B2 (ja) * | 2014-11-13 | 2019-10-16 | 三菱瓦斯化学株式会社 | 半導体素子を洗浄するためのアルカリ土類金属を含む洗浄液、およびそれを用いた半導体素子の洗浄方法 |
| TWI585841B (zh) * | 2015-02-06 | 2017-06-01 | 國立台灣科技大學 | 基板及其加工方法與裝置 |
| CN104993014B (zh) * | 2015-05-27 | 2017-02-01 | 东方日升新能源股份有限公司 | 扩散后不良片的单独返工方法 |
| JP6619956B2 (ja) * | 2015-06-17 | 2019-12-11 | 日本放送協会 | 固体撮像素子の製造方法 |
| CN105045051B (zh) * | 2015-08-24 | 2016-06-01 | 北京中科紫鑫科技有限责任公司 | 光刻胶的去除方法 |
| US10538846B2 (en) * | 2015-12-11 | 2020-01-21 | Dongwoo Fine-Chem Co., Ltd. | Etching solution composition for tungsten layer, method for preparing electronic device using the same and electronic device |
| KR102487249B1 (ko) * | 2015-12-11 | 2023-01-13 | 동우 화인켐 주식회사 | 텅스텐막 식각액 조성물 |
| TWI717346B (zh) * | 2016-04-13 | 2021-02-01 | 大陸商盛美半導體設備(上海)股份有限公司 | 阻擋層的去除方法和半導體結構的形成方法 |
| CN107924836B (zh) * | 2016-05-26 | 2021-09-21 | 南京中云新材料有限公司 | 一种单晶硅片表面织构化的方法 |
| GB2557682A (en) * | 2016-12-15 | 2018-06-27 | saperatec GmbH | Method and apparatus for recycling packaging material |
| US20180371292A1 (en) * | 2017-06-21 | 2018-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Buffered cmp polishing solution |
| CN107357143B (zh) | 2017-07-25 | 2018-06-19 | 上海新阳半导体材料股份有限公司 | 一种清洗剂、其制备方法和应用 |
| US10879076B2 (en) * | 2017-08-25 | 2020-12-29 | Versum Materials Us, Llc | Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/silicon stack during manufacture of a semiconductor device |
| CN109988509B (zh) * | 2017-12-29 | 2021-07-09 | 浙江新创纳电子科技有限公司 | 一种钽酸锂还原片抛光液及其制备方法和用途 |
| SG11202004420QA (en) | 2018-01-25 | 2020-06-29 | Merck Patent Gmbh | Photoresist remover compositions |
| US20190233777A1 (en) * | 2018-01-30 | 2019-08-01 | Dow Global Technologies Llc | Microemulsion removers for advanced photolithography |
| JP7294315B2 (ja) * | 2018-03-02 | 2023-06-20 | 三菱瓦斯化学株式会社 | アルミナのダメージを抑制した組成物及びこれを用いた半導体基板の製造方法 |
| US11499236B2 (en) * | 2018-03-16 | 2022-11-15 | Versum Materials Us, Llc | Etching solution for tungsten word line recess |
| CN109116689A (zh) * | 2018-09-19 | 2019-01-01 | 珠海特普力高精细化工有限公司 | 一种环保型有机干膜剥离液 |
| KR20250116167A (ko) * | 2018-12-03 | 2025-07-31 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 에칭 조성물 |
| CN109777393B (zh) * | 2019-03-19 | 2020-04-14 | 中国石油化工股份有限公司 | 一种泡沫驱油剂 |
| CN110702490A (zh) * | 2019-11-01 | 2020-01-17 | 上海申和热磁电子有限公司 | 一种半导体切片废液中碳化硅的提纯分析方法 |
| KR102192954B1 (ko) * | 2020-03-26 | 2020-12-18 | 동우 화인켐 주식회사 | 고분자 세정용 조성물 |
| TWI824299B (zh) | 2020-09-22 | 2023-12-01 | 美商恩特葛瑞斯股份有限公司 | 蝕刻劑組合物 |
| CN112326631B (zh) * | 2020-10-12 | 2023-11-07 | 宁波江丰电子材料股份有限公司 | 一种溶解钨钛合金样品的方法 |
| KR20220083186A (ko) | 2020-12-11 | 2022-06-20 | 동우 화인켐 주식회사 | 고분자 처리용 공정액 |
| CN112680288A (zh) * | 2020-12-24 | 2021-04-20 | 昆山晶科微电子材料有限公司 | 一种用于清洁半导体芯片洗涤剂及其制备方法 |
| KR102925424B1 (ko) | 2021-03-16 | 2026-02-11 | 동우 화인켐 주식회사 | 고분자 처리용 공정액 조성물 |
| CN117616102A (zh) | 2021-05-21 | 2024-02-27 | 弗萨姆材料美国有限责任公司 | 用于在半导体器件制造期间从硅-锗/硅堆叠选择性地去除硅-锗合金的蚀刻溶液 |
| US12652976B2 (en) * | 2021-07-22 | 2026-06-09 | Lawrence Livermore National Security, Llc | Systems and methods for silicon microstructures fabricated via greyscale DRIE with SOI release |
| CN113862480A (zh) * | 2021-09-29 | 2021-12-31 | 天津绿展环保科技有限公司 | 一种用于paste罐的工业提取剂、处理方法及处理系统 |
| KR102965473B1 (ko) * | 2022-08-23 | 2026-05-18 | 인디언 오일 코퍼레이션 리미티드 | 태양광 물 분해를 위한 양면 광활성 반도체 재료를 위한 재사용 가능한 금속 기판 |
| CN118295222B (zh) * | 2024-05-06 | 2025-08-12 | 惠州达诚微电子材料有限公司 | 一种光刻胶用剥离液及其制备方法 |
| CN118581455B (zh) * | 2024-05-31 | 2025-01-24 | 四川江化微电子材料有限公司 | 一种银蚀刻液及其制备方法和应用 |
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| JPS53142168A (en) * | 1977-05-18 | 1978-12-11 | Toshiba Corp | Reproductive use of semiconductor substrate |
| US4704188A (en) * | 1983-12-23 | 1987-11-03 | Honeywell Inc. | Wet chemical etching of crxsiynz |
| JPH05299810A (ja) * | 1992-04-21 | 1993-11-12 | Sumitomo Metal Ind Ltd | 配線パターン形成用エッチング溶液 |
| JPH07122532A (ja) * | 1993-10-26 | 1995-05-12 | Mitsubishi Materials Corp | 再生ウェーハの製造方法 |
| KR100492104B1 (ko) | 1996-03-19 | 2005-06-10 | 다이낑 고오교 가부시키가이샤 | 불화수소의 연속 제조 방법 |
| JPH11150329A (ja) * | 1997-11-14 | 1999-06-02 | Sony Corp | 半導体素子の製造方法 |
| JPH11288858A (ja) * | 1998-01-30 | 1999-10-19 | Canon Inc | Soi基板の再生方法及び再生基板 |
| US6242165B1 (en) * | 1998-08-28 | 2001-06-05 | Micron Technology, Inc. | Supercritical compositions for removal of organic material and methods of using same |
| JP3189892B2 (ja) * | 1998-09-17 | 2001-07-16 | 日本電気株式会社 | 半導体基板の洗浄方法及び洗浄液 |
| JP2000133558A (ja) * | 1998-10-22 | 2000-05-12 | Canon Inc | 半導体基体の作製方法およびそれにより作製された基体 |
| JP2002071927A (ja) * | 2000-08-29 | 2002-03-12 | Sony Corp | カラーフィルタ基板の再生方法 |
| JP2002270801A (ja) * | 2001-03-13 | 2002-09-20 | Canon Inc | 半導体基板の製造方法及び半導体基板 |
| JP2005508079A (ja) | 2001-10-08 | 2005-03-24 | アドバンスド.テクノロジー.マテリアルス.インコーポレイテッド | 多成分流体用のリアル・タイム成分モニタリングおよび補充システム |
| US6698619B2 (en) | 2002-05-03 | 2004-03-02 | Advanced Technology Materials, Inc. | Returnable and reusable, bag-in-drum fluid storage and dispensing container system |
| US7188644B2 (en) | 2002-05-03 | 2007-03-13 | Advanced Technology Materials, Inc. | Apparatus and method for minimizing the generation of particles in ultrapure liquids |
| US7153690B2 (en) | 2002-10-04 | 2006-12-26 | Advanced Technology Materials, Inc. | Real-time component monitoring and replenishment system for multicomponent fluids |
| US6912438B2 (en) * | 2002-10-21 | 2005-06-28 | Advanced Micro Devices, Inc. | Using scatterometry to obtain measurements of in circuit structures |
| JP2004170538A (ja) * | 2002-11-18 | 2004-06-17 | Nippon Zeon Co Ltd | レジスト剥離液 |
| JP4085262B2 (ja) * | 2003-01-09 | 2008-05-14 | 三菱瓦斯化学株式会社 | レジスト剥離剤 |
| JP4159929B2 (ja) * | 2003-05-28 | 2008-10-01 | 花王株式会社 | レジスト用剥離剤組成物 |
| US7119052B2 (en) * | 2003-06-24 | 2006-10-10 | Advanced Technology Materials, Inc. | Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers |
| ATE520661T1 (de) | 2003-06-27 | 2011-09-15 | Univ Maryland | Heterocyclische verbindungen mit quaternärem stickstoff zum nachweis von wässrigen monosacchariden in physiologischen flüssigkeiten |
| CA2544198C (en) * | 2003-10-29 | 2011-07-26 | Mallinckrodt Baker, Inc. | Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors |
| KR101162797B1 (ko) * | 2004-08-03 | 2012-07-05 | 아반토르 퍼포먼스 머티리얼스, 인크. | 마이크로일렉트로닉스 기판용 세정 조성물 |
| US7819981B2 (en) | 2004-10-26 | 2010-10-26 | Advanced Technology Materials, Inc. | Methods for cleaning ion implanter components |
| EP1894230A2 (en) * | 2005-06-13 | 2008-03-05 | Advanced Technology Materials, Inc. | Compositions and methods for selective removal of metal or metal alloy after metal silicide formation |
| WO2008157345A2 (en) * | 2007-06-13 | 2008-12-24 | Advanced Technology Materials, Inc. | Wafer reclamation compositions and methods |
-
2008
- 2008-03-31 EP EP08103209A patent/EP1975987A3/en not_active Withdrawn
- 2008-03-31 WO PCT/US2008/058878 patent/WO2008121952A1/en not_active Ceased
- 2008-03-31 SG SG201007080-3A patent/SG166102A1/en unknown
- 2008-03-31 CN CN200880016177A patent/CN101681130A/zh active Pending
- 2008-03-31 JP JP2010501279A patent/JP2010524208A/ja active Pending
- 2008-03-31 KR KR1020097022496A patent/KR20100015974A/ko not_active Withdrawn
- 2008-03-31 TW TW097111743A patent/TW200908148A/zh unknown
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