JP2010283056A5 - - Google Patents

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Publication number
JP2010283056A5
JP2010283056A5 JP2009134005A JP2009134005A JP2010283056A5 JP 2010283056 A5 JP2010283056 A5 JP 2010283056A5 JP 2009134005 A JP2009134005 A JP 2009134005A JP 2009134005 A JP2009134005 A JP 2009134005A JP 2010283056 A5 JP2010283056 A5 JP 2010283056A5
Authority
JP
Japan
Prior art keywords
pad
linear conductors
core substrate
linear
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009134005A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010283056A (ja
JP5249132B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009134005A priority Critical patent/JP5249132B2/ja
Priority claimed from JP2009134005A external-priority patent/JP5249132B2/ja
Priority to US12/792,334 priority patent/US8362369B2/en
Publication of JP2010283056A publication Critical patent/JP2010283056A/ja
Publication of JP2010283056A5 publication Critical patent/JP2010283056A5/ja
Application granted granted Critical
Publication of JP5249132B2 publication Critical patent/JP5249132B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009134005A 2009-06-03 2009-06-03 配線基板 Expired - Fee Related JP5249132B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009134005A JP5249132B2 (ja) 2009-06-03 2009-06-03 配線基板
US12/792,334 US8362369B2 (en) 2009-06-03 2010-06-02 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009134005A JP5249132B2 (ja) 2009-06-03 2009-06-03 配線基板

Publications (3)

Publication Number Publication Date
JP2010283056A JP2010283056A (ja) 2010-12-16
JP2010283056A5 true JP2010283056A5 (enExample) 2012-05-24
JP5249132B2 JP5249132B2 (ja) 2013-07-31

Family

ID=43299941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009134005A Expired - Fee Related JP5249132B2 (ja) 2009-06-03 2009-06-03 配線基板

Country Status (2)

Country Link
US (1) US8362369B2 (enExample)
JP (1) JP5249132B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5460155B2 (ja) * 2009-07-14 2014-04-02 新光電気工業株式会社 キャパシタ及び配線基板
JP5436963B2 (ja) * 2009-07-21 2014-03-05 新光電気工業株式会社 配線基板及び半導体装置
TWI446497B (zh) * 2010-08-13 2014-07-21 欣興電子股份有限公司 嵌埋被動元件之封裝基板及其製法
JP5587804B2 (ja) * 2011-01-21 2014-09-10 日本特殊陶業株式会社 電子部品実装用配線基板の製造方法、電子部品実装用配線基板、及び電子部品付き配線基板の製造方法
JP2013004576A (ja) * 2011-06-13 2013-01-07 Shinko Electric Ind Co Ltd 半導体装置
JP5833398B2 (ja) * 2011-06-27 2015-12-16 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
JP2014216552A (ja) * 2013-04-26 2014-11-17 富士通株式会社 積層構造体及びその製造方法
US20160055976A1 (en) * 2014-08-25 2016-02-25 Qualcomm Incorporated Package substrates including embedded capacitors
US10276368B2 (en) * 2014-10-03 2019-04-30 Nippon Sheet Glass Company, Limited Method for producing glass substrate with through glass vias and glass substrate
CN115335994A (zh) * 2020-03-12 2022-11-11 罗姆股份有限公司 电容器和电容器的制造方法
CN114582729A (zh) * 2022-01-20 2022-06-03 珠海越亚半导体股份有限公司 封装基板制作方法及封装基板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141595A (ja) 1982-02-17 1983-08-22 アルプス電気株式会社 回路板の形成方法
JPS58137915A (ja) 1982-02-09 1983-08-16 アルプス電気株式会社 回路板の形成方法
US4463084A (en) * 1982-02-09 1984-07-31 Alps Electric Co., Ltd. Method of fabricating a circuit board and circuit board provided thereby
JPH01124296A (ja) * 1987-11-09 1989-05-17 Hitachi Chem Co Ltd 配線板の製造法
JPH07207450A (ja) * 1994-01-13 1995-08-08 Nitto Denko Corp フッ素樹脂製部分メッキ多孔質シートの製法
JPH10308565A (ja) * 1997-05-02 1998-11-17 Shinko Electric Ind Co Ltd 配線基板
JPH1168319A (ja) * 1997-08-11 1999-03-09 Shinko Electric Ind Co Ltd 多層回路基板及びその製造方法
US6495394B1 (en) * 1999-02-16 2002-12-17 Sumitomo Metal (Smi) Electronics Devices Inc. Chip package and method for manufacturing the same
JP2001102749A (ja) * 1999-09-17 2001-04-13 Internatl Business Mach Corp <Ibm> 回路基板
JP2001207288A (ja) * 2000-01-27 2001-07-31 Canon Inc 細孔内への電着方法及び構造体
JP2004273480A (ja) * 2003-03-05 2004-09-30 Sony Corp 配線基板およびその製造方法および半導体装置
TWI255466B (en) * 2004-10-08 2006-05-21 Ind Tech Res Inst Polymer-matrix conductive film and method for fabricating the same
US7462784B2 (en) * 2006-05-02 2008-12-09 Ibiden Co., Ltd. Heat resistant substrate incorporated circuit wiring board
JP5344667B2 (ja) * 2007-12-18 2013-11-20 太陽誘電株式会社 回路基板およびその製造方法並びに回路モジュール
JP5426261B2 (ja) * 2009-07-17 2014-02-26 新光電気工業株式会社 半導体装置

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