WO2008126738A1 - インターポーザ - Google Patents

インターポーザ Download PDF

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Publication number
WO2008126738A1
WO2008126738A1 PCT/JP2008/056565 JP2008056565W WO2008126738A1 WO 2008126738 A1 WO2008126738 A1 WO 2008126738A1 JP 2008056565 W JP2008056565 W JP 2008056565W WO 2008126738 A1 WO2008126738 A1 WO 2008126738A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode section
pad
post
main body
holes
Prior art date
Application number
PCT/JP2008/056565
Other languages
English (en)
French (fr)
Inventor
Shuichi Kawano
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to CN200880000049XA priority Critical patent/CN101542722B/zh
Priority to EP08739676A priority patent/EP2136399A4/en
Priority to JP2008526707A priority patent/JP4695192B2/ja
Publication of WO2008126738A1 publication Critical patent/WO2008126738A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　インターポーザ１０は、第１及び第２スルーホール１４，１６を有する基板本体１２と、第１及び第２スルーホール１４，１６の内面並びに基板本体１２の第１表面に形成された第１電極部２２に誘電体層２４と第２電極部２６とを積層してなるコンデンサ２０と、第１スルーホール１４内において第２電極部２６に囲まれて形成された空間内に電気絶縁材を充填してなる絶縁層１８と、この絶縁層１８を貫通し一端が第１電極部２２に電気的に接続されると共に第２電極部２６と電気的に絶縁されてなる第１ポスト４０とを備えている。この第１ポスト４０の両端には、それぞれ第１パッド３１と第２パッド３２が設けられている。一方、第２スルーホール１６内には、外周面が第２電極部２６に接する一方、第１電極部２２とは電気的に絶縁されてなる第２ポストを備える。この第２ポスト４２の両端には、それぞれ第３パッド３３と第４パッド３４が設けられている。
PCT/JP2008/056565 2007-04-10 2008-04-02 インターポーザ WO2008126738A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880000049XA CN101542722B (zh) 2007-04-10 2008-04-02 中继基板
EP08739676A EP2136399A4 (en) 2007-04-10 2008-04-02 ZWISCHENSTÜCK
JP2008526707A JP4695192B2 (ja) 2007-04-10 2008-04-02 インターポーザ

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US91097007P 2007-04-10 2007-04-10
US60/910,970 2007-04-10
US11/969,606 2008-01-04
US11/969,606 US7589394B2 (en) 2007-04-10 2008-01-04 Interposer

Publications (1)

Publication Number Publication Date
WO2008126738A1 true WO2008126738A1 (ja) 2008-10-23

Family

ID=39853518

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056565 WO2008126738A1 (ja) 2007-04-10 2008-04-02 インターポーザ

Country Status (6)

Country Link
US (1) US7589394B2 (ja)
EP (1) EP2136399A4 (ja)
JP (1) JP4695192B2 (ja)
KR (1) KR20090042753A (ja)
CN (1) CN101542722B (ja)
WO (1) WO2008126738A1 (ja)

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JP2012079719A (ja) * 2010-09-30 2012-04-19 Chino Corp 機能追加型基板
JP2012227266A (ja) * 2011-04-18 2012-11-15 Shinko Electric Ind Co Ltd 配線基板、半導体装置及び配線基板の製造方法
JP2012227267A (ja) * 2011-04-18 2012-11-15 Shinko Electric Ind Co Ltd 配線基板、半導体装置及び配線基板の製造方法

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US20090189285A1 (en) * 2008-01-24 2009-07-30 Colt Jr John Zuidema On chip thermocouple and/or power supply and a design structure for same
US20100123993A1 (en) * 2008-02-13 2010-05-20 Herzel Laor Atomic layer deposition process for manufacture of battery electrodes, capacitors, resistors, and catalyzers
US8247288B2 (en) * 2009-07-31 2012-08-21 Alpha & Omega Semiconductor Inc. Method of integrating a MOSFET with a capacitor
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US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012079719A (ja) * 2010-09-30 2012-04-19 Chino Corp 機能追加型基板
JP2012227266A (ja) * 2011-04-18 2012-11-15 Shinko Electric Ind Co Ltd 配線基板、半導体装置及び配線基板の製造方法
JP2012227267A (ja) * 2011-04-18 2012-11-15 Shinko Electric Ind Co Ltd 配線基板、半導体装置及び配線基板の製造方法

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JPWO2008126738A1 (ja) 2010-07-22
CN101542722A (zh) 2009-09-23
US7589394B2 (en) 2009-09-15
US20080253097A1 (en) 2008-10-16
CN101542722B (zh) 2010-12-22
EP2136399A4 (en) 2011-05-25
KR20090042753A (ko) 2009-04-30
JP4695192B2 (ja) 2011-06-08

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