TW200943329A - A laminated electronic part and its manufacturing method - Google Patents
A laminated electronic part and its manufacturing methodInfo
- Publication number
- TW200943329A TW200943329A TW98106644A TW98106644A TW200943329A TW 200943329 A TW200943329 A TW 200943329A TW 98106644 A TW98106644 A TW 98106644A TW 98106644 A TW98106644 A TW 98106644A TW 200943329 A TW200943329 A TW 200943329A
- Authority
- TW
- Taiwan
- Prior art keywords
- coil
- electrodes
- laminated
- electronic part
- manufacturing
- Prior art date
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
This invention is a laminated electronic part and its manufacturing method. This laminated electronic part can prevent the disconnection between a via conductor and a coil electrode. There are multiple coil electrodes 8 combining together to form a coil L. Multiple magnetic body layers 4 and multiple coil electrodes 8 are laminated together to form a laminated body 2. A contacting part C connects multiple coil electrodes 8; furthermore, the contacting part C has a shape with an end's area that is greater than the other end. External electrodes are formed on the surface of the laminated body and is connected to the aforementioned coil. The length of coil electrodes 8a is longer than the length of coil electrodes 8f. The coil electrodes 8a connecs to a contacting part B1 through one of the aforementioned ends.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008068699 | 2008-03-18 | ||
JP2009023207A JP5262775B2 (en) | 2008-03-18 | 2009-02-04 | Multilayer electronic component and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200943329A true TW200943329A (en) | 2009-10-16 |
TWI387978B TWI387978B (en) | 2013-03-01 |
Family
ID=41231478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98106644A TWI387978B (en) | 2008-03-18 | 2009-03-02 | Laminated type electronic component and manufacturing method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5262775B2 (en) |
CN (1) | CN101572161B (en) |
TW (1) | TWI387978B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103035396A (en) * | 2011-09-30 | 2013-04-10 | 钰铠科技股份有限公司 | Lamination type inductance manufacturing process |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5533673B2 (en) * | 2009-02-10 | 2014-06-25 | 株式会社村田製作所 | Electronic components |
WO2015093562A1 (en) | 2013-12-18 | 2015-06-25 | 武延 本郷 | Cold welding device, coil manufacturing device, coil and manufacturing method for same |
JP5592554B1 (en) * | 2013-12-18 | 2014-09-17 | 武延 本郷 | Cold welding apparatus, coil manufacturing apparatus, coil and manufacturing method thereof |
KR101630090B1 (en) * | 2014-12-24 | 2016-06-13 | 삼성전기주식회사 | Multilayered electronic component and manufacturing method thereof |
JP6962129B2 (en) * | 2017-10-20 | 2021-11-05 | Tdk株式会社 | Multilayer coil parts and their manufacturing methods |
JP7276202B2 (en) * | 2020-03-05 | 2023-05-18 | 株式会社村田製作所 | inductor components |
JP7367713B2 (en) * | 2021-02-24 | 2023-10-24 | 株式会社村田製作所 | inductor parts |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0737720A (en) * | 1993-07-21 | 1995-02-07 | Hitachi Metals Ltd | Chip component and its usage |
JP3788074B2 (en) * | 1998-11-10 | 2006-06-21 | 株式会社村田製作所 | Chip coil and manufacturing method thereof |
JP3446681B2 (en) * | 1999-09-28 | 2003-09-16 | 株式会社村田製作所 | Multilayer inductor array |
JPWO2005024863A1 (en) * | 2003-09-01 | 2006-11-16 | 株式会社村田製作所 | Multilayer coil component and manufacturing method thereof |
JP4211591B2 (en) * | 2003-12-05 | 2009-01-21 | 株式会社村田製作所 | Method for manufacturing multilayer electronic component and multilayer electronic component |
JP4140061B2 (en) * | 2004-01-23 | 2008-08-27 | 株式会社村田製作所 | Chip inductor and manufacturing method thereof |
KR100745496B1 (en) * | 2005-01-07 | 2007-08-02 | 가부시키가이샤 무라타 세이사쿠쇼 | Laminated coil |
JP2007165407A (en) * | 2005-12-09 | 2007-06-28 | Murata Mfg Co Ltd | Choke coil |
JP4509186B2 (en) * | 2006-01-31 | 2010-07-21 | 日立金属株式会社 | Laminated component and module using the same |
-
2009
- 2009-02-04 JP JP2009023207A patent/JP5262775B2/en active Active
- 2009-03-02 TW TW98106644A patent/TWI387978B/en active
- 2009-03-17 CN CN200910128580.1A patent/CN101572161B/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103035396A (en) * | 2011-09-30 | 2013-04-10 | 钰铠科技股份有限公司 | Lamination type inductance manufacturing process |
Also Published As
Publication number | Publication date |
---|---|
CN101572161A (en) | 2009-11-04 |
JP5262775B2 (en) | 2013-08-14 |
JP2009260266A (en) | 2009-11-05 |
TWI387978B (en) | 2013-03-01 |
CN101572161B (en) | 2014-07-02 |
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