CN101572161A - Stacking type electronic component and manufacturing method thereof - Google Patents
Stacking type electronic component and manufacturing method thereof Download PDFInfo
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- CN101572161A CN101572161A CN 200910128580 CN200910128580A CN101572161A CN 101572161 A CN101572161 A CN 101572161A CN 200910128580 CN200910128580 CN 200910128580 CN 200910128580 A CN200910128580 A CN 200910128580A CN 101572161 A CN101572161 A CN 101572161A
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Abstract
The present invention provides a stacking type electronic component capable of preventing disconnection between a through-hole conductor and a coil electrode, and a method for manufacturing the same. A coil is composed of a plurality of coil electrodes (8). A stacking body (2) is formed by stacking a plurality of magnetic body layers (4) and a plurality of coil electrodes (8). A contact part (C) is connected to the a plurality of coil electrodes (8) and has a shape that one end area is larger than the other end area. An external electrode is formed on the surface of a stacking body and is connected with the coil. A coil electrode (8a) is longer than a coil electrode (8f). the coil electrode (8a) is connected with the end part of a contact part (B1).
Description
Technical field
The present invention relates to laminated electronic component and manufacture method thereof, relate to laminated electronic component and manufacture method thereof that insulating barrier and coil electrode are laminated.
Background technology
Below, with reference to the structure of the laminated electronic component in the past of description of drawings internal coil.Fig. 9 is the perspective view of laminated electronic component 100 in the past.Figure 10 is the exploded perspective view of the duplexer 102 of laminated electronic component 100 in the past.
As shown in Figure 9, laminated electronic component 100 comprises: the rectangular-shaped duplexer 102 that comprises coil in inside; And two outer electrode 112a, 112b being formed at the relative side of duplexer 102.
Coil electrode 108a～108f has the shape of approximate " コ " font, is to have the roughly electrode of the length of 3/4 circle.Via conductors B1～B5 runs through magnetic layer 104a～104e along the vertical direction and is provided with at the end of each coil electrode 108a～108e respectively.Coil electrode 108a～108f is connected to each other by via conductors B1～B5, constitutes spiral helicine coil.In addition, coil electrode 108a, 108f in top side that is formed at stacked direction and lower side are provided with extraction electrode 110a, 110b respectively.This extraction electrode 110a, 110b role are that coil is connected with outer electrode 112a, 112b.
In the laminated electronic component in the past 100 that constitutes as mentioned above, as described below shown in, have and between coil electrode 108f and via conductors B5, be easy to generate such problem that breaks.
As shown in figure 10, the length of coil electrode 108f is longer than the length of coil electrode 108a.Therefore, when flowing through electric current in coil, the caloric value of coil electrode 108f is bigger than the caloric value of coil electrode 108a.In addition, in the less side's of area of coil electrode 108f connecting through hole conductor B5 end.Therefore, especially can concentrate heating in the coupling part of coil electrode 108f and via conductors B5.Consequently, between coil electrode 108f and via conductors B5, be easy to generate broken string.
In addition, coil-conductor and the undermost coil-conductor of having put down in writing a kind of the superiors in patent documentation 1 has identical shaped laminated electronic component.Yet, in patent documentation 1, do not mention the problem of the coupling part broken string of via conductors and coil-conductor.
Patent documentation 1: the Japan Patent spy opens the 2005-167130 communique
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of laminated electronic component and manufacture method thereof that can prevent the broken string between via conductors and the coil electrode.
The feature of the laminated electronic component of first invention is to comprise: a plurality of coil electrodes that constitute coil; Stacked and constitute a plurality of insulating barriers of duplexer with above-mentioned a plurality of coil electrodes; The connecting portion that connects above-mentioned a plurality of coil electrode and have end area shape bigger than the other end area; And the surface that is formed at above-mentioned duplexer, and first outer electrode that is connected with above-mentioned coil and second outer electrode, the coil electrode that is connected with above-mentioned first outer electrode is connected in an above-mentioned end of above-mentioned connecting portion, the coil electrode that is connected with above-mentioned second outer electrode is connected in above-mentioned the other end of above-mentioned connecting portion, and the position from being connected with this first outer electrode of coil electrode that is connected in above-mentioned first outer electrode is bigger to the D.C. resistance of above-mentioned connecting portion than the position from being connected with this second outer electrode of the coil electrode that is connected in above-mentioned second outer electrode to the D.C. resistance of above-mentioned connecting portion.
According to first invention, the position from being connected with this first outer electrode of the coil electrode that is connected with first outer electrode is bigger to the D.C. resistance of connecting portion than the position from being connected with this second outer electrode of the coil electrode that is connected with second outer electrode to the D.C. resistance of connecting portion.Therefore, when flowing through electric current in coil, the caloric value of the coil electrode that is connected with first outer electrode is bigger than the caloric value of the coil electrode that is connected with second outer electrode.So the coil electrode and the connecting portion that are connected with first outer electrode may break owing to heating.Yet, in first invention, be connected with the bigger side's of area of connecting portion end at the coil electrode that is connected with first outer electrode.Therefore, in first invention, can prevent to concentrate heating in the coupling part of coil electrode that is connected with first outer electrode and connecting portion.Consequently, can be suppressed at the boundary member generation broken string of coil electrode and connecting portion.
In first invention, the coil electrode that is connected with above-mentioned second outer electrode also can constitute and can be connected with above-mentioned connecting portion at a plurality of positions.
In first invention, the coil electrode that is connected with above-mentioned second outer electrode also can have the part shape thicker than other parts that can be connected with above-mentioned connecting portion.
In first invention, above-mentioned connecting portion also can be the part that is connected in outside coil electrode and the position that this second outer electrode is connected of above-mentioned second outer electrode, and is connected in the part outside the end of this connecting portion opposition side.
In first invention, the coil electrode and the above-mentioned connecting portion that are connected with above-mentioned first outer electrode also can be integrally formed at above-mentioned insulating barrier.
In first invention, can not form above-mentioned connecting portion at the above-mentioned insulating barrier that is formed with the coil electrode that is connected with above-mentioned second outer electrode yet.
In first invention, the coil electrode that is connected with above-mentioned second outer electrode also can be connected in above-mentioned the other end of above-mentioned connecting portion.
Second invention is by being built-in with coil and forming the manufacture method of the laminated electronic component that the duplexer of first outer electrode and second outer electrode forms on the surface, it is characterized in that, comprising: the connecting portion that will have end area shape bigger than the other end area is formed at the operation of insulating barrier; First coil electrode is formed at above-mentioned insulating barrier, makes this first coil electrode that is connected with above-mentioned first outer electrode be connected in the operation of an above-mentioned end of above-mentioned connecting portion; To be formed at the operation of insulating barrier with second coil electrode that above-mentioned second outer electrode is connected; And stacked be formed with the insulating barrier of this first coil electrode and be formed with the insulating barrier of this second coil electrode and form above-mentioned duplexer, make above-mentioned first coil electrode from the position that is connected with this first outer electrode to the D.C. resistance of above-mentioned connecting portion than above-mentioned second coil electrode from the position that is connected with this second outer electrode to the big operation of the D.C. resistance of above-mentioned connecting portion.
According to second invention, the position from being connected with this first outer electrode of coil electrode that is connected in first outer electrode is bigger to the D.C. resistance of connecting portion than the position from being connected with this second outer electrode of the coil electrode that is connected in second outer electrode to the D.C. resistance of connecting portion.Therefore, when flowing through electric current in coil, the caloric value of the coil electrode that is connected with first outer electrode is bigger than the caloric value of the coil electrode that is connected with second outer electrode.So the coil electrode and the connecting portion that are connected with first outer electrode may break owing to heating.Yet, in second invention, be connected with the bigger side's of area of connecting portion end at the coil electrode that is connected with first outer electrode.Therefore, in second invention, can prevent to concentrate heating in the coupling part of coil electrode that is connected with first outer electrode and connecting portion.Consequently, can be suppressed at the boundary member generation broken string of coil electrode and connecting portion.
In second invention, in the operation that forms above-mentioned second coil electrode, also can form this second coil electrode at the above-mentioned insulating barrier that does not form above-mentioned connecting portion.
In second invention, in the operation that forms above-mentioned second coil electrode, also this second coil electrode can be formed the shape that can be connected with above-mentioned connecting portion at a plurality of positions.
In second invention, in the operation that forms above-mentioned second coil electrode, also can form this second coil electrode, make that the part that can be connected with above-mentioned connecting portion is thicker than other parts.
In second invention, in the operation that forms above-mentioned duplexer, also can stacked above-mentioned insulating barrier, make that above-mentioned connecting portion is the part that is connected in outside above-mentioned coil electrode and the position that this second outer electrode is connected of above-mentioned second outer electrode, and be connected in the part outside the end of this connecting portion opposition side.
The feature of the 3rd invention is to comprise: a plurality of coil electrodes that constitute coil; Stacked and constitute a plurality of insulating barriers of duplexer with above-mentioned a plurality of coil electrodes; The a plurality of connecting portions that connect above-mentioned a plurality of coil electrode respectively and have end area shape bigger than the other end area; And the surface and first outer electrode that is connected with above-mentioned coil and second outer electrode that are formed at above-mentioned duplexer, the coil electrode that is connected with above-mentioned first outer electrode is connected in the bigger side's of area of above-mentioned connecting portion end, the coil electrode that is connected with above-mentioned second outer electrode is connected in the less side's of area of above-mentioned connecting portion end, and the D.C. resistance of the coil electrode that is connected with above-mentioned first outer electrode is bigger than the D.C. resistance of the coil electrode that is connected with above-mentioned second outer electrode.
In the 3rd invention, the D.C. resistance of the coil electrode that is connected with above-mentioned first outer electrode can be by the electrode length decision of the position that is connected with this coil electrode from this first outer electrode to above-mentioned connecting portion, and the D.C. resistance of the coil electrode that is connected with above-mentioned second outer electrode can be by the electrode length decision of the position that is connected with this coil electrode from this second outer electrode to above-mentioned connecting portion.
According to the present invention, the position from being connected with this first outer electrode of the coil electrode that is connected with first outer electrode is bigger to the D.C. resistance of connecting portion than the position from being connected with this second outer electrode of the coil electrode that is connected with second outer electrode to the D.C. resistance of connecting portion.In addition, in the present invention, be connected with the bigger side's of area of connecting portion end at the coil electrode that is connected with first outer electrode.Therefore, in the present invention, can prevent to concentrate heating in the coupling part of coil electrode that is connected with first outer electrode and connecting portion.Consequently, can be suppressed at the boundary member generation broken string of coil electrode and connecting portion.
Description of drawings
Fig. 1 is the stereoscopic figure of the related laminated electronic component of an embodiment of the invention.
Fig. 2 is the exploded perspective view of the duplexer of laminated electronic component shown in Figure 1.
Fig. 3 is the perspective view of the laminated electronic component shown in Figure 1 of direction (LT face) observation from the side.
Fig. 4 is the figure of the coil electrode of the expression laminated electronic component that is used to test.
Fig. 5 is the figure of the coil electrode of the expression laminated electronic component that is used to test.
Fig. 6 is the figure of other examples that represents the coil electrode of laminated electronic component in the past.
Fig. 7 is the figure of the expression ceramic green sheet that is used to test.
Fig. 8 is the figure of the variation of expression coil electrode.
Fig. 9 is the perspective view of laminated electronic component in the past.
Figure 10 is the exploded perspective view of laminated electronic component in the past.
Label declaration
B, B1, B2, B3, B4, B5 via conductors
C, C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12 contact site
The L coil
T1, t2 end
1 laminated electronic component
2 duplexers
4,4a, 4b, 4c, 4d, 4e, 4f, 6,6a, 6b, 6c, 6d magnetic layer
8,8a, 8b, 8c, 8d, 8e, 8f coil electrode
10a, 10b lead division
12a, 12b outer electrode
Embodiment
The following describes related laminated electronic component of an embodiment of the invention and manufacture method thereof.This laminated electronic component for example can be used for inductor, impedance component (impedor), LC filter.Fig. 1 is the stereoscopic figure of laminated electronic component 1.Fig. 2 is the exploded perspective view of duplexer 2.Fig. 3 is the perspective view of the laminated electronic component 1 of direction observation from the side.Below, in the time of will forming laminated electronic component 1, the direction of laminated ceramic raw cook (ceramic green sheet) is defined as stacked direction.
(about the structure of laminated electronic component)
As shown in Figure 1, laminated electronic component 1 comprises: the rectangular-shaped duplexer 2 that comprises coil L in inside; And two outer electrode 12a, 12b being formed at the relative side (surface) of duplexer 2 and being connected with coil L.
Each coil electrode 8 is formed by the conductive material that Ag makes, and has the shape that an annular part is cut.In the present embodiment, coil electrode 8 has the shape of approximate " コ " font.In view of the above, each coil electrode 8 formation has the roughly electrode of the length of 3/4 circle.In addition, coil electrode 8 also can be formed as the noble metal of main component or their conductive materials such as alloy by Pd, Au, Pt etc.In addition, coil electrode 8 also can be the shape that a circle or an oval part are cut.The following describes the structure of each coil electrode 8a～8f.
Coil electrode 8a is formed among magnetic layer 4a～4f, be configured on the magnetic layer 4a of top side of stacked direction.Coil electrode 8a forms longlyer than coil electrode 8f.End at this coil electrode 8a forms lead division 10a, at the other end formation contact site C1 of this coil electrode 8a.Lead division 10a is connected with outer electrode 12a.Contact site C1 forms slightlyer than other parts of coil electrode 8a, is connected with via conductors B1 being easy to, and B1 forms as one with via conductors.
Coil electrode 8b is formed on the magnetic layer 4b.End at this coil electrode 8b forms contact site C2, at the other end formation contact site C3 of this coil electrode 8b.Contact site C2 forms slightlyer than other parts of coil electrode 8b, so that when stacked magnetic layer 4a and magnetic layer 4b, be easy to be connected with via conductors B1.In addition, contact site C3 forms slightlyer than other parts of coil electrode 8b, is connected with via conductors B2 being easy to, and B2 forms as one with via conductors.
Coil electrode 8c is formed on the magnetic layer 4c.End at this coil electrode 8c forms contact site C4, at the other end formation contact site C5 of this coil electrode 8c.Contact site C4 forms slightlyer than other parts of coil electrode 8c, so that when stacked magnetic layer 4b and magnetic layer 4c, be easy to be connected with via conductors B2.In addition, contact site C5 forms slightlyer than other parts of coil electrode 8c, is connected with via conductors B3 being easy to, and B3 forms as one with via conductors.
Coil electrode 8d is formed on the magnetic layer 4d.The shape of coil electrode 8d is that the center makes the shape of coil electrode 8b Rotate 180 degree identical with central point with magnetic layer 4b.End at this coil electrode 8d forms contact site C6, at the other end formation contact site C7 of this coil electrode 8d.Contact site C6 forms slightlyer than other parts of coil electrode 8d, so that be easy to be connected with via conductors B3 during with magnetic layer 4d at stacked magnetic layer 4c.In addition, contact site C7 forms slightlyer than other parts of coil electrode 8d, is connected with via conductors B4 being easy to, and B4 forms as one with via conductors.
Coil electrode 8e is formed on the magnetic layer 4e.The shape of coil electrode 8e is that the center makes the shape of coil electrode 8c Rotate 180 degree identical with central point with magnetic layer 4c.End at this coil electrode 8e forms contact site C8, at the other end formation contact site C9 of this coil electrode 8e.Contact site C8 forms slightlyer than other parts of coil electrode 8e, so that be easy to be connected with via conductors B4 during with magnetic layer 4e at stacked magnetic layer 4d.In addition, contact site C9 forms slightlyer than other parts of coil electrode 8e, is connected with via conductors B5 being easy to, and B5 forms as one with via conductors.
As previously discussed, in laminated electronic component 1, by the two kinds of tip electrodes (coil electrode 8a, 8f) that are positioned at the end and four kinds of targets in the middle of being positioned at (coil electrode 8b～8e) constitutes coil L.And, when adjusting the number of turn of coil L, between coil electrode 8a and coil electrode 8f, insert the suitable coil electrode 8 among coil electrode 8b～8e.At this moment, coil electrode 8f be positioned at coil electrode 8f directly over coil electrode 8 since contact site C relative to each other connect by via conductors B each other.That is, coil electrode 8c be positioned at coil electrode 8f directly over the time, use contact site C12.Coil electrode 8d be positioned at coil electrode 8f directly over the time, use contact site C11.Coil electrode 8e be positioned at coil electrode 8f directly over the time, use contact site C10.As mentioned above, even coil electrode 8f has the structure that among coil electrode 8c～8e any is arranged on directly over it, also can be connected with this coil electrode 8c～8e.
Next via conductors B is described.Via conductors B runs through magnetic layer 4 and form along the above-below direction of stacked direction, as shown in Figure 3, when the direction vertical with stacked direction observed, has the area shape bigger than the area of the other end t2 of an end t1.More specifically, it is bigger than the area of the end t2 of the downside that is positioned at stacked direction to be positioned at the area of end t 1 of upside of stacked direction.Below, the annexation of each via conductors B is described.
The end t1 of via conductors B1 is connected with coil electrode 8a, and the end t2 of via conductors B1 is connected with coil electrode 8b.The end t1 of via conductors B2 is connected with coil electrode 8b, and the end t2 of via conductors B2 is connected with coil electrode 8c.The end t1 of via conductors B3 is connected with coil electrode 8c, and the end t2 of via conductors B3 is connected with coil electrode 8d.The end t1 of via conductors B4 is connected with coil electrode 8d, and the end t2 of via conductors B4 is connected with coil electrode 8e.The end t1 of via conductors B5 is connected with coil electrode 8e, and the end t2 of via conductors B5 is connected with coil electrode 8f.
It is overlapping from the upside of stacked direction with the order of magnetic layer 6a, 6b, magnetic layer 4a～4f and magnetic layer 6c, the 6d of exploded perspective view shown in Figure 2, form duplexer 2, if the surface at duplexer 2 forms outer electrode 12a, 12b, the laminated electronic component 1 that then can obtain having structure shown in Figure 3.
In above such laminated electronic component, as shown in Figure 2, coil electrode 8a forms longlyer than coil electrode 8f.In view of the above, big from the position that coil electrode 8f is connected with outer electrode 12b from the position that coil electrode 8a is connected with outer electrode 12a to second D.C. resistance of via conductors B5 (the contact site C10 Fig. 2) to first D.C. resistance ratio of via conductors B1 (the contact site C1 Fig. 2).Said herein D.C. resistance is not the simple D.C. resistance from the front end of coil electrode to the rear end, but considers the D.C. resistance of reality of the position of connecting portion.
Herein, position that coil electrode 8a is connected with outer electrode 12a and coil electrode 8f and the position that outer electrode 12b is connected are lead division 10a, 10b exposes part for wire from duplexer 2.In addition, first D.C. resistance is meant that terminal of resistance measurement device and lead division 10a are exposed entire portion for wire from duplexer 2 to be connected, the another terminal of resistance measurement device is connected the D.C. resistance that obtains with contact site C1.Equally, second D.C. resistance be meant with terminal of resistance measurement device and lead division 10b from duplexer 2 expose that entire portion for wire is connected, another terminal and contact site C10, C11 with the resistance measurement device, C12 (the contact site C10 Fig. 2) be connected the D.C. resistance that obtains.
(about the manufacture method of laminated electronic component)
The manufacture method of laminated electronic component 1 is described below with reference to Fig. 2.In Shuo Ming the manufacture method, use the stacked legal system of sheet material to make a laminated electronic component 1 below.
At first, should become being produced as follows of ceramic green sheet of magnetic layer 4,6.Will be with iron oxide (Fe
2O
3) for 48.0mol%, zinc oxide (ZnO) be 25.0mol%, nickel oxide (NiO) for 18.0mol%, cupric oxide (CuO) for each material of the ratio weighing of 9.0mol% drops into ball mill as raw material, carry out the wet method stirring.With the mixture crushed after being dried that obtains, with the powder that obtains 750 ℃ of following pre-burnings 1 hour.After the preburning powder that obtains carried out waterproof pulverization with ball mill, dry back was broken, obtains the ferrite ceramics powder.
This ferrite ceramics powder is added bond (vinyl acetate, water-soluble acrylic etc.), plasticizer, wetting agent, dispersant, mix, carry out deaeration by decompression afterwards with ball mill.The skill in using a kitchen knife in cookery is scraped in the ceramic size use that obtains form sheet, and make its drying, produce the ceramic green sheet of the thickness (for example 35 μ m) of expectation.
Form via conductors B at the ceramic green sheet that should become magnetic layer 4a～4e.Particularly, use laser beam to form through hole at ceramic green sheet.Herein, laser beam passes through in the ceramic green sheet while decaying.Therefore, through hole has the less conical in shape of peristome area big by the peristome area of a side of laser beam irradiation, opposition side.Next, use methods such as printing coating to fill the conductive paste of Ag, Pd, Cu, Au or their alloy etc. at this through hole.In view of the above, form as shown in Figure 3, at the via conductors B of the area that when the direction vertical with stacked direction observed, has the end t1 shape bigger than the area of the other end t2.
Next, by on the ceramic green sheet that should become magnetic layer 4a～4f, being coated with the conductive paste as main component such as Ag, Pd, Cu, Au or their alloy, form coil electrode 8a～8f with methods such as silk screen print method or photoetching processes.Specific as follows.
On the ceramic green sheet that should become magnetic layer 4a, the interarea formation coil electrode 8a in the end of via conductors B1 t1 side makes contact site C1 and via conductors B1 overlapping.On the ceramic green sheet that should become magnetic layer 4b～4e, the interarea formation coil electrode 8b～8e in the end of via conductors B t1 side makes contact site C and via conductors B overlapping.In addition, on the ceramic green sheet that should become the magnetic layer 4f that does not form via conductors B, form coil electrode 8f.In addition, coil electrode 8 and via conductors B also can be formed at ceramic green sheet simultaneously.
Next, stacked each ceramic green sheet forms the duplexer 2 that does not burn till.Particularly, configuration should become the ceramic green sheet of magnetic layer 6d.Next, on the ceramic green sheet that should become magnetic layer 6d, carry out to become the configuration and the pre-crimping of the ceramic green sheet of magnetic layer 6c.Afterwards, the ceramic green sheet becoming magnetic layer 4a～4f, 6a, 6b also carries out pre-crimping with same step.In view of the above, form the duplexer 2 that does not burn till.At this duplexer that does not burn till 2, carry out formal crimping by hydrostatic machine etc.More than, based on Fig. 2 the manufacture method of duplexer 2 has been described, but in fact,, has used female raw cook as ceramic green sheet in order to obtain a plurality of duplexers, be about to that it is divided into the cutting action that duplexer is one by one used in that formal crimping is laggard.
Next, carrying out the unsticking mixture at duplexer 2 handles and burns till.Firing temperature for example is 900 ℃.The duplexer 2 that in view of the above, can obtain burning till.On the surface of duplexer 2, for example using coating of method such as infusion process and burn-back main component is the electrode paste of silver, forms outer electrode 12a, 12b.As shown in Figure 1, outer electrode 12a, 12b are formed at the left and right sides end face of duplexer 2.Lead division 10a, the 10b of coil L is electrically connected with outer electrode 12a, 12b respectively.
At last, externally nickel plating (Ni)/zinc-plated (Sn) implemented on the surface of electrode 12a, 12b.Through above operation, finish laminated electronic component shown in Figure 11.
(effect)
As shown above, if adopt laminated electronic component 1, as described below shown in, can prevent the broken string between via conductors B and the coil electrode 8.Particularly, in Fig. 9 and laminated electronic component in the past 100 shown in Figure 10, be connected with the less side's of area of via conductors B5 end at coil electrode 108f.Coil electrode 108f is owing to form longlyer than coil electrode 108a, so have the D.C. resistance bigger than coil electrode 108a, when flowing through electric current in coil, caloric value is big.If in the less side's of area of the bigger coil electrode 108f connecting through hole conductor B5 of such caloric value end, then concentrate in the coupling part of via conductors B5 and coil electrode 108f especially and generate heat.Consequently, the connecting portion branch at via conductors B5 and coil electrode 108f produces broken string.
Therefore, as shown in Figures 2 and 3, in laminated electronic component 1, in coil electrode 8a, 8f, for from the position that is connected with outer electrode 12 to the bigger side's of D.C. resistance of via conductors B coil electrode 8a, the end t1 of connecting through hole conductor B1.This end t1 has the area bigger than end t2.Therefore, in laminated electronic component 1, compare with laminated electronic component 100, heating is concentrated in the coupling part that can be suppressed at coil electrode 8a and via conductors B1.Consequently, can be suppressed at the boundary member generation broken string of coil electrode 8a and through hole electrode B1.
The artificial further definite above-mentioned effect of the present patent application is carried out following electrostatic storage deflection (ESD) test, estimates the broken string generation rate.Fig. 4 and Fig. 5 are the figure of the coil electrode of the expression laminated electronic component that is used to test.In test, use first preproduction and second preproduction.First preproduction is equivalent to laminated electronic component 100 in the past.Particularly, use coil electrode 108a shown in Figure 4, as the coil electrode 108a that is connected with first outer electrode.This coil electrode 108a is connected with via conductors B1 at the G place.That is, the D.C. resistance of undermost coil electrode 108f is bigger than the coil electrode 108a of the superiors.In addition, second preproduction is equivalent to the related laminated electronic component of present embodiment 1.Particularly, use coil electrode 8f shown in Figure 5, as the coil electrode 8f that is connected with second outer electrode.This coil electrode 8f is connected with via conductors B5 at the H place.That is, the D.C. resistance of the coil electrode 8a of the superiors is bigger than undermost coil electrode 8f.Enumerate the detail specifications of first preproduction and second preproduction below.
Size: 2.50mm * 2.00mm * 1.00mm
The material of magnetic layer: Ni-Cu-Zn ferrite
The material of outer electrode: nickel plating-Xi on the silver electrode (Ni-Sn)
The material of coil electrode: silver
The length of coil electrode: 7/8 circle
The number of turn of coil: 12.5 circles
Manufacture method: sheet material layered manner
Make a plurality of first preproductions and second preproduction respectively, wherein, extract 100 conditions that satisfy Rdc 〉=average+3 σ respectively (wherein, on average be meant the mean value of a plurality of Rdc) preproduction, for this each 100 first preproductions and second preproduction, respectively apply the voltage of 30 30kV respectively in positive negative direction with 0.1 second interval.The result who obtains in view of the above is as shown in table 1.
Table 1
| First preproduction | Second preproduction | |
| The broken string generation rate | 16％(16/100) | 0％(0/100) |
As shown above, in first preproduction, in a part of preproduction, produce broken string, but in second preproduction, do not produce broken string fully.So as can be known, in the related laminated electronic component 1 of present embodiment, the generation that can suppress to break.
In addition, if adopt the related laminated electronic component 1 of present embodiment, as described below shown in, can suppress via conductors B produce form bad.Fig. 6 is the figure of other examples that represents the coil electrode 108a of laminated electronic component 100 in the past.
In laminated electronic component in the past 100 shown in Figure 10, when changing the quantity of coil electrode 108 in order to change coil turn, can use any among the coil electrode 108a shown in Fig. 6 (a), Fig. 6 (b) or Fig. 6 (c).In the coil electrode 108a shown in Fig. 6 (a) and Fig. 6 (b), the way forms via conductors B1 therein.This be for, even coil electrode 108c or coil electrode 108d be positioned at coil electrode 108a under the time, coil electrode 108a also can be connected with coil electrode 108c or coil electrode 108d.
Yet in the coil-conductor 108a that is formed with via conductors B1 midway of the coil-conductor shown in Fig. 6 (a) and Fig. 6 (b), it is bad that via conductors B1 might produce formation.Particularly, in the coil-conductor 108a shown in Fig. 6 (a) and Fig. 6 (b), because via conductors B1 is formed at coil-conductor midway, so the wiring of coil electrode 108a is extended towards both direction from via conductors B1.Therefore, when using silk screen print method to form coil-conductor 108a, conductive paste can be used to form the wiring of coil electrode 108a, can't provide enough conductive pastes to via conductors B1.Consequently, in the coil-conductor 108a shown in Fig. 6 (a) and Fig. 6 (b), the formation that might produce via conductors B1 is bad.
Relative with it, in the related laminated electronic component 1 of present embodiment, do not form via conductors B at the coil electrode 8f corresponding with coil electrode 108a.Therefore, in laminated electronic component 1, all via conductors B are formed at the end of coil electrode 8.So, in laminated electronic component 1, be difficult to produce the bad problem of formation of via conductors B.
The artificial further definite above-mentioned effect of the present patent application is carried out following experiment, estimates the formation fraction defective of via conductors.Fig. 7 is the figure of the expression ceramic green sheet that is used to test.In experiment, use silk screen printing at three kinds of ceramic green sheet coating conductive pastes, form coil electrode, check the formation fraction defective of via conductors.As three kinds of ceramic green sheets, use shown in Fig. 7 (a), be the ceramic green sheet that position X has through hole in the end of coil electrode; Shown in Fig. 7 (b), be the ceramic green sheet that position Y has through hole at coil electrode midway; And shown in Fig. 7 (c), be the ceramic green sheet that position Z has through hole at coil electrode midway.
In experiment, the ceramic green sheet that has the 90mm * 90mm of through hole by silk screen printing at position X forms 945 coil electrodes.In addition, 945 coil electrodes of ceramic green sheet formation that have the 90mm * 90mm of through hole by silk screen printing at position Y.In addition, 945 coil electrodes of ceramic green sheet formation that have the 90mm * 90mm of through hole by silk screen printing at position Z.And, even via conductors produces and forms when bad in 945 coil electrodes, think that also to produce the formation of via conductors at this ceramic green sheet bad.Each 200 of three kinds of ceramic green sheets are carried out such operation respectively.Table 2 expression experimental result.
Table 2
| The position of via conductors | X | Y | Z |
| The formation fraction defective of via conductors | 0％(0/200) | 14％(28/200) | 25％(50/200) |
As shown in table 2, shown in Fig. 7 (a), be formed with in the ceramic green sheet of through hole in the end of coil electrode, the formation fraction defective of via conductors is 0%.On the other hand, in the ceramic green sheet that is formed with through hole midway shown in Fig. 7 (b) and Fig. 7 (c), at coil electrode, the formation fraction defective of via conductors is 14% and 25%.So as can be known, be arranged on comparing of coil electrode midway with via conductors, the end that via conductors is arranged on coil electrode can reduce the formation fraction defective of via conductors.Promptly as can be known, in laminated electronic component 1, because via conductors B only is formed at the end of coil electrode 8, so it is bad to be difficult to produce the formation of via conductors B.
In addition, if adopt laminated electronic component 1, magnetic layer 4 that can be by less kind (=be formed with the magnetic layer 4 of coil electrode 108) obtains built-in laminated electronic component with coil L of the multiple number of turn.Describe in detail below.
In laminated electronic component in the past 100 shown in Figure 10, the coil electrode 108a and the via conductors B1 that have contact site at a plurality of positions are integrally formed at magnetic layer 104a.Therefore, when changing the quantity of coil electrode 108 for the number of turn that changes coil, be positioned at coil electrode 108a under the position of contact site of coil electrode 108 also can change.Therefore, as shown in Figure 6, in laminated electronic component 100, need prepare the coil electrode 108a of the different a plurality of patterns in the position of via conductors B1 in advance.Therefore, in laminated electronic component 100 in the past, need the multiple coil electrode 108 of management.Particularly, in laminated electronic component 100, need eight kinds of coil electrodes 108 altogether of management three kinds of coil electrode 108a, coil electrode 108b～coil electrode 108e and coil electrode 108f.
On the other hand, in laminated electronic component 1, the coil electrode 8f that has contact site C10, C11, C12 at a plurality of positions does not form via conductors B.Therefore, in order to change the number of turn of coil L, only need between coil electrode 8a and coil electrode 8f, to insert coil electrode 8b～8e and get final product.That is, needn't design the position that changes via conductors B, just can connecting coil electrode 8f and be positioned at this coil electrode 8f directly over coil electrode 8.As mentioned above, coil electrode 8f only needs a kind of getting final product.So in laminated electronic component 1, six kinds of coil electrodes 8 altogether of management coil electrode 8a～8f get final product.Consequently, if adopt laminated electronic component 1, then can obtain built-in laminated electronic component by the coil electrode 8 of less kind with coil L of the multiple number of turn.
(other execution modes)
In addition, laminated electronic component involved in the present invention is not limited to the respective embodiments described above, can change in the scope of its main points.For example, in Fig. 2, contact site C forms slightlyer than other parts of coil electrode 8, forms slightlyer but contact site C is also nonessential.For example, shown in the variation of coil electrode 8f as shown in Figure 8, when the line width of coil electrode 8f was enough thick, contact site C needn't form slightlyer than other parts of coil electrode 8c.
The situation of the coil electrode 8f that uses Fig. 8 is described herein.The coil electrode 8f of Fig. 8 is different with the coil electrode 8f of Fig. 2, does not have clear and definite contact site C.Therefore, only by observing coil electrode 8f individuality, being difficult to differentiate coil electrode 8f can be connected with via conductors B5 at a plurality of positions.
Yet, part (for example some M, the N of Fig. 8) outside the end of the lead division 10b (position that is connected with outer electrode 12b) of coil electrode 8f and lead division 10b opposition side is when being connected with via conductors B5, from the point that is connected with via conductors B5 to the end that does not form lead division 10b one side, think that via conductors B5 can connect.Therefore, when in the end that does not form lead division 10b one side except coil electrode 8f via conductors B5 being connected with coil electrode 8f, being judged as coil electrode 8f can be connected with via conductors B5 at a plurality of positions.
In addition, in laminated electronic component 1, be to use the coil electrode 8 of 3/4 circle, but for example also can use the coil electrode 8 of 5/6 circle or the coil electrode 8 of 7/8 circle.
In addition, in the manufacture method of laminated electronic component 1, be to use the stacked legal system of sheet material to make laminated electronic component 1, but the method for making this laminated electronic component 1 is not limited thereto.For example, also can use print process to make laminated electronic component 1.
In addition, as shown in Figure 2, in laminated electronic component 1, by making coil electrode 8a form longlyer, make from the position that coil electrode 8a is connected with outer electrode 12a big from the position that coil electrode 8f is connected with outer electrode 12b to second D.C. resistance of via conductors B5 to first D.C. resistance, the ratio of via conductors B1 than coil electrode 8f.Yet, first D.C. resistance method bigger than second D.C. resistance is not limited thereto.For example, also can realize by live width or the thickness of adjusting coil electrode 8a and coil electrode 8f.
Industrial practicality
The present invention is useful for laminated electronic component and manufacture method thereof, and is particularly better on the broken string this point that can prevent between via conductors and the coil electrode.
Claims (14)
1. a laminated electronic component is characterized in that,
Comprise: a plurality of coil electrodes that constitute coil;
Stacked and constitute a plurality of insulating barriers of duplexer with described a plurality of coil electrodes;
The connecting portion that connects described a plurality of coil electrode and have end area shape bigger than the other end area; And
Be formed at surface and first outer electrode that is connected with described coil and second outer electrode of described duplexer,
The coil electrode that is connected with described first outer electrode is connected in a described end of described connecting portion,
The coil electrode that is connected with described second outer electrode is connected in described another end of described connecting portion,
Be connected in described first outer electrode coil electrode from the position that is connected with this first outer electrode to described connecting portion till D.C. resistance greater than the coil electrode that is connected in described second outer electrode from the position that is connected with this second outer electrode to described connecting portion till D.C. resistance.
2. laminated electronic component as claimed in claim 1 is characterized in that,
The coil electrode that is connected with described second outer electrode can be connected with described connecting portion at a plurality of positions.
3. laminated electronic component as claimed in claim 2 is characterized in that,
The coil electrode that is connected with described second outer electrode has the part shape thicker than other parts that can be connected with described connecting portion.
4. laminated electronic component as claimed in claim 2 is characterized in that,
Described connecting portion is the part that is connected in outside coil electrode and the position that this second outer electrode is connected of described second outer electrode, and is connected in the part outside the end of opposition side of this connecting portion.
5. as each described laminated electronic component in the claim 1 to 4, it is characterized in that,
The coil electrode and the described connecting portion that are connected with described first outer electrode are integrally formed at described insulating barrier.
6. as each described laminated electronic component in the claim 1 to 5, it is characterized in that,
Do not form described connecting portion at the described insulating barrier that is formed with the coil electrode that is connected with described second outer electrode.
7. as each described laminated electronic component in the claim 1 to 6, it is characterized in that,
The coil electrode that is connected with described second outer electrode is connected in described the other end of described connecting portion.
8. the manufacture method of a laminated electronic component is used to make by being built-in with coil and forming the laminated electronic component that the duplexer of first outer electrode and second outer electrode forms on the surface, it is characterized in that,
Comprise:
The connecting portion that will have end area shape bigger than the other end area is formed at the operation of insulating barrier;
First coil electrode is formed at described insulating barrier, makes described first coil electrode that is connected with described first outer electrode be connected in the operation of a described end of described connecting portion;
To be formed at the operation of insulating barrier with second coil electrode that described second outer electrode is connected; And
Stacked be formed with the insulating barrier of this first coil electrode and be formed with the insulating barrier of this second coil electrode and form described duplexer, make described first coil electrode from the position that is connected with this first outer electrode to described connecting portion till D.C. resistance greater than described second coil electrode from the position that is connected with this second outer electrode to described connecting portion till the operation of D.C. resistance.
9. the manufacture method of laminated electronic component as claimed in claim 8 is characterized in that,
In the operation that forms described second coil electrode, form described second coil electrode at the described insulating barrier that does not form described connecting portion.
10. as the manufacture method of each described laminated electronic component in claim 8 or 9, it is characterized in that,
In the operation that forms described second coil electrode, described second coil electrode is formed the shape that can be connected with described connecting portion at a plurality of positions.
11. the manufacture method of laminated electronic component as claimed in claim 10 is characterized in that,
In forming the operation of described second coil electrode, form described second coil electrode, it is thicker than other parts to make it possible to the part that is connected with described connecting portion.
12. the manufacture method of laminated electronic component as claimed in claim 10 is characterized in that,
Described connecting portion is the part that is connected in outside described coil electrode and the position that described second outer electrode is connected of described second outer electrode, and in the operation that forms described duplexer, stacked described insulating barrier makes the part outside its end that is connected in this connecting portion opposition side.
13. a laminated electronic component is characterized in that,
Comprise:
Constitute a plurality of coil electrodes of coil;
Stacked and constitute a plurality of insulating barriers of duplexer with described a plurality of coil electrodes;
Connect described a plurality of coil electrode respectively and have a plurality of connecting portions of an end area greater than the shape of the other end area; And
Be formed at surface and first outer electrode that is connected with described coil and second outer electrode of described duplexer,
The coil electrode that is connected with described first outer electrode is connected in the bigger side's of area of described connecting portion end,
The coil electrode that is connected with described second outer electrode is connected in the less side's of area of described connecting portion end,
The D.C. resistance of the coil electrode that is connected with described first outer electrode is greater than the D.C. resistance of the coil electrode that is connected with described second outer electrode.
14. laminated electronic component as claimed in claim 13 is characterized in that,
The D.C. resistance of the coil electrode that is connected with described first outer electrode is decided by the electrode length of the position that is connected with this coil electrode from this first outer electrode till the described connecting portion,
The D.C. resistance of the coil electrode that is connected with described second outer electrode is decided by the electrode length of the position that is connected with this coil electrode from this second outer electrode till the described connecting portion.
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| JP2009023207 | 2009-02-04 | ||
| JP2009023207A JP5262775B2 (en) | 2008-03-18 | 2009-02-04 | Multilayer electronic component and manufacturing method thereof |
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| CN105742041A (en) * | 2014-12-24 | 2016-07-06 | 三星电机株式会社 | Multilayer Electronic Component And Method Of Manufacturing The Same |
| CN109274223A (en) * | 2013-12-18 | 2019-01-25 | 株式会社阿斯特 | Coil manufacturing method |
| CN109698063A (en) * | 2017-10-20 | 2019-04-30 | Tdk株式会社 | Multilayer coil component and its manufacturing method |
| US11955850B2 (en) | 2013-12-18 | 2024-04-09 | Aster Co., Ltd. | Cold pressure welding apparatus, coil manufacturing apparatus, coil, and method of manufacturing the same |
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| CN102308344B (en) * | 2009-02-10 | 2013-10-16 | 株式会社村田制作所 | Electronic component |
| CN103035396A (en) * | 2011-09-30 | 2013-04-10 | 钰铠科技股份有限公司 | Lamination type inductance manufacturing process |
| JP7276202B2 (en) * | 2020-03-05 | 2023-05-18 | 株式会社村田製作所 | inductor components |
| JP7367713B2 (en) * | 2021-02-24 | 2023-10-24 | 株式会社村田製作所 | inductor parts |
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| JPH0737720A (en) * | 1993-07-21 | 1995-02-07 | Hitachi Metals Ltd | Chip component and its usage |
| JP3788074B2 (en) * | 1998-11-10 | 2006-06-21 | 株式会社村田製作所 | Chip coil and manufacturing method thereof |
| JP3446681B2 (en) * | 1999-09-28 | 2003-09-16 | 株式会社村田製作所 | Multilayer inductor array |
| EP1564761A4 (en) * | 2003-09-01 | 2010-03-31 | Murata Manufacturing Co | Laminated coil component and method of producing the same |
| JP4211591B2 (en) * | 2003-12-05 | 2009-01-21 | 株式会社村田製作所 | Method for manufacturing multilayer electronic component and multilayer electronic component |
| EP1708209A4 (en) * | 2004-01-23 | 2014-11-12 | Murata Manufacturing Co | Chip inductor and process for producing the same |
| US7719398B2 (en) * | 2005-01-07 | 2010-05-18 | Murata Manufacturing Co., Ltd. | Laminated coil |
| JP2007165407A (en) * | 2005-12-09 | 2007-06-28 | Murata Mfg Co Ltd | Choke coil |
| KR101372963B1 (en) * | 2006-01-31 | 2014-03-11 | 히타치 긴조쿠 가부시키가이샤 | Laminated component and module using same |
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Cited By (8)
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|---|---|---|---|---|
| CN109274223A (en) * | 2013-12-18 | 2019-01-25 | 株式会社阿斯特 | Coil manufacturing method |
| US10742097B2 (en) | 2013-12-18 | 2020-08-11 | Aster Co., Ltd. | Cold pressure welding apparatus, coil manufacturing apparatus, coil, and method of manufacturing the same |
| CN109274223B (en) * | 2013-12-18 | 2021-12-03 | 株式会社阿斯特 | Coil manufacturing method |
| US11804757B2 (en) | 2013-12-18 | 2023-10-31 | Aster Co., Ltd. | Cold pressure welding apparatus, coil manufacturing apparatus, coil, and method of manufacturing the same |
| US11955850B2 (en) | 2013-12-18 | 2024-04-09 | Aster Co., Ltd. | Cold pressure welding apparatus, coil manufacturing apparatus, coil, and method of manufacturing the same |
| CN105742041A (en) * | 2014-12-24 | 2016-07-06 | 三星电机株式会社 | Multilayer Electronic Component And Method Of Manufacturing The Same |
| CN109698063A (en) * | 2017-10-20 | 2019-04-30 | Tdk株式会社 | Multilayer coil component and its manufacturing method |
| US11189413B2 (en) | 2017-10-20 | 2021-11-30 | Tdk Corporation | Multilayer coil component and method for producing the same |
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| Publication number | Publication date |
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| JP2009260266A (en) | 2009-11-05 |
| TWI387978B (en) | 2013-03-01 |
| CN101572161B (en) | 2014-07-02 |
| JP5262775B2 (en) | 2013-08-14 |
| TW200943329A (en) | 2009-10-16 |
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