JP2008052721A5 - - Google Patents

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Publication number
JP2008052721A5
JP2008052721A5 JP2007189189A JP2007189189A JP2008052721A5 JP 2008052721 A5 JP2008052721 A5 JP 2008052721A5 JP 2007189189 A JP2007189189 A JP 2007189189A JP 2007189189 A JP2007189189 A JP 2007189189A JP 2008052721 A5 JP2008052721 A5 JP 2008052721A5
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JP
Japan
Prior art keywords
recess
electrically connected
antenna
semiconductor chip
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007189189A
Other languages
English (en)
Japanese (ja)
Other versions
JP5078478B2 (ja
JP2008052721A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007189189A priority Critical patent/JP5078478B2/ja
Priority claimed from JP2007189189A external-priority patent/JP5078478B2/ja
Publication of JP2008052721A publication Critical patent/JP2008052721A/ja
Publication of JP2008052721A5 publication Critical patent/JP2008052721A5/ja
Application granted granted Critical
Publication of JP5078478B2 publication Critical patent/JP5078478B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007189189A 2006-07-28 2007-07-20 半導体装置 Expired - Fee Related JP5078478B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007189189A JP5078478B2 (ja) 2006-07-28 2007-07-20 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006206798 2006-07-28
JP2006206798 2006-07-28
JP2007189189A JP5078478B2 (ja) 2006-07-28 2007-07-20 半導体装置

Publications (3)

Publication Number Publication Date
JP2008052721A JP2008052721A (ja) 2008-03-06
JP2008052721A5 true JP2008052721A5 (enExample) 2010-08-26
JP5078478B2 JP5078478B2 (ja) 2012-11-21

Family

ID=39236672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007189189A Expired - Fee Related JP5078478B2 (ja) 2006-07-28 2007-07-20 半導体装置

Country Status (1)

Country Link
JP (1) JP5078478B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5029253B2 (ja) * 2007-09-26 2012-09-19 株式会社村田製作所 無線ｉｃデバイス
JP5029252B2 (ja) * 2007-09-26 2012-09-19 株式会社村田製作所 無線ｉｃデバイス
JP5637004B2 (ja) * 2011-02-23 2014-12-10 株式会社村田製作所 半導体集積回路モジュール、無線通信モジュール及び無線通信デバイス
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
WO2019051191A1 (en) * 2017-09-07 2019-03-14 Composecure, Llc TRANSACTION CARD WITH INTEGRATED ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING
JP6306258B1 (ja) * 2017-09-20 2018-04-04 誠敏 中野 Ｉｃタグシステム
PT4109337T (pt) 2017-10-18 2024-11-13 Composecure Llc Cartão de transação de metal, cerâmica ou revestido a cerâmica com janela ou padrão de janela e retroiluminação
JP6362759B1 (ja) * 2017-12-19 2018-07-25 誠敏 中野 Ｉｃタグ
EP3609066B1 (en) * 2018-08-07 2021-02-24 Mahle International GmbH Electric power inverter
CN111952733B (zh) * 2020-07-03 2023-02-03 深圳捷豹电波科技有限公司 天线板及应用其的无线充电与通讯模块

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1185938A (ja) * 1997-07-17 1999-03-30 Denso Corp Ｉｃカード

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