JP2006121087A5 - - Google Patents

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Publication number
JP2006121087A5
JP2006121087A5 JP2005303551A JP2005303551A JP2006121087A5 JP 2006121087 A5 JP2006121087 A5 JP 2006121087A5 JP 2005303551 A JP2005303551 A JP 2005303551A JP 2005303551 A JP2005303551 A JP 2005303551A JP 2006121087 A5 JP2006121087 A5 JP 2006121087A5
Authority
JP
Japan
Prior art keywords
dielectric
metal foil
resistive
layer
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005303551A
Other languages
English (en)
Japanese (ja)
Other versions
JP4500759B2 (ja
JP2006121087A (ja
Filing date
Publication date
Priority claimed from US10/967,781 external-priority patent/US7382627B2/en
Application filed filed Critical
Publication of JP2006121087A publication Critical patent/JP2006121087A/ja
Publication of JP2006121087A5 publication Critical patent/JP2006121087A5/ja
Application granted granted Critical
Publication of JP4500759B2 publication Critical patent/JP4500759B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005303551A 2004-10-18 2005-10-18 容量性／抵抗性デバイス、高誘電率有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法 Expired - Fee Related JP4500759B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/967,781 US7382627B2 (en) 2004-10-18 2004-10-18 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof

Publications (3)

Publication Number Publication Date
JP2006121087A JP2006121087A (ja) 2006-05-11
JP2006121087A5 true JP2006121087A5 (enExample) 2008-12-04
JP4500759B2 JP4500759B2 (ja) 2010-07-14

Family

ID=35730635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005303551A Expired - Fee Related JP4500759B2 (ja) 2004-10-18 2005-10-18 容量性／抵抗性デバイス、高誘電率有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法

Country Status (6)

Country Link
US (1) US7382627B2 (enExample)
EP (1) EP1648207B1 (enExample)
JP (1) JP4500759B2 (enExample)
KR (1) KR100729703B1 (enExample)
CN (1) CN1783377A (enExample)
TW (1) TWI397354B (enExample)

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CN101090599B (zh) * 2006-06-16 2010-05-26 鸿富锦精密工业（深圳）有限公司 电路板
US7808797B2 (en) * 2006-12-11 2010-10-05 Intel Corporation Microelectronic substrate including embedded components and spacer layer and method of forming same
DE602007006238D1 (de) * 2006-12-21 2010-06-10 Cardiac Pacemakers Inc Festkörper-impulstherapiekondensator
US7672113B2 (en) * 2007-09-14 2010-03-02 Oak-Mitsui, Inc. Polymer-ceramic composites with excellent TCC
US8957531B2 (en) 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
CN105047642B (zh) * 2015-08-12 2024-01-19 深圳市槟城电子股份有限公司 一种端口防护电路集成封装件
CN105047411A (zh) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 一种电阻和电容串连的组件及其制作方法
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
JP7438901B2 (ja) * 2020-09-11 2024-02-27 キオクシア株式会社 スイッチング回路および記憶装置
CN117457395A (zh) 2022-07-19 2024-01-26 国巨电子（中国）有限公司 薄膜晶片电阻电容及其制作方法

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