JP2006121087A5 - - Google Patents
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- Publication number
- JP2006121087A5 JP2006121087A5 JP2005303551A JP2005303551A JP2006121087A5 JP 2006121087 A5 JP2006121087 A5 JP 2006121087A5 JP 2005303551 A JP2005303551 A JP 2005303551A JP 2005303551 A JP2005303551 A JP 2005303551A JP 2006121087 A5 JP2006121087 A5 JP 2006121087A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- metal foil
- resistive
- layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims 9
- 229910052751 metal Inorganic materials 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 239000000843 powder Substances 0.000 claims 3
- 239000003990 capacitor Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims 1
- 229910002113 barium titanate Inorganic materials 0.000 claims 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical group [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims 1
- 229910052746 lanthanum Inorganic materials 0.000 claims 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/967,781 US7382627B2 (en) | 2004-10-18 | 2004-10-18 | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006121087A JP2006121087A (ja) | 2006-05-11 |
| JP2006121087A5 true JP2006121087A5 (enExample) | 2008-12-04 |
| JP4500759B2 JP4500759B2 (ja) | 2010-07-14 |
Family
ID=35730635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005303551A Expired - Lifetime JP4500759B2 (ja) | 2004-10-18 | 2005-10-18 | 容量性／抵抗性デバイス、高誘電率有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7382627B2 (enExample) |
| EP (1) | EP1648207B1 (enExample) |
| JP (1) | JP4500759B2 (enExample) |
| KR (1) | KR100729703B1 (enExample) |
| CN (1) | CN1783377A (enExample) |
| TW (1) | TWI397354B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7596842B2 (en) | 2005-02-22 | 2009-10-06 | Oak-Mitsui Inc. | Method of making multilayered construction for use in resistors and capacitors |
| US20060286696A1 (en) * | 2005-06-21 | 2006-12-21 | Peiffer Joel S | Passive electrical article |
| CN101090599B (zh) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业（深圳）有限公司 | 电路板 |
| US7808797B2 (en) * | 2006-12-11 | 2010-10-05 | Intel Corporation | Microelectronic substrate including embedded components and spacer layer and method of forming same |
| JP5025733B2 (ja) * | 2006-12-21 | 2012-09-12 | カーディアック ペースメイカーズ， インコーポレイテッド | ソリッド・ステート・パルス治療コンデンサ及びその形成方法 |
| US7672113B2 (en) * | 2007-09-14 | 2010-03-02 | Oak-Mitsui, Inc. | Polymer-ceramic composites with excellent TCC |
| US8957531B2 (en) * | 2011-10-20 | 2015-02-17 | International Business Machines Corporation | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity |
| CN105047642B (zh) * | 2015-08-12 | 2024-01-19 | 深圳市槟城电子股份有限公司 | 一种端口防护电路集成封装件 |
| CN105047411A (zh) * | 2015-08-12 | 2015-11-11 | 深圳市槟城电子有限公司 | 一种电阻和电容串连的组件及其制作方法 |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| JP7438901B2 (ja) * | 2020-09-11 | 2024-02-27 | キオクシア株式会社 | スイッチング回路および記憶装置 |
| CN117457395A (zh) | 2022-07-19 | 2024-01-26 | 国巨电子（中国）有限公司 | 薄膜晶片电阻电容及其制作方法 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3934119A (en) * | 1974-09-17 | 1976-01-20 | Texas Instruments Incorporated | Electrical resistance heaters |
| US4377652A (en) * | 1978-02-17 | 1983-03-22 | Asahi Kasei Kogyo Kabushiki Kaisha | Polyamide-imide compositions and articles for electrical use prepared therefrom |
| US4410867A (en) * | 1978-12-28 | 1983-10-18 | Western Electric Company, Inc. | Alpha tantalum thin film circuit device |
| US4399417A (en) * | 1980-06-06 | 1983-08-16 | Bell Telephone Laboratories, Incorporated | Integrated CRC filter circuit |
| US4407883A (en) * | 1982-03-03 | 1983-10-04 | Uop Inc. | Laminates for printed circuit boards |
| JPS58190091A (ja) * | 1982-04-30 | 1983-11-05 | 宇部興産株式会社 | フレキシブル配線基板の製造方法 |
| JPS60113993A (ja) * | 1983-11-25 | 1985-06-20 | 三菱電機株式会社 | 多層回路基板の製造方法 |
| US5093036A (en) * | 1988-09-20 | 1992-03-03 | Raychem Corporation | Conductive polymer composition |
| JP3019541B2 (ja) * | 1990-11-22 | 2000-03-13 | 株式会社村田製作所 | コンデンサ内蔵型配線基板およびその製造方法 |
| JPH0548271A (ja) * | 1991-08-12 | 1993-02-26 | Murata Mfg Co Ltd | 機能性多層回路基板 |
| JPH0565456A (ja) * | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
| JPH05152111A (ja) * | 1991-11-28 | 1993-06-18 | Rohm Co Ltd | チツプ型複合部品 |
| DE69305942T2 (de) * | 1992-09-15 | 1997-03-13 | Du Pont | Zusammensetzung für einen Polymer-Dickschichtwiderstand |
| US6111005A (en) * | 1993-07-30 | 2000-08-29 | Diemat, Inc. | Polymeric adhesive paste |
| US6140402A (en) * | 1993-07-30 | 2000-10-31 | Diemat, Inc. | Polymeric adhesive paste |
| JP3117175B2 (ja) | 1994-02-09 | 2000-12-11 | アルプス電気株式会社 | 抵抗体 |
| TW301843B (en) * | 1994-11-15 | 1997-04-01 | Ibm | Electrically conductive paste and composite and their use as an electrically conductive connector |
| TW367621B (en) * | 1995-02-27 | 1999-08-21 | Nxp Bv | Electronic component comprising a thin-film structure with passive elements |
| JPH08306503A (ja) * | 1995-05-11 | 1996-11-22 | Rohm Co Ltd | チップ状電子部品 |
| JPH0992983A (ja) * | 1995-07-17 | 1997-04-04 | Sumitomo Kinzoku Electro Device:Kk | セラミック多層基板の製造方法 |
| US5699224A (en) * | 1995-10-25 | 1997-12-16 | Rohm Co., Ltd. | Thick-film capacitor and chip-type composite electronic component utilizing the same |
| JPH09186004A (ja) * | 1995-12-28 | 1997-07-15 | Kyocera Corp | Ｃ−ｒ複合電子部品 |
| EP0902048B1 (en) * | 1997-09-11 | 2005-11-23 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible polyimide film and process of preparation |
| US5993698A (en) | 1997-11-06 | 1999-11-30 | Acheson Industries, Inc. | Electrical device containing positive temperature coefficient resistor composition and method of manufacturing the device |
| KR19990071099A (ko) * | 1998-02-27 | 1999-09-15 | 윤종용 | 인쇄회로기판 및 그 제조방법 |
| EP1082882B1 (en) * | 1999-03-17 | 2007-10-31 | Motorola, Inc. | Method of manufacturing resistors |
| US6030553A (en) * | 1999-04-01 | 2000-02-29 | Industrial Technology Research Institute | Polymer thick film resistor pastes |
| US6535398B1 (en) * | 2000-03-07 | 2003-03-18 | Fujitsu Limited | Multichip module substrates with buried discrete capacitors and components and methods for making |
| US6278356B1 (en) * | 2000-05-17 | 2001-08-21 | Compeq Manufacturing Company Limited | Flat, built-in resistors and capacitors for a printed circuit board |
| US6541137B1 (en) * | 2000-07-31 | 2003-04-01 | Motorola, Inc. | Multi-layer conductor-dielectric oxide structure |
| US6657849B1 (en) * | 2000-08-24 | 2003-12-02 | Oak-Mitsui, Inc. | Formation of an embedded capacitor plane using a thin dielectric |
| TW511405B (en) * | 2000-12-27 | 2002-11-21 | Matsushita Electric Industrial Co Ltd | Device built-in module and manufacturing method thereof |
| US7524528B2 (en) * | 2001-10-05 | 2009-04-28 | Cabot Corporation | Precursor compositions and methods for the deposition of passive electrical components on a substrate |
| KR100455891B1 (ko) * | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
| US6910264B2 (en) * | 2003-01-03 | 2005-06-28 | Phoenix Precision Technology Corp. | Method for making a multilayer circuit board having embedded passive components |
| JP4449772B2 (ja) * | 2004-04-09 | 2010-04-14 | 株式会社デンソー | パワー半導体スイッチング素子及びそれを用いた半導体パワーモジュール |
-
2004
- 2004-10-18 US US10/967,781 patent/US7382627B2/en not_active Expired - Lifetime
-
2005
- 2005-09-26 EP EP05020896A patent/EP1648207B1/en not_active Ceased
- 2005-10-04 TW TW094134608A patent/TWI397354B/zh active
- 2005-10-17 KR KR1020050097353A patent/KR100729703B1/ko not_active Expired - Fee Related
- 2005-10-18 JP JP2005303551A patent/JP4500759B2/ja not_active Expired - Lifetime
- 2005-10-18 CN CNA2005101161069A patent/CN1783377A/zh active Pending