JP2004002956A5 - - Google Patents

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Publication number
JP2004002956A5
JP2004002956A5 JP2002342090A JP2002342090A JP2004002956A5 JP 2004002956 A5 JP2004002956 A5 JP 2004002956A5 JP 2002342090 A JP2002342090 A JP 2002342090A JP 2002342090 A JP2002342090 A JP 2002342090A JP 2004002956 A5 JP2004002956 A5 JP 2004002956A5
Authority
JP
Japan
Prior art keywords
dielectric
dielectric layer
plating
layer
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002342090A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004002956A (ja
Filing date
Publication date
Priority claimed from US10/268,433 external-priority patent/US6661642B2/en
Application filed filed Critical
Publication of JP2004002956A publication Critical patent/JP2004002956A/ja
Publication of JP2004002956A5 publication Critical patent/JP2004002956A5/ja
Pending legal-status Critical Current

Links

JP2002342090A 2001-11-26 2002-11-26 誘電構造物 Pending JP2004002956A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33338301P 2001-11-26 2001-11-26
US10/268,433 US6661642B2 (en) 2001-11-26 2002-10-10 Dielectric structure

Publications (2)

Publication Number Publication Date
JP2004002956A JP2004002956A (ja) 2004-01-08
JP2004002956A5 true JP2004002956A5 (enExample) 2006-01-12

Family

ID=26953090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002342090A Pending JP2004002956A (ja) 2001-11-26 2002-11-26 誘電構造物

Country Status (5)

Country Link
US (1) US6661642B2 (enExample)
EP (1) EP1315407A3 (enExample)
JP (1) JP2004002956A (enExample)
KR (1) KR20030043715A (enExample)
TW (1) TWI223289B (enExample)

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US7293467B2 (en) * 2001-07-09 2007-11-13 Nartron Corporation Anti-entrapment system
US7162928B2 (en) * 2004-12-06 2007-01-16 Nartron Corporation Anti-entrapment system
US7132642B2 (en) * 2001-07-09 2006-11-07 Nartron Corporation Anti-entrapment systems for preventing objects from being entrapped by translating devices
US6872468B1 (en) * 2003-10-09 2005-03-29 Motorola, Inc. Peelable circuit board foil
JP2005181958A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc レーザーアブレーションを用いる電子部品および光学部品の形成方法
US7193838B2 (en) 2003-12-23 2007-03-20 Motorola, Inc. Printed circuit dielectric foil and embedded capacitors
US20060022304A1 (en) * 2004-07-29 2006-02-02 Rohm And Haas Electronic Materials Llc Dielectric structure
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
EP1693484A3 (en) * 2005-02-15 2007-06-20 Rohm and Haas Electronic Materials, L.L.C. Plating Method
US7312591B2 (en) * 2005-03-11 2007-12-25 Npc Corporation Powered panel moving system
KR100691437B1 (ko) * 2005-11-02 2007-03-09 삼성전기주식회사 폴리머-세라믹의 유전체 조성물, 이를 이용하는 내장형캐패시터와 인쇄회로기판
US7342373B2 (en) 2006-01-04 2008-03-11 Nartron Corporation Vehicle panel control system
US20130284710A1 (en) * 2009-05-15 2013-10-31 Translith Systems, Llc Method and Apparatus for the Line Narrowing of Diode Lasers
US9254536B2 (en) * 2009-05-15 2016-02-09 Paul Hoff Method and apparatus for controlled laser ablation of material
US20110232758A1 (en) * 2010-03-25 2011-09-29 Rohm And Haas Electronic Materials Llc Thin film photovoltaic cell
US8415227B2 (en) * 2011-08-29 2013-04-09 Intermolecular, Inc. High performance dielectric stack for DRAM capacitor
FR3045036B1 (fr) * 2015-12-15 2017-12-22 Commissariat Energie Atomique Procede de preparation d'une solution sol-gel utilisable pour la preparation d'une ceramique de titanate de baryum dope par du hafnium et/ou par au moins un element lanthanide
US10796990B2 (en) * 2018-09-19 2020-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure, package structure, and manufacturing method thereof

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
DE3143995A1 (de) * 1981-11-05 1983-05-19 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Dickschichtkondensator in druckschaltungstechnik
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material
US5155655A (en) 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JP2531906B2 (ja) 1991-09-13 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション 発泡重合体
US5835174A (en) 1995-10-12 1998-11-10 Rohm And Haas Company Droplets and particles containing liquid crystal and films and apparatus containing the same
JPH1056251A (ja) * 1996-08-08 1998-02-24 Sony Corp 電子部品内蔵プリント基板およびその製造方法
EP0917719A2 (en) 1996-08-12 1999-05-26 Energenius, Inc. Semiconductor supercapacitor system, method for making same and articles produced therefrom
US5742471A (en) 1996-11-25 1998-04-21 The Regents Of The University Of California Nanostructure multilayer dielectric materials for capacitors and insulators
US5895263A (en) 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US5856068A (en) * 1997-05-02 1999-01-05 Motorola, Inc. Method for fabricating a printed circuit board by curing under superatmospheric pressure
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US6068782A (en) 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
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US6623865B1 (en) 2000-03-04 2003-09-23 Energenius, Inc. Lead zirconate titanate dielectric thin film composites on metallic foils
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