JP2004002956A5 - - Google Patents

Download PDF

Info

Publication number
JP2004002956A5
JP2004002956A5 JP2002342090A JP2002342090A JP2004002956A5 JP 2004002956 A5 JP2004002956 A5 JP 2004002956A5 JP 2002342090 A JP2002342090 A JP 2002342090A JP 2002342090 A JP2002342090 A JP 2002342090A JP 2004002956 A5 JP2004002956 A5 JP 2004002956A5
Authority
JP
Japan
Prior art keywords
dielectric
dielectric layer
plating
layer
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002342090A
Other languages
English (en)
Other versions
JP2004002956A (ja
Filing date
Publication date
Priority claimed from US10/268,433 external-priority patent/US6661642B2/en
Application filed filed Critical
Publication of JP2004002956A publication Critical patent/JP2004002956A/ja
Publication of JP2004002956A5 publication Critical patent/JP2004002956A5/ja
Pending legal-status Critical Current

Links

Description

【特許請求の範囲】
【請求項１】 誘電層上への導電層のメッキを促進するために十分な量のメッキドーパントを含む誘電層を有する誘電構造物。
【請求項２】 第一誘電層および第二誘電層を有する誘電構造物であって、該第一誘電層が該第一誘電層上への導電層のメッキを促進するために十分な量のメッキドーパントを含む誘電構造物。
【請求項３】 メッキドーパントが金属である請求項１または２記載の誘電構造物。
【請求項４】 メッキドーパントが５０体積％までの量において第一誘電層中に存在する請求項１から３のいずれか一つに記載の誘電構造物。
【請求項５】 該第二誘電層上に配置された第三の誘電層をさらに含み、該第三誘電層が該第三誘電層上への導電層のメッキを促進するために十分な量のメッキドーパントを含む請求項２から４のいずれか一つに記載の誘電構造物。
【請求項６】 該第二誘電層が複数の誘電層を含む請求項２から５のいずれか一つに記載の誘電構造物。
【請求項７】 ボトム導電層が第二誘電層と密着し、トップ導電層が第一誘電層と密着している請求項１から６のいずれかひとつに記載の誘電構造物を含むキャパシター。
【請求項８】 埋め込まれたキャパシタンス物質が請求項１から６のいずれか一つに記載の誘電構造物を含む、埋め込まれたキャパシタンス物質を含むプリント回路板。
【請求項９】 キャパシタンス物質を多層積層プリント回路板の１以上の層中に埋め込む段階を含む多層積層プリント回路板の製造法であって、埋め込まれたキャパシタンス物質が請求項１から６のいずれか一つに記載の誘電構造物を含む方法。
【請求項１０】 第一誘電層上への導電層のメッキを促進するために十分な量のメッキドーパントを含む誘電層を基体上に堆積させ、該誘電層の表面上に導電層をメッキする段階を含むキャパシターの製造法。
JP2002342090A 2001-11-26 2002-11-26 誘電構造物 Pending JP2004002956A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33338301P 2001-11-26 2001-11-26
US10/268,433 US6661642B2 (en) 2001-11-26 2002-10-10 Dielectric structure

Publications (2)

Publication Number Publication Date
JP2004002956A JP2004002956A (ja) 2004-01-08
JP2004002956A5 true JP2004002956A5 (ja) 2006-01-12

Family

ID=26953090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002342090A Pending JP2004002956A (ja) 2001-11-26 2002-11-26 誘電構造物

Country Status (5)

Country Link
US (1) US6661642B2 (ja)
EP (1) EP1315407A3 (ja)
JP (1) JP2004002956A (ja)
KR (1) KR20030043715A (ja)
TW (1) TWI223289B (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7162928B2 (en) * 2004-12-06 2007-01-16 Nartron Corporation Anti-entrapment system
US7293467B2 (en) 2001-07-09 2007-11-13 Nartron Corporation Anti-entrapment system
US7132642B2 (en) * 2001-07-09 2006-11-07 Nartron Corporation Anti-entrapment systems for preventing objects from being entrapped by translating devices
US6872468B1 (en) 2003-10-09 2005-03-29 Motorola, Inc. Peelable circuit board foil
JP2005181958A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc レーザーアブレーションを用いる電子部品および光学部品の形成方法
US7193838B2 (en) 2003-12-23 2007-03-20 Motorola, Inc. Printed circuit dielectric foil and embedded capacitors
JP2006093663A (ja) * 2004-07-29 2006-04-06 Rohm & Haas Electronic Materials Llc 誘電体構造
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
EP1693484A3 (en) * 2005-02-15 2007-06-20 Rohm and Haas Electronic Materials, L.L.C. Plating Method
US7312591B2 (en) 2005-03-11 2007-12-25 Npc Corporation Powered panel moving system
KR100691437B1 (ko) * 2005-11-02 2007-03-09 삼성전기주식회사 폴리머-세라믹의 유전체 조성물, 이를 이용하는 내장형캐패시터와 인쇄회로기판
US7342373B2 (en) 2006-01-04 2008-03-11 Nartron Corporation Vehicle panel control system
US9254536B2 (en) * 2009-05-15 2016-02-09 Paul Hoff Method and apparatus for controlled laser ablation of material
US20130284710A1 (en) * 2009-05-15 2013-10-31 Translith Systems, Llc Method and Apparatus for the Line Narrowing of Diode Lasers
US20110232758A1 (en) * 2010-03-25 2011-09-29 Rohm And Haas Electronic Materials Llc Thin film photovoltaic cell
US8415227B2 (en) * 2011-08-29 2013-04-09 Intermolecular, Inc. High performance dielectric stack for DRAM capacitor
FR3045036B1 (fr) * 2015-12-15 2017-12-22 Commissariat Energie Atomique Procede de preparation d'une solution sol-gel utilisable pour la preparation d'une ceramique de titanate de baryum dope par du hafnium et/ou par au moins un element lanthanide
US10796990B2 (en) * 2018-09-19 2020-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure, package structure, and manufacturing method thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143995A1 (de) * 1981-11-05 1983-05-19 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Dickschichtkondensator in druckschaltungstechnik
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material
US5155655A (en) 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JP2531906B2 (ja) 1991-09-13 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション 発泡重合体
US5835174A (en) 1995-10-12 1998-11-10 Rohm And Haas Company Droplets and particles containing liquid crystal and films and apparatus containing the same
JPH1056251A (ja) * 1996-08-08 1998-02-24 Sony Corp 電子部品内蔵プリント基板およびその製造方法
JP2001503197A (ja) 1996-08-12 2001-03-06 エナージーニアス，インコーポレイテッド 半導体スーパーキャパシタシステム、その製法、及び該製法による製品
US5742471A (en) 1996-11-25 1998-04-21 The Regents Of The University Of California Nanostructure multilayer dielectric materials for capacitors and insulators
US5895263A (en) 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US5856068A (en) * 1997-05-02 1999-01-05 Motorola, Inc. Method for fabricating a printed circuit board by curing under superatmospheric pressure
US6432472B1 (en) 1997-08-15 2002-08-13 Energenius, Inc. Method of making semiconductor supercapacitor system and articles produced therefrom
US6068782A (en) 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
JPH11297532A (ja) * 1998-04-15 1999-10-29 Murata Mfg Co Ltd 電子部品及びその製造方法
US6137192A (en) 1998-05-15 2000-10-24 Energenius, Inc. Embedded backup energy storage unit
US6093636A (en) 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
US6420441B1 (en) 1999-10-01 2002-07-16 Shipley Company, L.L.C. Porous materials
US6623865B1 (en) 2000-03-04 2003-09-23 Energenius, Inc. Lead zirconate titanate dielectric thin film composites on metallic foils
US6271273B1 (en) 2000-07-14 2001-08-07 Shipley Company, L.L.C. Porous materials

Similar Documents

Publication Publication Date Title
JP2004002956A5 (ja)
WO2002011207A3 (en) Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
TWI314028B (en) Method of forming passive devices and passive apparatus
EP1087647A3 (en) Thin integral resistor/capacitor/inductor package, method of manufacture
TWI268524B (en) Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure
WO2006091463A3 (en) Method of making multilayered construction for use in resistors and capacitors
EP1215948A3 (en) Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
JP2008544551A5 (ja)
WO2002011206A3 (en) Electronic assembly comprising interposer with embedded capacitors and methods of manufacture
EP1699275A3 (en) Printed circuit board with embedded capacitors therein and manufacturing process thereof
RU2007105901A (ru) Способ встраивания электропроводящих элементов в слой диэлектрика
WO2005034201A3 (en) Metal-insulator-metal capacitor and method of fabrication
MY161142A (en) A novel thin laminate as embedded capacitance material in printed circuit boards
EP1581035A3 (en) Multilayer ceramic substrate and its production method
WO2007106642A3 (en) Method for forming embedded capacitors on a printed circuit board, and resultant printed circuit board
KR100861618B1 (ko) 내장형 캐패시터의 공차 향상을 위한 인쇄회로기판 및 그제조방법
EP1699277A4 (en) CERAMIC MULTILAYER SUBSTRATE
JP2006121087A5 (ja)
WO2007075714A3 (en) Embedded capacitors and methods for their fabrication and connection
EP1315407A3 (en) Dielectric structure
TW200420203A (en) Multilayer board and its manufacturing method
JP2004063664A (ja) キャビティ付き多層セラミック基板
JP2007088461A5 (ja)
WO2005062803A3 (en) Printed circuit dielectric foil and embedded capacitors
TW200611620A (en) A manufacturing method of a multi-layer circuit board with embedded passive components