CN1783377A - 电容/电阻器件、电介质叠层和印刷电路板及其制造方法 - Google Patents
电容/电阻器件、电介质叠层和印刷电路板及其制造方法 Download PDFInfo
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Abstract
一种具有电容和电阻两种功能的电容/电阻器件。该电容/电阻器件可嵌入到印刷电路板的层中。嵌入电容/电阻器件保存了电路板的表面区域,减少焊接数目,从而提高了可靠性。
Description
技术领域
本发明涉及一种具有电容和电阻两种功能的器件,和在有机电介质层和印刷电路板中结合这些器件的方法。
背景技术
电容器和电阻器可串联用做集成电路(IC)器件延伸出的信号跟踪器的传输线终端。电容器和电阻器用来使IC器件的阻抗匹配于传输线、或用来降低或消除信号反射。某些电路是连续负载的,使用与电路并联的电阻器。非连续负载的电路带有串联的电阻器和电容器,能用于低功率IC。图1示范性地阐述了现有技术中已知的IC器件10和20的不连续负载终端。
在图1中,a与b的距离通常较短。选择电阻R的数值使其与线路的阻抗匹配,通常是约45-80欧姆。选择电容器C的数值使串联的电阻R和电容C的电阻电容时间常数大于信号的发生时间,而小于信号脉冲的总时间。通常的电容值在30皮法拉第的数量级上。
常规的电容电阻终端通常由表面安装技术(SMT)的电阻和电容器构成。图2是印刷电路板25的一部分的剖面图,该印刷电路板带有SMT电阻器40和SMT电容器50,二者与IC器件30连接,以形成用于IC 30的常规的SMT电容电阻终端。向IC 30传输信号的信号线路与将IC器件30连接到电阻器40上的电路轨迹60相连接。电容器50通过一对焊接盘52和焊接头58与电路轨迹70相偶联。电阻器40通过焊接盘42和焊接头48与电路轨迹70相偶联。电容器50通过其它的焊接盘58和电路59与通路孔80相偶联。这样的排列使电阻器40和电容器50与信号线串联,并且通过电镀的通路孔80接地。此常规表面安装法需要使用较贵的表面区域(real estates)。而且,对焊接头的需求降低了可靠性,而增加了制造成本。
发明内容
依据第一个实施方式,电容/电阻器件包括第一电极、设置在第一电极上的电介质、设置在第二电极上且与电介质相邻的电阻器元件,其中的电介质包括填充了高介电常数粉末相的聚合物。电容/电阻器件可嵌入在有机电介质层中,而结合到印刷电路板中。
依据以上的实施方式,电阻和电容器功能都可结合到单一嵌入式叠层中,从而降低成本以及产生电阻和电容功能的难度。当电容/电阻器件被结合到印刷电路板中时,电容/电阻器件的嵌入也不再需要较贵的区域。而且,可以取消SMT器件所需的焊接头,从而提高了可靠性。电容/电阻器件可使用常规蚀刻工艺来加工,进一步降低了生产成本。
本领域技术人员通过阅读以下实施方式的详细说明,会明白上述优点和本发明各种其它实施方式的优点和好处。
附图说明
参照下列附图进行详细说明,其中相同的数字代表相同的元件,其中:
图1是常规(现有技术)串联有电阻器和电容器的不连续负载终端的示意图;
图2是具有用于集成电路器件的常规(现有技术)的SMT RC传输线路终端的印刷电路板的剖面图;
图3是依据第二个实施方式的,具有嵌入式电容/电阻器件的印刷电路板的一部分的剖面图;
图4A-4F所示说明依据本发明制造图3所示的包含电容/电阻器件的层状结构的方法。
具体实施方式
本发明的实施方式涉及可嵌入在印刷电路板(PWB)基片中的电容/电阻器件。向PWB基片中提供电容/电器功能,保存了印刷电路板上较贵的表面区域。本发明的实施方式也比常规SMT终端排列需要更少的焊接头。
图3是印刷电路板2000的一部分的剖面图。印刷电路板2000包括电容电阻传输线路终端,其中将电阻的功能和电容器的功能整合到单一的电容/电阻器件200中。器件200包括下电极210、电介质220、电阻元件230、上电极或上片240,和导电轨迹245。器件200向单一层状结构中提供电阻和电容功能,通常用括号201标示。器件200通过导电电路轨迹245、由电介质层280延伸出的电镀的通孔250和导电电路轨迹260与IC器件270相偶联。IC器件270可通过焊接盘272和焊接头274与导电电路轨迹260相连接。导电电路轨迹211可从下电极210延伸出去,以接地或连接其它的电路。
图4A-4F所示说明制造包括器件200的的层状结构的方法。图4A是第一制造阶段的前视剖面图,该阶段提供第一和第二金属箔212、242。第二金属箔242有一层电阻材料232。电阻材料232可为,例如NiP、CrSi、NiCr或其它能由电镀、喷镀或以其它方法沉积在第二金属箔242表面上的电阻材料。第一和第二金属箔212、242可由如铜、铜基材料和其它金属制得。
高介电常数的淤浆可浇铸或施涂在第一箔212上,然后固化形成第一电介质层222。相似地,第二电介质层226可以类似方式形成在第二箔242上的电阻材料层232表面上。淤浆材料可包括,例如,具有高介电常数(“高K”)填充料或功能相的聚合物-溶剂溶液。合适的用作淤浆或溶液的聚合物包括,例如,环氧树脂或聚酰亚胺树脂。高K功能相可定义为介电常数超过500的材料,可包括通式为ABO3的钙钛矿。合适的填充料包括,例如,结晶钛酸钡(BT)、钛酸锶钡(BST)、钛酸锆酸铅(PZT)、钛酸镧铅、钛酸锆酸镧铅(PLZT)、铌酸镁铅(PMN),和钛酸铜钙以及它们的混合物。填充料可为粉末形式。
在电介质层222、226中任一表面或两个表面上(图4A中所示的层222上)可施涂薄粘合层227。粘合层227可由,例如热塑性聚合物形成,并填充有高电介质相以避免介电常数的下降。然后,两种结构按图4A中所示的箭头方向层压在一起。
参见图4B,由层222、226和227通过层叠形成单一电介质220。该电介质层的介电常数可在5至40的范围内。粘合层227使电介质层222和电介质层226在层叠过程中易于结合。但是,如果电介质层222和226在层叠之前只是部分固化,或电介质层222和226本质上为热塑性,层叠中合适的温度和压力足以软化树脂,以致于层224和226可以在无粘合剂的情况下结合在一起,则粘合层227也可以不存在。图4B所示的结构也可以通过将淤浆只浇铸到箔212、242中的一个上,并将另一个箔层叠到固化或部分固化的淤浆上来形成。而另一种的方法会形成具有固化或半固化的淤浆的独立薄膜220,将箔212和242层压到聚合物薄膜220的两面。
将光致蚀刻剂(未示于图4B中)施涂于箔212上,对箔212进行成像和蚀刻,而所剩余的光致蚀刻剂可使用标准印刷电路板加工条件来剥离。图4C是所得制品沿图4D中的4C-4C线所得的顶视剖面图。参见图4C,蚀刻制造出器件200的下电极210和导电电路轨迹211。
图4D是沿图4C中的4D-4D线得到的前视剖面图。参见图4D,将所得制品的下电极210面层压到层压材料282上。例如,在标准印刷板工艺中,使用FR4预浸材料或其它的预浸材料来进行层叠。
将光致蚀刻剂(未示于图4D中)施涂于箔242上,并且对箔242进行成像和蚀刻,并剥离剩余的光致蚀刻剂。图4E是所得制品沿图4F中的4E-4E线所得的顶部剖面图。图4F是沿图4E中的4F-4F线得到的前视剖面图。参见图4E和4F,蚀刻制造出器件200的上电极240和导电电路轨迹245。蚀刻还产生间隙248。
可再次施涂光致蚀刻剂(未示于图4E和图4F中),可使用能除去电阻材料的蚀刻溶液来对电阻材料232进行成像和蚀刻。以此方式,电阻材料层232可进行选择性蚀刻,形成具有任何所需形状和尺寸的电阻元件230。所得电阻元件230跨过间隙248,在导电体240和导电轨迹245之间延伸。
参见图4F,将电介质层280层叠到电介质层282有部件的面上,形成层状结构201。然后采用常规层叠方法,并通过形成工艺,将层状结构201结合到如印刷电路板中。
实施例1:
参照图3对这一器件200的实施例进行讨论。在此实施例中,图4B所示的最初层状结构包括镀有电阻材料232的铜箔242,电阻材料232由薄板电阻率为50欧姆/平方的镍磷合金组成。电介质220是填充有钛酸钡的热塑性聚酰亚胺。钛酸钡作为填充料的优势是容易得到且不含有铅。电介质220厚14微米,介电常数为11,因而产生4.5纳法拉/平方英寸的电容密度。
30皮法拉的传输线路终端所需的电容器的尺寸(从顶面视图观察时)是4.3平方毫米,或大约2毫米×2毫米。电极210和240由蚀刻铜箔212和242形成。上述的电容器易于制成具有相对高相容性的电容器。
此实施例中用于得到标称60欧姆电阻的电阻器的尺寸可以改变,只要长度和宽度的比例保持在1.2至1.0。
实施例2:
参照图3对这一器件200的实施例进行讨论。在此实施例中,图4B所示的最初层状结构包括由镀有电阻材料232的铜箔242,所述电阻材料232由薄板电阻率为50欧姆/平方的镍磷合金所组成。电介质220为填充钛酸钡的热塑性聚酰亚胺。钛酸钡作为填充料的优势是它容易得到且不含有铅。电介质220厚8微米,介电常数为11,因而产生6.2纳法拉/平方英寸的电容密度。
30皮法拉的传输线路终端所需的电容器的尺寸(从顶面视图观察时)是3.1平方毫米,或大约1.77毫米×1.77毫米。电极210和240由蚀刻铜箔212和242形成。上述的电容器易于制成具有相对高相容性的电容器。
此实施例中用于标称60欧姆电阻的电阻器的尺寸可以改变,只要长度和宽度的比例保持在1.2至1.0。
依据上述实施方式,使用结合了电阻器的高介电常数的薄电容器层状结构可减小嵌入式电容功能的尺寸,并且更有效地嵌入电阻电容传输线路终端。嵌入电阻器和电容器功能不需要较贵的表面区域,并且取消了与SMT器件有关的焊接头,因此提高了可靠性。而且,在其中结合了电阻和电容器的层压制品可使用常规蚀刻工艺来加工,进一步降低了生产成本。
上述实施例也提供用于电路设计和PWB制造的其他选择。例如,一件层压制品可用于嵌入很多离散的电阻器和很多离散的电容器,这降低了连接电阻和电容所产生的电感效应。
顶面视图中的电容器实施方式的形状通常是矩形。但是,电容器电极、电介质和其它部件和层也可具有其它规则或不规则的表面形状,诸如,圆形、椭圆形、卵形或多边形。
在上述层状结构中形成单独的电容/电阻器件200。但是,板形结构和印刷电路板可包括大量独立的不同类型和排列方式的电容/电阻器件。
在上述实施方式中,电阻、电容和电感结合形成特定电路阻抗,通常用大写字母Z表示。电容和电阻可构造成得到特定的阻抗。改变电阻、电容或两者都会改变电感。可控制所有三者的改变以限定最终的阻抗。换言之,层压制品的阻抗是“可调的”。
上面本发明的说明书举例说明和描述了本发明。另外,虽然公开内容只显示和描述了本发明的优选的实施方式,但应理解为本发明可在各种其它的组合、修改和环境中使用,并且可以在这里所述的本发明概念范围内、符合上述教导的,和/或在本领域技术或知识范围内进行改变和修改。
以上描述的实施方式旨在进一步解释已知的实施本发明的最好模式,以及使本领域技术人员能够使用本发明的或其它的实施例和进行特定应用所需的各种修改或使用本发明。因此,说明书不旨在将本发明限制在这里所揭示的形式中。附加的权利要求书旨在包括另外的,没有在说明书清楚限定的实施方式。
Claims (15)
1.一种电容/电阻器件,其包括:
第一电极;
设置在第一电极上的电介质;
在电介质上形成且与电介质相邻的电阻器元件;
导电轨迹;和
设置在电介质上且与电阻器元件电接触的第二电极,其中电介质设置在第-电极和第二电极之间,所述电介质包括填充了高介电常数粉末相的聚合物。
2.如权利要求1所述的电容/电阻器件,其特征在于,所述电阻器元件在第二电极和导电轨迹之间延伸。
3.如权利要求2所述的电容/电阻器件,其特征在于,所述电阻器元件设置在电介质和第二电极之间。
4.如权利要求1所述的电容/电阻器件,其特征在于,所述电解质包括聚酰亚胺聚合物。
5.如权利要求4所述的电容/电阻器件,其特征在于,所述电介质的介电常数在5至40之间。
6.如权利要求1所述的电容/电阻器件,其特征在于,所述高介电常数粉末相选自钛酸钡、钛酸锶钡、钛酸锆酸铅、钛酸锆酸镧铅、钛酸镁铅、钛酸铜钙和它们的混合物。
7.如权利要求1所述的电容/电阻器件,嵌入到至少两个有机电介质层压层之间,其特征在于,所述层压层和电容/电阻器件形成层状结构。
8.一种印刷电路板,其包括:
至少一种如权利要求7所述的层状结构;和
至少一种设置在印刷电路板上表面的IC器件,其中IC器件与电容/电阻
器件电偶联。
9.一种制造电容/电阻器件的方法,其包括:
提供第一金属箔和第二金属箔;
在第一金属箔上形成电介质;
在第二金属箔上形成电阻器元件,其中电阻器元件与电介质相邻;
由第一金属箔形成第一电极;和
由设置在电介质上且与电阻器元件电接触的第二金属箔形成第二电极和导电轨迹,其中电介质设置在第一电极和第二电极之间,电介质包括填充了高介电常数粉末相的聚合物。
10.如权利要求9所述的方法,其特征在于,所述电阻器元件在第二电极和导电轨迹之间延伸。
11.如权利要求10所述的方法,其特征在于,所述电阻器元件设置在电介质和第二电极之间。
12.如权利要求9所述的方法,还包括:
提供第二金属箔;和
蚀刻第二金属箔,形成第二电极。
13.如权利要求12所述的方法,其特征在于,形成电介质包括在第一金属箔和第二金属箔之间形成填充聚合物层。
14.一种制造层状结构的方法,其包括:
在至少两个有机电介质层压层之间嵌入至少一个如权利要求7所述的电容/电阻器件。
15.一种制造印刷电路板的方法,其包括:
提供至少一种如权利要求7所述的层状结构;和
提供至少一种设置在印刷电路板上表面的IC器件,其中IC器件与电容/电阻器件电偶联。
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US10/967,781 US7382627B2 (en) | 2004-10-18 | 2004-10-18 | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof |
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EP (1) | EP1648207B1 (zh) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105047411A (zh) * | 2015-08-12 | 2015-11-11 | 深圳市槟城电子有限公司 | 一种电阻和电容串连的组件及其制作方法 |
CN105047642A (zh) * | 2015-08-12 | 2015-11-11 | 深圳市槟城电子有限公司 | 一种端口防护电路集成封装件 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7596842B2 (en) | 2005-02-22 | 2009-10-06 | Oak-Mitsui Inc. | Method of making multilayered construction for use in resistors and capacitors |
US20060286696A1 (en) * | 2005-06-21 | 2006-12-21 | Peiffer Joel S | Passive electrical article |
CN101090599B (zh) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
US7808797B2 (en) * | 2006-12-11 | 2010-10-05 | Intel Corporation | Microelectronic substrate including embedded components and spacer layer and method of forming same |
ATE524817T1 (de) | 2006-12-21 | 2011-09-15 | Cardiac Pacemakers Inc | Festkörper-impulstherapiekondensator |
US7672113B2 (en) * | 2007-09-14 | 2010-03-02 | Oak-Mitsui, Inc. | Polymer-ceramic composites with excellent TCC |
US8957531B2 (en) | 2011-10-20 | 2015-02-17 | International Business Machines Corporation | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity |
US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3934119A (en) | 1974-09-17 | 1976-01-20 | Texas Instruments Incorporated | Electrical resistance heaters |
US4377652A (en) | 1978-02-17 | 1983-03-22 | Asahi Kasei Kogyo Kabushiki Kaisha | Polyamide-imide compositions and articles for electrical use prepared therefrom |
US4410867A (en) * | 1978-12-28 | 1983-10-18 | Western Electric Company, Inc. | Alpha tantalum thin film circuit device |
US4399417A (en) * | 1980-06-06 | 1983-08-16 | Bell Telephone Laboratories, Incorporated | Integrated CRC filter circuit |
US4407883A (en) | 1982-03-03 | 1983-10-04 | Uop Inc. | Laminates for printed circuit boards |
JPS58190091A (ja) | 1982-04-30 | 1983-11-05 | 宇部興産株式会社 | フレキシブル配線基板の製造方法 |
JPS60113993A (ja) * | 1983-11-25 | 1985-06-20 | 三菱電機株式会社 | 多層回路基板の製造方法 |
US5093036A (en) | 1988-09-20 | 1992-03-03 | Raychem Corporation | Conductive polymer composition |
JP3019541B2 (ja) * | 1990-11-22 | 2000-03-13 | 株式会社村田製作所 | コンデンサ内蔵型配線基板およびその製造方法 |
JPH0548271A (ja) * | 1991-08-12 | 1993-02-26 | Murata Mfg Co Ltd | 機能性多層回路基板 |
JPH0565456A (ja) | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
JPH05152111A (ja) * | 1991-11-28 | 1993-06-18 | Rohm Co Ltd | チツプ型複合部品 |
DE69305942T2 (de) | 1992-09-15 | 1997-03-13 | Du Pont | Zusammensetzung für einen Polymer-Dickschichtwiderstand |
US6111005A (en) | 1993-07-30 | 2000-08-29 | Diemat, Inc. | Polymeric adhesive paste |
US6140402A (en) | 1993-07-30 | 2000-10-31 | Diemat, Inc. | Polymeric adhesive paste |
JP3117175B2 (ja) | 1994-02-09 | 2000-12-11 | アルプス電気株式会社 | 抵抗体 |
TW301843B (en) | 1994-11-15 | 1997-04-01 | Ibm | Electrically conductive paste and composite and their use as an electrically conductive connector |
TW367621B (en) | 1995-02-27 | 1999-08-21 | Nxp Bv | Electronic component comprising a thin-film structure with passive elements |
JPH08306503A (ja) * | 1995-05-11 | 1996-11-22 | Rohm Co Ltd | チップ状電子部品 |
JPH0992983A (ja) * | 1995-07-17 | 1997-04-04 | Sumitomo Kinzoku Electro Device:Kk | セラミック多層基板の製造方法 |
US5699224A (en) * | 1995-10-25 | 1997-12-16 | Rohm Co., Ltd. | Thick-film capacitor and chip-type composite electronic component utilizing the same |
JPH09186004A (ja) * | 1995-12-28 | 1997-07-15 | Kyocera Corp | C−r複合電子部品 |
EP0902048B1 (en) | 1997-09-11 | 2005-11-23 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible polyimide film and process of preparation |
US5993698A (en) | 1997-11-06 | 1999-11-30 | Acheson Industries, Inc. | Electrical device containing positive temperature coefficient resistor composition and method of manufacturing the device |
KR19990071099A (ko) * | 1998-02-27 | 1999-09-15 | 윤종용 | 인쇄회로기판 및 그 제조방법 |
WO2000056128A1 (en) * | 1999-03-17 | 2000-09-21 | Motorola Inc. | Method of manufacturing resistors |
US6030553A (en) | 1999-04-01 | 2000-02-29 | Industrial Technology Research Institute | Polymer thick film resistor pastes |
US6535398B1 (en) * | 2000-03-07 | 2003-03-18 | Fujitsu Limited | Multichip module substrates with buried discrete capacitors and components and methods for making |
US6278356B1 (en) * | 2000-05-17 | 2001-08-21 | Compeq Manufacturing Company Limited | Flat, built-in resistors and capacitors for a printed circuit board |
US6541137B1 (en) | 2000-07-31 | 2003-04-01 | Motorola, Inc. | Multi-layer conductor-dielectric oxide structure |
US6657849B1 (en) | 2000-08-24 | 2003-12-02 | Oak-Mitsui, Inc. | Formation of an embedded capacitor plane using a thin dielectric |
TW511405B (en) * | 2000-12-27 | 2002-11-21 | Matsushita Electric Ind Co Ltd | Device built-in module and manufacturing method thereof |
US7524528B2 (en) * | 2001-10-05 | 2009-04-28 | Cabot Corporation | Precursor compositions and methods for the deposition of passive electrical components on a substrate |
KR100455891B1 (ko) | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
US6910264B2 (en) | 2003-01-03 | 2005-06-28 | Phoenix Precision Technology Corp. | Method for making a multilayer circuit board having embedded passive components |
JP4449772B2 (ja) * | 2004-04-09 | 2010-04-14 | 株式会社デンソー | パワー半導体スイッチング素子及びそれを用いた半導体パワーモジュール |
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2004
- 2004-10-18 US US10/967,781 patent/US7382627B2/en active Active
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2005
- 2005-09-26 EP EP05020896A patent/EP1648207B1/en active Active
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- 2005-10-17 KR KR1020050097353A patent/KR100729703B1/ko not_active IP Right Cessation
- 2005-10-18 CN CNA2005101161069A patent/CN1783377A/zh active Pending
- 2005-10-18 JP JP2005303551A patent/JP4500759B2/ja active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105047411A (zh) * | 2015-08-12 | 2015-11-11 | 深圳市槟城电子有限公司 | 一种电阻和电容串连的组件及其制作方法 |
CN105047642A (zh) * | 2015-08-12 | 2015-11-11 | 深圳市槟城电子有限公司 | 一种端口防护电路集成封装件 |
WO2017025002A1 (zh) * | 2015-08-12 | 2017-02-16 | 深圳市槟城电子有限公司 | 一种电阻和电容串联的组件及其制作方法 |
CN105047642B (zh) * | 2015-08-12 | 2024-01-19 | 深圳市槟城电子股份有限公司 | 一种端口防护电路集成封装件 |
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KR100729703B1 (ko) | 2007-06-19 |
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US7382627B2 (en) | 2008-06-03 |
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