JP4449772B2 - パワー半導体スイッチング素子及びそれを用いた半導体パワーモジュール - Google Patents
パワー半導体スイッチング素子及びそれを用いた半導体パワーモジュール Download PDFInfo
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- JP4449772B2 JP4449772B2 JP2005031728A JP2005031728A JP4449772B2 JP 4449772 B2 JP4449772 B2 JP 4449772B2 JP 2005031728 A JP2005031728 A JP 2005031728A JP 2005031728 A JP2005031728 A JP 2005031728A JP 4449772 B2 JP4449772 B2 JP 4449772B2
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- power semiconductor
- switching element
- gate
- semiconductor switching
- semiconductor chip
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- H03K17/162—Modifications for eliminating interference voltages or currents in field-effect transistor switches without feedback from the output circuit to the control circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
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- F02P3/0435—Opening or closing the primary coil circuit with electronic switching means with semiconductor devices
- F02P3/0442—Opening or closing the primary coil circuit with electronic switching means with semiconductor devices using digital techniques
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- Semiconductor Integrated Circuits (AREA)
Description
主要な効果については既述したので、この実施例の半導体パワーモジュール100の等価回路図を示す図7を参照して更なる効果を具体的に説明する。Cgcはゲート電極とコレクタ電極との間の静電容量、Cgeはゲート電極とエミッタ電極との間の静電容量、L2はパワー半導体スイッチング素子5、6のポリシリコンゲート電極27とゲート直列抵抗素子8との間のゲート配線35の配線インダクタンス、Csはゲート配線35の対地間寄生容量、36はポリシリコン抵抗領域20と制御用半導体チップ12とを間のゲート配線、Lcはコレクタ電極側のたとえばボンディングワイヤなどの内部配線インダクタンス、Leはエミッタ電極側のたとえばボンディングワイヤなどの内部配線インダクタンス、Loは低位配線の配線インダクタンス、Pはゲート直列抵抗素子8が集積されたIGBT(パワー半導体スイッチング素子)27を収容する樹脂又はセラミックのパッケージである。いま、ポリシリコン抵抗領域20すなわちゲート直列抵抗素子8の電気抵抗が大きいと想定して説明する。
3 電流検出回路
4 駆動回路
5 メインスイッチ部
6 サブスイッチ部
7 電流検出抵抗
8 ゲート直列抵抗素子
9 樹脂モジュール
10 ワイヤボンディング
11 冷却用金属基板(金属ベース)
12 制御用半導体チップ
13 モールド樹脂部
14〜17 端子
19 フィールド絶縁膜
20 ポリシリコン抵抗領域(ゲート直列抵抗素子)
27 ポリシリコンゲート電極
28 エミッタ電極端子
29 ゲート電極端子(制御入力端子部)
30 ゲート接続電極
31 フィールド酸化膜
32 コンタクト開口
33 コンタクト開口
35 ゲート配線
100 半導体パワーモジュール
200 点火コイル
300 直流電源
400 点火プラグ
Claims (6)
- 制御電極としてのゲート電極と、前記ゲート電極に制御電圧を導入するための制御入力端子部とを有してパワー半導体チップに形成され、負荷であるコイルの電流をスイッチングするパワー半導体スイッチング素子において、
所定の電気抵抗値を有して前記パワー半導体チップの絶縁膜上に集積されて前記ゲート電極と前記制御入力端子部とを接続するゲート直列抵抗素子を有し、
前記パワー半導体スイッチング素子は、点火コイルへの通電を制御し、点火プラグの放電を制御するコイル負荷電流断続用のパワートランジスタからなり、
前記ゲート直列抵抗素子は、所定の比抵抗を有して前記パワー半導体チップ表面の絶縁膜を介して、GND電位となる基板側p型領域の直上に形成されたポリシリコン抵抗領域により構成されていることを特徴とするパワー半導体スイッチング素子。 - 請求項1記載のパワー半導体スイッチング素子において、
前記パワー半導体スイッチング素子の電荷注入用の主電極をなす前記パワー半導体チップの低電位電極は、前記パワー半導体チップが内蔵されるパッケージの外部ターミナルにボンディングワイヤにより接続されていることを特徴とするパワー半導体スイッチング素子。 - 請求項1又は2記載のパワー半導体スイッチング素子において、
前記パワー半導体スイッチング素子の前記ゲート電極は、前記パワー半導体チップが内蔵されるパッケージの外部ターミナルにボンディングワイヤにより接続されていることを特徴とするパワー半導体スイッチング素子。 - 請求項3記載のパワー半導体スイッチング素子において、
前記ゲート直列抵抗素子及び前記ゲート電極は、
同一のポリシリコン領域堆積工程により形成されていることを特徴とするパワー半導体スイッチング素子。 - 請求項4記載のパワー半導体スイッチング素子において、
前記ゲート電極は、
前記ゲート直列抵抗素子用のポリシリコン抵抗領域と同一のポリシリコン抵抗領域形成工程により形成されたゲート電極用のポリシリコン抵抗領域に不純物を追加ドープして形成されていることを特徴とするパワー半導体スイッチング素子。 - 請求項1乃至5のいずれか記載のパワー半導体スイッチング素子を有する半導体パワーモジュールにおいて、
前記パワー半導体チップとともに同一のパッケージに封止されるとともに、前記ゲート直列抵抗素子を通じて前記ゲート電極に前記制御電圧を出力する制御用半導体チップを有することを特徴とする半導体パワーモジュール。
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JP2005031728A JP4449772B2 (ja) | 2004-04-09 | 2005-02-08 | パワー半導体スイッチング素子及びそれを用いた半導体パワーモジュール |
US11/101,651 US7800174B2 (en) | 2004-04-09 | 2005-04-08 | Power semiconductor switching-device and semiconductor power module using the device |
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US7436678B2 (en) * | 2004-10-18 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof |
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