TWI397354B - 電容/電阻裝置,併有該裝置之高介電常數有機介電層壓物及印刷線路板,及其製造方法 - Google Patents
電容/電阻裝置,併有該裝置之高介電常數有機介電層壓物及印刷線路板,及其製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title description 9
- 239000003990 capacitor Substances 0.000 claims description 41
- 239000011888 foil Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 229910002113 barium titanate Inorganic materials 0.000 claims description 9
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical group [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000003989 dielectric material Substances 0.000 claims description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000010410 layer Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910019974 CrSi Inorganic materials 0.000 description 1
- CPGKMLVTFNUAHL-UHFFFAOYSA-N [Ca].[Ca] Chemical compound [Ca].[Ca] CPGKMLVTFNUAHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229960005336 magnesium citrate Drugs 0.000 description 1
- 235000002538 magnesium citrate Nutrition 0.000 description 1
- 239000004337 magnesium citrate Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- PLSARIKBYIPYPF-UHFFFAOYSA-H trimagnesium dicitrate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O PLSARIKBYIPYPF-UHFFFAOYSA-H 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
- H01C7/005—Polymer thick films
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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Description
本發明之技術領域係關於具有電容及電阻兩種功能之裝置,及將此等裝置併入有機介電層壓物及印刷線路板之方法。
電容器及電阻器可串聯使用於在積體電路(IC)裝置之間延伸之訊號跡線的傳輸線路終端。該等電容器及電阻器用以使IC裝置之阻抗與線路相匹配,或用以減少或去除訊號反射。某些電路為連續負載電路,且其使用一與該線路並聯之電阻器。非連續負載電路具有串聯之電阻器及電容器,並可用於低功率積體電路(IC)。圖1示意性說明先前技術中已知之IC裝置10及20之非連續負載終端。
在圖1中,自a至b之距離通常較短。電阻器R之值選取為與線路阻抗相匹配且通常約為45-80歐姆。選取電容器C之值以使得串聯之電阻器R及電容器C之RC時間常數大於訊號之上升時間並小於訊號脈衝之總時間。一般之電容值大約為30微微法拉。
習知之RC終端一般由表面黏著技術(SMT)電阻器及電容器構成。圖2為印刷電路板25之部分橫截面圖,此印刷電路板25具有連接至IC裝置30以形成該IC 30之習知之SMT RC傳輸線路終端之SMT電阻器40及SMT電容器50。載運訊號至IC 30之訊號線路連接至電路跡線60,此電路跡線60將IC裝置30連接至電阻器40。電容器50藉由一
對焊墊52與焊點58之一者耦接至電路跡線70。電阻器40藉由焊墊42及焊點48耦接至電路跡線70。電容器50藉由另一焊墊58及電路跡線59耦接至通路電洞80。此配置置放電阻器40及電容器50與訊號線路串聯,並通過鍍通孔通路80連接至地。此習知之表面黏著方法要求使用貴重之表面不動體。此外,對焊點之要求降低了可靠性並增加了製造成本。
根據一第一實施例,一種電容/電阻裝置包含:一第一電極,安置於該第一電極上之一介電質,及安置於一第二電極上並與該介電質鄰接之一電阻元件,其中該介電質包含一填充有高介電常數粉末相的聚合物。可將該電容/電阻裝置嵌入有機介電層壓物,並併入印刷線路板。
根據上述實施例,可將電阻器及電容器兩種功能整合至單一內埋層壓物,從而降低建立該電阻及電容功能之成本及難度。當該電容/電阻裝置併入印刷線路板時,嵌入該電容/電阻裝置亦釋放貴重之不動體。此外,可去除與SMT裝置相關聯之焊點,藉此可改良可靠性。使用習知之蝕刻方法可加工該電容/電阻裝置,從而可進一步降低生產成本。
閱讀實施例之下述詳細描述後,彼等熟習此項技術者將瞭解上述優勢以及本發明之多個額外實施例之其它優勢及益處。
本發明之具體實施例係處理可內埋入印刷線路板(PWB)之基板中的電容/電阻裝置。在該PWB基板中提供電容及電阻功能可保存印刷線路板上之貴重之表面不動體。本發明之實施例亦要求比習知之SMT終端配置較少之焊點。
圖3為印刷線路板2000的部分剖面圖。印刷線路板區2000包括一RC傳輸線路終端,其中將電阻器功能及電容器功能整合至單一電容/電阻裝置200內。裝置200包含底部電極210,介電質220,電阻器元件230,上電極或上方板240,及導電跡線245。裝置200在單一層壓結構中提供電阻及電容功能(藉由括號201整體表示)。裝置200藉由導電電路跡線245、延伸通過介電質280之鍍通孔通路250,及一導電電路跡線260耦接至IC裝置270。IC裝置270可藉由焊墊272及焊點274連接至導電電路跡線260。導電電路跡線211可自底部電極210延伸以連接至地或其它電路。
圖4A-4F說明製造包括裝置200之層壓物的方法。圖4A為製造之第一階段的前視剖面圖,此階段中提供第一及第二金屬箔片212、242。第二金屬箔片242具有一層電阻材料232。電阻材料232可為(例如)鎳磷(NiP)、鉻矽(CrSi)、鎳鉻(NiCr)或其它可鍍、濺射或另外之方式沉積至第二金屬箔片242表面上之電阻材料。第一及第二金屬箔片212、242可由(例如)銅、銅基材料,及其它金屬製成。
可將高介電常數漿料澆鑄或塗覆至第一箔片212上並
將其固化,從而形成第一介電質222。類似地,第二介電質226可由類似之方式形成至電阻材料層232之表面上的第二箔片242上。漿料材料可包含(例如)具有高介電常數("高K")填充料或功能相的聚合物-溶劑溶液。適合於漿料或溶液之聚合物可包括(例如)環氧或聚醯亞胺樹脂。高K功能相可界定為具有大於500之介電常數之材料並可包含通式為ABO 3之鈣鈦礦。適合之填充料包括(例如)結晶鈦酸鋇(BT)、鈦酸鍶鋇(BST)、鋯鈦酸鉛(PZT)、鈦酸鉛鑭、鋯鈦酸鉛鑭(PLZT)、鈮酸鉛鎂(PMN),及鈦酸鈣銅及其混合物。填充物可為粉末之形式。
可將薄黏接層227施加至介電質222、226(如圖4中所展示,在層222上)中之任一者之一個或兩個表面上。黏接層227可由(例如)熱塑性聚合物形成,且可用高介電相填充以避免介電常數減損。接著,兩種結構在如圖4A中所示之箭頭方向層壓至一起。
參看圖4B,層壓材料自層222、226及227形成單一介電質220。此介電質可具有一在5至40之範圍內之介電常數。黏接層227有利於在疊層製程期間接合介電質222及226。然而,若介電質222及226在層壓之前僅部分固化,或其具有熱塑性性質以使得一旦層壓則一合適之溫度及壓力將足以軟化樹脂,以使得層224及226可在無黏接劑之情況下黏結,則可省去黏接層227。圖4B中所展示之結構亦可藉由僅在箔片212及242之一者上澆鑄漿料並將另一箔片層壓至此固化或部分固化之漿料上形成。然而另一替代方法可為,形成固化或部分固化漿料220之獨
立薄膜,並將箔片212及242層壓至聚合薄膜220之兩側。
將一光阻材料(圖4B中未展示)施加至箔片212,且影像化並蝕刻此箔片212,並使用標準印刷線路板處理條件將剩餘之光阻材料剝離。圖4C為沿圖4D中之線4C-4C剖開之所得物品的仰視剖面圖。參看圖4C,蝕刻製成裝置200之底部電極210及導電電路跡線211。
圖4D為沿圖4C中線4D-4D剖開的部分前視剖面圖。參看圖4D,將所得物品之底部電極210一側層壓至層壓材料282。例如,該層壓材料可在標準印刷線路板製程中藉由FR4半固化片或其它半固化片製造。
將一光阻材料(圖4D中未展示)施加至箔片242,且影像化並蝕刻箔片242,並將剩餘之光阻材料剝離。圖4E為沿圖4F中線4E-4E剖開之所得物品的俯視剖面圖。圖4F為沿圖4E中線4F-4F之前視剖面圖。參看圖4E及4F,蝕刻製成裝置200之上電極240及導電電路跡線245。蝕刻亦製成間隙248。
可重新施加一光阻材料(圖4E及圖4F中未展示),且使用移除電阻材料之蝕刻溶液可影像化並蝕刻電阻材料232。以此方式,可選擇性地蝕刻電阻材料層232以形成具有所要之形狀及尺寸的電阻元件230。所得之電阻元件230橋接間隙248並在上導體240與導電跡線245之間延伸。
參看圖4F,介電質280層壓至介電質282之組件側,
從而形成層壓結構201。接著,可使用習知之層壓材料及通道形成方法將層壓結構201併入(例如)印刷線路板。
實例1:參看圖3討論裝置200之此實例。在此實例中,圖4B所展示之初始層壓結構由鍍有電阻材料232之銅箔242組成,其中電阻材料232由薄片電阻率為50歐姆每平方之鎳磷合金組成。介電質220為一填充鈦酸鋇之熱塑性聚醯亞胺。因為鈦酸鋇易於使用且不含鉛,所以其有利於作為一種填充物。介電質220為14微米厚,且具有值為11之介電常數,藉此形成4.5毫微法拉每平方英吋之電容密度。
30微微法拉之傳輸線路終端所需要之電容器尺寸(當自俯視平面透視圖觀看時)為4.3平方毫米,或約為2毫米乘2毫米。電極210及240由蝕刻銅箔212及242形成。上述電容器易製成相對高之容限。
只要長寬比保持在1.2至1.0,此實例中之標稱60歐姆電阻值之電阻器的尺寸可以改變。
實例2:參看圖3討論裝置200之此實例。在此實例中,圖4B中所展示之初始層壓結構由鍍有電阻材料232之銅箔242組成,電阻材料232由薄片電阻率為50歐姆每平方之鎳磷合金組成。介電質220為一填充鈦酸鋇之熱塑性聚醯亞胺。因為鈦酸鋇易於使用且不含鉛,所以其有利於作為一種填充物。介電質220為8微米厚,且具有一值為11之介電常數,藉此形成6.2毫微法拉每平方英吋之電容密度。
30微微法拉之傳輸線路終端所需要之電容器之尺寸(當自俯視平面透視圖觀看時)為3.1平方毫米,或約為1.77毫米乘1.77毫米。電極210及240由蝕刻銅箔212及242形成。上述電容器易製成相對高之容限。
只要長寬比保持在1.2至1.0,此實例中之標稱60歐姆電阻值之電阻器的尺寸可以改變。
根據上述實施例,組合電阻器之高介電常數薄電容器層壓結構可用以減小內埋電容器功能的尺寸且用以更有效地埋入RC傳輸線路終端。嵌入電容器及電阻器功能釋放貴重之基板表面不動體並去除與SMT裝置相關聯之焊點,藉此改良可靠性。此外,可使用降低生產成本之習知之蝕刻方法加工在層壓物內部組合電阻及電容的層壓物。
上述實施例亦向電路設計者及PWB製造者提供其它選擇。例如,一片層壓物可用以嵌入多個離散電阻器及多個離散電容器,從而可降低與連接電阻器與電容器相關聯之電感。
在俯視平面圖中,電容器實施例之形狀一般為長方形。然而,電容器電極、介電質、及其它組件與層可具有其它規則或不規則之表面區域形狀,例如,圓形、長方形、橢圓形或多邊形之形狀。
單一電容/電阻裝置200形成於上述之每一層壓結構201中。然而,平板結構及印刷線路板可包括大量不同類型及配置之個別電容/電阻裝置。
在上述實施例中,將電阻、電容及電感相結合以產生一特定電路阻抗(通常藉由大寫字母Z加以識別)。可構造該電阻及電容以達成一特定阻抗。改變電阻、電容,或兩者將改變電感。可控制所有三種改變以界定最終之阻抗。換言之,可"調整"層壓物之阻抗。
本發明之前述描述說明並描述本發明。額外地,揭示內容僅展示並描述本發明選定之較佳實施例,但應瞭解本發明能夠用於多各種其它組合、修改、及環境,且在本文表達之與上述教示相應之本發明概念之範疇內,及/或在相關技術之技術或知識內,能夠改變或修改。
本文上述之實施例之進一步目的是意欲說明實施本發明之已知之最佳模式,及使其它熟知此項技術者能夠在此或其它實例及本發明之特殊應用或使用所要求之修改中利用本發明。相應地,此描述並非意欲限制本發明為本文所揭示之形式。同樣,希望附加之申請專利範圍解釋為包括替代性實施例,而並非明確地界定在詳細描述中。
10‧‧‧IC裝置
20‧‧‧IC裝置
25‧‧‧印刷電路板
30‧‧‧IC裝置
40‧‧‧SMT電阻器或電阻
42‧‧‧焊墊
48‧‧‧焊墊
50‧‧‧SMT電容器或電容器
52‧‧‧焊墊
58‧‧‧焊點
59‧‧‧電路跡線
60‧‧‧電路跡線
70‧‧‧電路跡線
80‧‧‧通路電洞
200‧‧‧電容/電阻裝置
201‧‧‧層壓結構
210‧‧‧底部電極
211‧‧‧導電電路跡線
212‧‧‧第一金屬箔片
220‧‧‧介電質
222‧‧‧第一介電質
226‧‧‧第二介電質
227‧‧‧黏接層
230‧‧‧電阻元件
232‧‧‧電阻材料
240‧‧‧上電極
242‧‧‧第二金屬箔片
245‧‧‧導電電路跡線
248‧‧‧間隙
250‧‧‧鍍通孔通路
260‧‧‧導電電路跡線
270‧‧‧IC裝置
272‧‧‧焊墊
274‧‧‧焊點
280‧‧‧介電質
282‧‧‧層壓材料
2000‧‧‧印刷線路板
圖1為習知之(先前技術)具有一串聯之電阻器及電容器之非連續負載終端的示意性說明;圖2為一印刷線路板之橫截面圖,此印刷線路板具有積體電路裝置之習知之(先前技術)SMT RC傳輸線路終端;圖3為印刷線路板的部分截面圖,此印刷線路板具有根據第二實施例之一嵌入電容/電阻裝置;及圖4A-4F說明根據本發明之製造層壓結構之一種方法,
此層壓結構包括圖3中所展示之電容/電阻裝置。
200‧‧‧電容/電阻裝置
201‧‧‧層壓結構
210‧‧‧底部電極
211‧‧‧導電電路跡線
220‧‧‧介電質
230‧‧‧電阻元件
240‧‧‧上電極或上方板
245‧‧‧導電電路跡線
250‧‧‧鍍通孔通路
260‧‧‧導電電路跡線
270‧‧‧IC裝置
272‧‧‧焊墊
274‧‧‧焊點
280‧‧‧介電質
282‧‧‧層壓材料
2000‧‧‧印刷電路板
Claims (5)
- 一種包含電容/電阻裝置之層壓結構,其包含:一第一金屬箔;安置於該第一金屬箔上之一介電層;一第二金屬箔;形成於該第二金屬箔上並具有兩個相對表面之一電阻層,其中該電阻層之兩個相對表面之其一接觸該介電層,蝕刻該第一金屬箔以形成一第一電極,蝕刻該第二金屬箔以分別形成一第二電極及一導電跡線,該第一電極、該介電層以及該第二電極形成一電容,其中,該電阻層之兩個相對表面之至少一部份同時接觸該第二電極及該導電跡線以形成一電阻元件,該電阻元件接觸該介電層,該介電層包含一填充有一高介電常數粉末相之聚合物,該介電質之一厚度為8至25微米,該介電質之一介電常數處於5至40之間,該介電層係由覆蓋一包括高分子聚合物、溶劑以及高介電常數粉末相之介電膏於該第一金屬箔、該第二金屬箔或同時於該第一金屬箔與該第二金屬箔所形成,其中該電容以及該電阻元件層壓及埋設於至少二個印刷線路板介電壓層內。
- 如請求項1之層壓結構,其中該電阻層安置於該介電層與該第二電極之間。
- 如請求項1之層壓結構,其中該介電層包含聚醯亞胺高分子聚合物。
- 如請求項1之層壓結構,其中該高介電常數粉末相之聚合物選自鈦酸鋇、鈦酸鍶鋇、鋯鈦酸鉛、鋯鈦酸鉛鑭、鈦酸鉛鎂、鈦酸鈣銅及其混合物。
- 一種印刷線路板,其包含:至少一個如請求項1之層壓結構;及至少一個IC裝置,其安置於該印刷線路板之一上表面上, 其中該IC裝置電耦接至該電容/電阻裝置。
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