JP2006510233A5 - - Google Patents

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Publication number
JP2006510233A5
JP2006510233A5 JP2005508337A JP2005508337A JP2006510233A5 JP 2006510233 A5 JP2006510233 A5 JP 2006510233A5 JP 2005508337 A JP2005508337 A JP 2005508337A JP 2005508337 A JP2005508337 A JP 2005508337A JP 2006510233 A5 JP2006510233 A5 JP 2006510233A5
Authority
JP
Japan
Prior art keywords
electrode
forming
circuit conductor
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005508337A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006510233A (ja
Filing date
Publication date
Priority claimed from US10/663,551 external-priority patent/US20040108134A1/en
Application filed filed Critical
Priority claimed from PCT/US2003/040326 external-priority patent/WO2004056160A1/en
Publication of JP2006510233A publication Critical patent/JP2006510233A/ja
Publication of JP2006510233A5 publication Critical patent/JP2006510233A5/ja
Pending legal-status Critical Current

Links

JP2005508337A 2002-12-13 2003-12-12 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 Pending JP2006510233A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US44310502P 2002-12-13 2002-12-13
US10/663,551 US20040108134A1 (en) 2002-10-11 2003-09-16 Printed wiring boards having low inductance embedded capacitors and methods of making same
PCT/US2003/040326 WO2004056160A1 (en) 2002-12-13 2003-12-12 Printed wiring boards having low inductance embedded capacitors and methods of making same

Publications (2)

Publication Number Publication Date
JP2006510233A JP2006510233A (ja) 2006-03-23
JP2006510233A5 true JP2006510233A5 (enExample) 2006-05-25

Family

ID=32600307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005508337A Pending JP2006510233A (ja) 2002-12-13 2003-12-12 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法

Country Status (4)

Country Link
EP (1) EP1570713A1 (enExample)
JP (1) JP2006510233A (enExample)
KR (1) KR100713731B1 (enExample)
WO (1) WO2004056160A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100619367B1 (ko) 2004-08-26 2006-09-08 삼성전기주식회사 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법
JP4579673B2 (ja) * 2004-12-24 2010-11-10 日本特殊陶業株式会社 電子部品及びその製造方法、電子部品付き配線基板
EP1833286A1 (en) * 2004-12-28 2007-09-12 Ngk Spark Plug Co., Ltd Wiring board and wiring board manufacturing method
JP4667070B2 (ja) * 2005-02-23 2011-04-06 日本特殊陶業株式会社 配線基板及び配線基板の製造方法
JP4718314B2 (ja) * 2005-12-07 2011-07-06 日本特殊陶業株式会社 誘電体積層構造体、その製造方法、及び配線基板
JP6152254B2 (ja) * 2012-09-12 2017-06-21 新光電気工業株式会社 半導体パッケージ、半導体装置及び半導体パッケージの製造方法
US9337073B2 (en) * 2013-03-12 2016-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. 3D shielding case and methods for forming the same
JP6151616B2 (ja) * 2013-09-27 2017-06-21 京セラ株式会社 電子部品搭載用基板および電子装置
JP6737118B2 (ja) 2016-10-11 2020-08-05 Tdk株式会社 薄膜コンデンサ
JP6805702B2 (ja) 2016-10-11 2020-12-23 Tdk株式会社 薄膜コンデンサ
JP2018063989A (ja) 2016-10-11 2018-04-19 Tdk株式会社 薄膜キャパシタ
CN117711816B (zh) 2023-12-28 2024-10-29 上海理工大学 一种类水波纹扩散同心环状电容芯子低电感电容器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2764745B2 (ja) * 1989-07-21 1998-06-11 オムロン株式会社 混成回路基板およびその製造方法
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
EP1265466A3 (en) * 2001-06-05 2004-07-21 Dai Nippon Printing Co., Ltd. Method for fabrication wiring board provided with passive element and wiring board provided with passive element

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