JP2006510233A - 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 - Google Patents

低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 Download PDF

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Publication number
JP2006510233A
JP2006510233A JP2005508337A JP2005508337A JP2006510233A JP 2006510233 A JP2006510233 A JP 2006510233A JP 2005508337 A JP2005508337 A JP 2005508337A JP 2005508337 A JP2005508337 A JP 2005508337A JP 2006510233 A JP2006510233 A JP 2006510233A
Authority
JP
Japan
Prior art keywords
electrode
forming
dielectric
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005508337A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006510233A5 (enExample
Inventor
ウィリアム　ジェイ．ボーランド
ファーガソン ソウル
アール．マクグリゴー デビッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/663,551 external-priority patent/US20040108134A1/en
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2006510233A publication Critical patent/JP2006510233A/ja
Publication of JP2006510233A5 publication Critical patent/JP2006510233A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2005508337A 2002-12-13 2003-12-12 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法 Pending JP2006510233A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US44310502P 2002-12-13 2002-12-13
US10/663,551 US20040108134A1 (en) 2002-10-11 2003-09-16 Printed wiring boards having low inductance embedded capacitors and methods of making same
PCT/US2003/040326 WO2004056160A1 (en) 2002-12-13 2003-12-12 Printed wiring boards having low inductance embedded capacitors and methods of making same

Publications (2)

Publication Number Publication Date
JP2006510233A true JP2006510233A (ja) 2006-03-23
JP2006510233A5 JP2006510233A5 (enExample) 2006-05-25

Family

ID=32600307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005508337A Pending JP2006510233A (ja) 2002-12-13 2003-12-12 低インダクタンス埋め込みキャパシタを有するプリント配線板およびその製造方法

Country Status (4)

Country Link
EP (1) EP1570713A1 (enExample)
JP (1) JP2006510233A (enExample)
KR (1) KR100713731B1 (enExample)
WO (1) WO2004056160A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014056925A (ja) * 2012-09-12 2014-03-27 Shinko Electric Ind Co Ltd 半導体パッケージ、半導体装置及び半導体パッケージの製造方法
JP2015070047A (ja) * 2013-09-27 2015-04-13 京セラ株式会社 電子部品搭載用基板および電子装置
US10153092B2 (en) 2016-10-11 2018-12-11 Tdk Corporation Thin-film capacitor
US10319524B2 (en) 2016-10-11 2019-06-11 Tdk Corporation Thin-film capacitor
US10529495B2 (en) 2016-10-11 2020-01-07 Tdk Corporation Thin-film capacitor

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100619367B1 (ko) 2004-08-26 2006-09-08 삼성전기주식회사 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법
JP4579673B2 (ja) * 2004-12-24 2010-11-10 日本特殊陶業株式会社 電子部品及びその製造方法、電子部品付き配線基板
TWI295089B (en) * 2004-12-28 2008-03-21 Ngk Spark Plug Co Wiring substrate and the manufacturing method of the same
JP4667070B2 (ja) * 2005-02-23 2011-04-06 日本特殊陶業株式会社 配線基板及び配線基板の製造方法
JP4718314B2 (ja) * 2005-12-07 2011-07-06 日本特殊陶業株式会社 誘電体積層構造体、その製造方法、及び配線基板
US9337073B2 (en) * 2013-03-12 2016-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. 3D shielding case and methods for forming the same
CN117711816B (zh) * 2023-12-28 2024-10-29 上海理工大学 一种类水波纹扩散同心环状电容芯子低电感电容器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2764745B2 (ja) * 1989-07-21 1998-06-11 オムロン株式会社 混成回路基板およびその製造方法
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
EP1265466A3 (en) * 2001-06-05 2004-07-21 Dai Nippon Printing Co., Ltd. Method for fabrication wiring board provided with passive element and wiring board provided with passive element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014056925A (ja) * 2012-09-12 2014-03-27 Shinko Electric Ind Co Ltd 半導体パッケージ、半導体装置及び半導体パッケージの製造方法
JP2015070047A (ja) * 2013-09-27 2015-04-13 京セラ株式会社 電子部品搭載用基板および電子装置
US10153092B2 (en) 2016-10-11 2018-12-11 Tdk Corporation Thin-film capacitor
US10319524B2 (en) 2016-10-11 2019-06-11 Tdk Corporation Thin-film capacitor
US10529495B2 (en) 2016-10-11 2020-01-07 Tdk Corporation Thin-film capacitor

Also Published As

Publication number Publication date
KR20050084258A (ko) 2005-08-26
EP1570713A1 (en) 2005-09-07
KR100713731B1 (ko) 2007-05-04
WO2004056160A1 (en) 2004-07-01

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