KR100713731B1 - 낮은 인덕턴스의 내장 커패시터를 구비한 인쇄 배선 기판및 그 제조 방법 - Google Patents

낮은 인덕턴스의 내장 커패시터를 구비한 인쇄 배선 기판및 그 제조 방법 Download PDF

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Publication number
KR100713731B1
KR100713731B1 KR1020057010657A KR20057010657A KR100713731B1 KR 100713731 B1 KR100713731 B1 KR 100713731B1 KR 1020057010657 A KR1020057010657 A KR 1020057010657A KR 20057010657 A KR20057010657 A KR 20057010657A KR 100713731 B1 KR100713731 B1 KR 100713731B1
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KR
South Korea
Prior art keywords
electrode
printed wiring
innerlayer
forming
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020057010657A
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English (en)
Korean (ko)
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KR20050084258A (ko
Inventor
윌리암 제이. 보랜드
사울 페구슨
데이빗 알. 맥그레고어
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Priority claimed from US10/663,551 external-priority patent/US20040108134A1/en
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Publication of KR20050084258A publication Critical patent/KR20050084258A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020057010657A 2002-12-13 2003-12-12 낮은 인덕턴스의 내장 커패시터를 구비한 인쇄 배선 기판및 그 제조 방법 Expired - Fee Related KR100713731B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44310502P 2002-12-13 2002-12-13
US60/443,105 2002-12-13
US10/663,551 2003-09-16
US10/663,551 US20040108134A1 (en) 2002-10-11 2003-09-16 Printed wiring boards having low inductance embedded capacitors and methods of making same

Publications (2)

Publication Number Publication Date
KR20050084258A KR20050084258A (ko) 2005-08-26
KR100713731B1 true KR100713731B1 (ko) 2007-05-04

Family

ID=32600307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057010657A Expired - Fee Related KR100713731B1 (ko) 2002-12-13 2003-12-12 낮은 인덕턴스의 내장 커패시터를 구비한 인쇄 배선 기판및 그 제조 방법

Country Status (4)

Country Link
EP (1) EP1570713A1 (enExample)
JP (1) JP2006510233A (enExample)
KR (1) KR100713731B1 (enExample)
WO (1) WO2004056160A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100619367B1 (ko) 2004-08-26 2006-09-08 삼성전기주식회사 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법
JP4579673B2 (ja) * 2004-12-24 2010-11-10 日本特殊陶業株式会社 電子部品及びその製造方法、電子部品付き配線基板
TWI295089B (en) * 2004-12-28 2008-03-21 Ngk Spark Plug Co Wiring substrate and the manufacturing method of the same
JP4667070B2 (ja) * 2005-02-23 2011-04-06 日本特殊陶業株式会社 配線基板及び配線基板の製造方法
JP4718314B2 (ja) * 2005-12-07 2011-07-06 日本特殊陶業株式会社 誘電体積層構造体、その製造方法、及び配線基板
JP6152254B2 (ja) * 2012-09-12 2017-06-21 新光電気工業株式会社 半導体パッケージ、半導体装置及び半導体パッケージの製造方法
US9337073B2 (en) * 2013-03-12 2016-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. 3D shielding case and methods for forming the same
JP6151616B2 (ja) * 2013-09-27 2017-06-21 京セラ株式会社 電子部品搭載用基板および電子装置
JP6805702B2 (ja) 2016-10-11 2020-12-23 Tdk株式会社 薄膜コンデンサ
JP2018063989A (ja) 2016-10-11 2018-04-19 Tdk株式会社 薄膜キャパシタ
JP6737118B2 (ja) 2016-10-11 2020-08-05 Tdk株式会社 薄膜コンデンサ
CN117711816B (zh) * 2023-12-28 2024-10-29 上海理工大学 一种类水波纹扩散同心环状电容芯子低电感电容器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2764745B2 (ja) * 1989-07-21 1998-06-11 オムロン株式会社 混成回路基板およびその製造方法
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
EP1265466A3 (en) * 2001-06-05 2004-07-21 Dai Nippon Printing Co., Ltd. Method for fabrication wiring board provided with passive element and wiring board provided with passive element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article

Also Published As

Publication number Publication date
KR20050084258A (ko) 2005-08-26
EP1570713A1 (en) 2005-09-07
JP2006510233A (ja) 2006-03-23
WO2004056160A1 (en) 2004-07-01

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