JP2020503606A5 - - Google Patents
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- Publication number
- JP2020503606A5 JP2020503606A5 JP2019531057A JP2019531057A JP2020503606A5 JP 2020503606 A5 JP2020503606 A5 JP 2020503606A5 JP 2019531057 A JP2019531057 A JP 2019531057A JP 2019531057 A JP2019531057 A JP 2019531057A JP 2020503606 A5 JP2020503606 A5 JP 2020503606A5
- Authority
- JP
- Japan
- Prior art keywords
- fingerprint sensing
- cover structure
- fingerprint
- sensing module
- sensing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011111 cardboard Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022071629A JP7289956B2 (ja) | 2016-12-15 | 2022-04-25 | 指紋感知モジュール及びその方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE1651654 | 2016-12-15 | ||
| SE1651654-4 | 2016-12-15 | ||
| PCT/SE2017/051210 WO2018111174A1 (en) | 2016-12-15 | 2017-12-04 | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022071629A Division JP7289956B2 (ja) | 2016-12-15 | 2022-04-25 | 指紋感知モジュール及びその方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020503606A JP2020503606A (ja) | 2020-01-30 |
| JP2020503606A5 true JP2020503606A5 (enExample) | 2020-11-12 |
| JP7065094B2 JP7065094B2 (ja) | 2022-05-11 |
Family
ID=60781507
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019531057A Active JP7065094B2 (ja) | 2016-12-15 | 2017-12-04 | 指紋感知モジュール及びその方法 |
| JP2022071629A Active JP7289956B2 (ja) | 2016-12-15 | 2022-04-25 | 指紋感知モジュール及びその方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022071629A Active JP7289956B2 (ja) | 2016-12-15 | 2022-04-25 | 指紋感知モジュール及びその方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10395164B2 (enExample) |
| EP (2) | EP3564852B1 (enExample) |
| JP (2) | JP7065094B2 (enExample) |
| KR (1) | KR102468554B1 (enExample) |
| CN (2) | CN207601824U (enExample) |
| WO (1) | WO2018111174A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180165495A1 (en) * | 2016-12-09 | 2018-06-14 | Fingerprint Cards Ab | Electronic device |
| US11610429B2 (en) | 2016-12-15 | 2023-03-21 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| US11023702B2 (en) | 2016-12-15 | 2021-06-01 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| US10395164B2 (en) * | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
| FR3069081B1 (fr) * | 2017-07-17 | 2021-08-20 | Safran Identity & Security | Carte electronique comprenant un capteur d'empreinte et procede de fabrication d'une telle carte |
| WO2019014883A1 (zh) * | 2017-07-20 | 2019-01-24 | 深圳市汇顶科技股份有限公司 | 芯片封装结构、芯片模组及电子终端 |
| US10509936B2 (en) * | 2017-08-28 | 2019-12-17 | Superc-Touch Corporation | Fingerprint identification apparatus having conductive structure |
| US20200051938A9 (en) * | 2017-12-18 | 2020-02-13 | China Wafer Level Csp Co., Ltd. | Fingerprint chip packaging method and fingerprint chip package |
| TWI705538B (zh) * | 2018-06-29 | 2020-09-21 | 同欣電子工業股份有限公司 | 指紋感測封裝模組的製法 |
| USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
| CN109496315B (zh) * | 2018-10-26 | 2022-05-03 | 深圳市汇顶科技股份有限公司 | 指纹检测打码装置、指纹检测系统和电子设备 |
| SG10201902933WA (en) * | 2019-04-01 | 2020-11-27 | Advanide Holdings Pte Ltd | An improved card with fingerprint biometrics |
| FR3095287B1 (fr) | 2019-04-19 | 2022-11-04 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
| FR3095285B1 (fr) | 2019-04-19 | 2022-11-11 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
| FR3095536B1 (fr) | 2019-04-25 | 2021-09-24 | Idemia Identity & Security France | Module de carte à microcircuit avec capteur d’empreinte digitale et coque de protection |
| KR102138671B1 (ko) * | 2019-05-14 | 2020-08-11 | (주)비티비엘 | 지문센서부가 개선된 스마트카드 |
| US20210081743A1 (en) | 2019-08-12 | 2021-03-18 | Federal Card Services, LLC | Dual interface metal cards and methods of manufacturing |
| US12277462B2 (en) | 2019-08-14 | 2025-04-15 | Federal Card Services, LLC | Metal-containing dual interface smartcards |
| US11113593B2 (en) | 2019-08-15 | 2021-09-07 | Federal Card Services; LLC | Contactless metal cards with fingerprint sensor and display |
| CN110458143B (zh) * | 2019-08-21 | 2022-04-15 | 京东方科技集团股份有限公司 | 指纹识别装置、进行指纹识别的方法以及电子设备 |
| US11341385B2 (en) | 2019-11-16 | 2022-05-24 | Federal Card Services, LLC | RFID enabled metal transaction card with shaped opening and shaped slit |
| EP3836010B1 (en) * | 2019-12-12 | 2024-07-24 | Fingerprint Cards Anacatum IP AB | A biometric sensor module for card integration |
| US11055683B1 (en) * | 2020-04-02 | 2021-07-06 | Capital One Services, Llc | Computer-based systems involving fingerprint or biometrically-activated transaction cards and methods of use thereof |
| FR3111215B1 (fr) * | 2020-06-04 | 2022-08-12 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
| EP3933697B1 (en) * | 2020-07-01 | 2022-06-15 | Fingerprint Cards Anacatum IP AB | Biometric imaging module and method for manufacturing a biometric imaging module |
| WO2022086624A1 (en) * | 2020-10-23 | 2022-04-28 | Visa International Service Association | Integrated biometric sensor and memory for biometric card |
| SE2051294A1 (en) | 2020-11-06 | 2022-05-07 | Fingerprint Cards Anacatum Ip Ab | Integrated biometric sensor module and method for manufacturing a smartcard comprising an integrated biometric sensor module |
| KR20240018865A (ko) | 2022-08-03 | 2024-02-14 | 삼성전자주식회사 | 지문 센서 패키지 및 이를 포함하는 스마트 카드 |
| WO2024049340A1 (en) * | 2022-08-29 | 2024-03-07 | Fingerprint Cards Anacatum Ip Ab | Biometric imaging device and method for manufacturing the biometric imaging device |
| FR3144885A1 (fr) | 2023-01-09 | 2024-07-12 | Linxens Holding | Module de carte à puce renforcé et procédé de fabrication d’une telle carte à puce |
| KR102758876B1 (ko) * | 2023-09-27 | 2025-01-23 | 주식회사 이터널 | 전원 공급 필름 및 이러한 전원 공급 필름을 이용한 지문 인식 카드의 사용자 지문 등록 방법 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3769332B2 (ja) * | 1996-09-13 | 2006-04-26 | 大日本印刷株式会社 | Icカードの製造方法 |
| DE19921231A1 (de) | 1999-05-07 | 2000-11-09 | Giesecke & Devrient Gmbh | Fingerabdrucksensor für Chipkarte |
| FR2797075B1 (fr) | 1999-07-26 | 2001-10-12 | Gemplus Card Int | Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard |
| KR20030060894A (ko) | 2000-09-19 | 2003-07-16 | 나노피어스 테크놀러지스, 인코포레이티드 | 무선 주파수 인식 장치의 소자와 안테나 어셈블리 방법 |
| NO316776B1 (no) | 2001-12-07 | 2004-05-03 | Idex Asa | Pakkelosning for fingeravtrykksensor |
| DE10221214A1 (de) * | 2002-05-13 | 2003-11-27 | Orga Kartensysteme Gmbh | Chipmodul |
| US6924496B2 (en) * | 2002-05-31 | 2005-08-02 | Fujitsu Limited | Fingerprint sensor and interconnect |
| CZ2005209A3 (cs) | 2002-09-10 | 2005-12-14 | Ivi Smart Technologies, Inc. | Bezpečné biometrické ověření identity |
| JP4904769B2 (ja) * | 2005-10-21 | 2012-03-28 | 富士通セミコンダクター株式会社 | 半導体装置 |
| CN100590643C (zh) * | 2007-01-17 | 2010-02-17 | 南茂科技股份有限公司 | 指纹辨识器的薄膜封装构造 |
| JP2010122015A (ja) * | 2008-11-18 | 2010-06-03 | Fujitsu Ltd | センサユニット及び電子装置の製造方法 |
| NO20093601A1 (no) * | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
| CN102918546B (zh) * | 2010-04-15 | 2016-05-11 | 苹果公司 | 包括电容透镜的手指传感器及其相关方法 |
| AU2011268185B2 (en) * | 2010-06-18 | 2013-11-21 | Apple Inc. | Finger sensor including encapsulating layer over sensing area and related methods |
| US8717775B1 (en) * | 2010-08-02 | 2014-05-06 | Amkor Technology, Inc. | Fingerprint sensor package and method |
| KR20120019729A (ko) * | 2010-08-26 | 2012-03-07 | (주)바이오스마트 | 스폿 용접을 이용하여 제조된 ic 카드 및 그 제조 방법 |
| JP5069342B2 (ja) | 2010-09-01 | 2012-11-07 | エイエスディ株式会社 | 指紋読み取りセンサ付icカードとその製造方法 |
| US9158958B2 (en) * | 2010-10-28 | 2015-10-13 | Synaptics Incorporated | Signal strength enhancement in a biometric sensor array |
| GB201208680D0 (en) * | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
| AP2015008710A0 (en) * | 2013-01-29 | 2015-08-31 | Mary Grace | Smart card and smart card system with enhanced security features |
| WO2015013530A1 (en) * | 2013-07-24 | 2015-01-29 | Synaptics Incorporated | Signal strength enhancement in a biometric sensor array |
| US9582704B2 (en) * | 2013-08-23 | 2017-02-28 | Fingerprint Cards Ab | Connection pads for a fingerprint sensing device |
| TWI534962B (zh) * | 2013-12-09 | 2016-05-21 | 茂丞科技股份有限公司 | 具有外觀隱藏的耦合電極之近接式感測器及其製造方法 |
| DE102013113901B3 (de) * | 2013-12-12 | 2015-01-08 | Innenministerium des Landes Schleswig-Holstein, vertreten durch den Innenminister | Verfahren zum Sichtbarmachen von Fingerabdrücken |
| US9520697B2 (en) * | 2014-02-10 | 2016-12-13 | Soraa Laser Diode, Inc. | Manufacturable multi-emitter laser diode |
| TWI530885B (zh) * | 2014-03-18 | 2016-04-21 | 茂丞科技股份有限公司 | 具有外露顏料層之全平面感測器及使用其之電子裝置 |
| US9576177B2 (en) * | 2014-12-11 | 2017-02-21 | Fingerprint Cards Ab | Fingerprint sensing device |
| US9449212B2 (en) * | 2014-12-22 | 2016-09-20 | Fingerprint Cards Ab | Capacitive fingerprint sensor with sensing elements comprising timing circuitry |
| TWI594341B (zh) * | 2015-01-19 | 2017-08-01 | 神盾股份有限公司 | 指紋辨識裝置封裝及其製造方法 |
| KR101942141B1 (ko) * | 2015-05-12 | 2019-01-24 | 앰코테크놀로지코리아(주) | 지문센서 패키지 |
| TW201643772A (zh) | 2015-06-08 | 2016-12-16 | 指紋卡公司 | 具有中介結構的指紋感測裝置 |
| CN204808272U (zh) * | 2015-07-03 | 2015-11-25 | 宸鸿科技(厦门)有限公司 | 具有指纹识别功能的触控面板 |
| TWM523147U (zh) * | 2015-09-10 | 2016-06-01 | 茂丞科技股份有限公司 | 指紋感測單元及指紋感測模組 |
| US9792516B2 (en) * | 2016-01-26 | 2017-10-17 | Next Biometrics Group Asa | Flexible card with fingerprint sensor |
| US10395164B2 (en) * | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
-
2017
- 2017-11-09 US US15/807,679 patent/US10395164B2/en active Active
- 2017-12-04 KR KR1020197014898A patent/KR102468554B1/ko active Active
- 2017-12-04 JP JP2019531057A patent/JP7065094B2/ja active Active
- 2017-12-04 WO PCT/SE2017/051210 patent/WO2018111174A1/en not_active Ceased
- 2017-12-13 EP EP19180709.8A patent/EP3564852B1/en active Active
- 2017-12-13 EP EP17207037.7A patent/EP3336759B1/en active Active
- 2017-12-15 CN CN201721766773.6U patent/CN207601824U/zh active Active
- 2017-12-15 CN CN201711350145.4A patent/CN108229340B/zh active Active
-
2022
- 2022-04-25 JP JP2022071629A patent/JP7289956B2/ja active Active
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