JP2018022777A5 - - Google Patents
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- Publication number
- JP2018022777A5 JP2018022777A5 JP2016153084A JP2016153084A JP2018022777A5 JP 2018022777 A5 JP2018022777 A5 JP 2018022777A5 JP 2016153084 A JP2016153084 A JP 2016153084A JP 2016153084 A JP2016153084 A JP 2016153084A JP 2018022777 A5 JP2018022777 A5 JP 2018022777A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor module
- substrate
- insulating member
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 5
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016153084A JP6717103B2 (ja) | 2016-08-03 | 2016-08-03 | 半導体モジュール |
| KR1020197002978A KR20190024993A (ko) | 2016-08-03 | 2017-05-12 | 반도체 모듈 |
| PCT/JP2017/018052 WO2018025463A1 (ja) | 2016-08-03 | 2017-05-12 | 半導体モジュール |
| CN201780047686.1A CN109564912A (zh) | 2016-08-03 | 2017-05-12 | 半导体模块 |
| US16/322,401 US10770400B2 (en) | 2016-08-03 | 2017-05-12 | Semiconductor module |
| EP17836570.6A EP3496141A4 (en) | 2016-08-03 | 2017-05-12 | SEMICONDUCTOR MODULE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016153084A JP6717103B2 (ja) | 2016-08-03 | 2016-08-03 | 半導体モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018022777A JP2018022777A (ja) | 2018-02-08 |
| JP2018022777A5 true JP2018022777A5 (enExample) | 2018-11-29 |
| JP6717103B2 JP6717103B2 (ja) | 2020-07-01 |
Family
ID=61074071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016153084A Expired - Fee Related JP6717103B2 (ja) | 2016-08-03 | 2016-08-03 | 半導体モジュール |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10770400B2 (enExample) |
| EP (1) | EP3496141A4 (enExample) |
| JP (1) | JP6717103B2 (enExample) |
| KR (1) | KR20190024993A (enExample) |
| CN (1) | CN109564912A (enExample) |
| WO (1) | WO2018025463A1 (enExample) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3614386B2 (ja) | 2001-08-23 | 2005-01-26 | 株式会社ルネサステクノロジ | パワーｍｏｓｆｅｔ |
| JP3904541B2 (ja) * | 2003-09-26 | 2007-04-11 | 沖電気工業株式会社 | 半導体装置内蔵基板の製造方法 |
| JP2007288044A (ja) * | 2006-04-19 | 2007-11-01 | Sumitomo Electric Ind Ltd | 半導体装置 |
| JP5268786B2 (ja) * | 2009-06-04 | 2013-08-21 | 三菱電機株式会社 | 半導体モジュール |
| JP5659663B2 (ja) * | 2010-09-28 | 2015-01-28 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2012151353A (ja) * | 2011-01-20 | 2012-08-09 | Sharp Corp | 半導体モジュール |
| CN102148215B (zh) * | 2011-01-21 | 2012-06-06 | 哈尔滨理工大学 | 提高ccga 器件软钎焊焊点可靠性的互连结构及实现方法 |
| JP2013004943A (ja) | 2011-06-22 | 2013-01-07 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
| JP5708359B2 (ja) * | 2011-08-11 | 2015-04-30 | 株式会社デンソー | 半導体装置及び半導体装置の製造方法 |
| JP2015080383A (ja) | 2013-10-18 | 2015-04-23 | 日本精工株式会社 | 半導体モジュール |
| WO2015178296A1 (ja) * | 2014-05-20 | 2015-11-26 | 三菱電機株式会社 | 電力用半導体装置 |
| JP6308300B2 (ja) * | 2014-08-12 | 2018-04-11 | 富士電機株式会社 | 半導体装置 |
| JP6361448B2 (ja) * | 2014-10-15 | 2018-07-25 | 住友電気工業株式会社 | 半導体モジュール |
-
2016
- 2016-08-03 JP JP2016153084A patent/JP6717103B2/ja not_active Expired - Fee Related
-
2017
- 2017-05-12 EP EP17836570.6A patent/EP3496141A4/en not_active Withdrawn
- 2017-05-12 KR KR1020197002978A patent/KR20190024993A/ko not_active Abandoned
- 2017-05-12 US US16/322,401 patent/US10770400B2/en not_active Expired - Fee Related
- 2017-05-12 CN CN201780047686.1A patent/CN109564912A/zh not_active Withdrawn
- 2017-05-12 WO PCT/JP2017/018052 patent/WO2018025463A1/ja not_active Ceased