JP2015076612A5 - - Google Patents

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Publication number
JP2015076612A5
JP2015076612A5 JP2014205343A JP2014205343A JP2015076612A5 JP 2015076612 A5 JP2015076612 A5 JP 2015076612A5 JP 2014205343 A JP2014205343 A JP 2014205343A JP 2014205343 A JP2014205343 A JP 2014205343A JP 2015076612 A5 JP2015076612 A5 JP 2015076612A5
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JP
Japan
Prior art keywords
emitting diode
light emitting
powder layer
fluorescent powder
diode module
Prior art date
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Application number
JP2014205343A
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English (en)
Japanese (ja)
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JP6581766B2 (ja
JP2015076612A (ja
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Priority claimed from TW102136176A external-priority patent/TWI610465B/zh
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Publication of JP2015076612A publication Critical patent/JP2015076612A/ja
Publication of JP2015076612A5 publication Critical patent/JP2015076612A5/ja
Application granted granted Critical
Publication of JP6581766B2 publication Critical patent/JP6581766B2/ja
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JP2014205343A 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法 Active JP6581766B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法
TW102136176 2013-10-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019124909A Division JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015076612A JP2015076612A (ja) 2015-04-20
JP2015076612A5 true JP2015076612A5 (enExample) 2017-11-16
JP6581766B2 JP6581766B2 (ja) 2019-09-25

Family

ID=52776260

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014205343A Active JP6581766B2 (ja) 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法
JP2019124909A Active JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019124909A Active JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

Country Status (4)

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US (6) US9502622B2 (enExample)
JP (2) JP6581766B2 (enExample)
CN (3) CN104517947B (enExample)
TW (1) TWI610465B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI610465B (zh) 2013-10-07 2018-01-01 Epistar Corporation 發光二極體組件及製作方法
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11543083B2 (en) * 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US20220078892A1 (en) * 2014-09-28 2022-03-10 Zhejiang Super Lighting Electric Appliance Co.,Ltd Led filament and led light bulb
US12313227B2 (en) 2014-09-28 2025-05-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11997768B2 (en) * 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
CN107785475B (zh) 2015-07-17 2020-02-07 开发晶照明(厦门)有限公司 发光装置复合基板及具有该发光装置复合基板的led模组
TWI568038B (zh) * 2015-07-17 2017-01-21 開發晶照明(廈門)有限公司 發光裝置複合基板及具有該發光裝置複合基板的led模組
JP6850112B2 (ja) * 2016-11-28 2021-03-31 株式会社ディスコ Led組み立て方法
DE102017112642A1 (de) 2017-06-08 2018-12-13 Osram Opto Semiconductors Gmbh Led-filament
KR20190101787A (ko) * 2018-02-23 2019-09-02 서울반도체 주식회사 개선된 연색성을 갖는 led 조명 장치 및 led 필라멘트
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
US10828962B2 (en) * 2018-07-13 2020-11-10 Simpson Performance Products, Inc. Compact cooling system for vehicle operators
CN109148402B (zh) * 2018-08-29 2020-09-15 开发晶照明(厦门)有限公司 发光二极管封装结构及其制造方法
CN110335931B (zh) * 2019-07-05 2020-12-01 开发晶照明(厦门)有限公司 光电器件及其制作方法
TWI712188B (zh) * 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法
WO2021224134A1 (en) * 2020-05-07 2021-11-11 Signify Holding B.V. An led filament and a lamp
USD1083850S1 (en) 2021-01-20 2025-07-15 Hamamatsu Photonics K.K. Light-emitting element module
JP1701619S (enExample) * 2021-01-20 2021-12-06
JP1701505S (enExample) 2021-01-20 2021-12-06
USD1089808S1 (en) 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
JP1712335S (ja) 2021-01-20 2022-04-12 発光素子モジュール
TWI801122B (zh) * 2022-01-28 2023-05-01 友達光電股份有限公司 封裝結構及其製造方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835960B2 (en) * 2003-03-03 2004-12-28 Opto Tech Corporation Light emitting diode package structure
JP2007165811A (ja) 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
JP5555971B2 (ja) * 2006-07-18 2014-07-23 日亜化学工業株式会社 線状発光装置およびそれを用いた面状発光装置
JP4976974B2 (ja) * 2007-03-28 2012-07-18 パナソニック株式会社 発光装置
JP5220373B2 (ja) 2007-09-25 2013-06-26 三洋電機株式会社 発光モジュール
KR100998233B1 (ko) * 2007-12-03 2010-12-07 서울반도체 주식회사 슬림형 led 패키지
US8207553B2 (en) * 2008-03-25 2012-06-26 Bridge Semiconductor Corporation Semiconductor chip assembly with base heat spreader and cavity in base
KR100888236B1 (ko) * 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
TWI445156B (zh) * 2009-01-20 2014-07-11 Epistar Corp 發光元件
CN101852345B (zh) * 2009-03-30 2012-05-23 奇力光电科技股份有限公司 发光二极管光源模块
JP2011035198A (ja) * 2009-08-03 2011-02-17 Ccs Inc Led発光デバイスの製造方法
JP5485642B2 (ja) * 2009-10-06 2014-05-07 シチズン電子株式会社 発光ダイオード及びその製造方法
KR101342287B1 (ko) * 2010-04-28 2013-12-16 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 장치용 패키지 및 발광 장치
KR20110130851A (ko) * 2010-05-28 2011-12-06 삼성전자주식회사 발광 장치, 이를 포함하는 발광 시스템, 및 이들의 제조 방법
US8322947B2 (en) * 2010-06-11 2012-12-04 Neumann Duane A Flexible skid steer attachment device
CN201820755U (zh) * 2010-07-15 2011-05-04 弘凯光电(深圳)有限公司 发光二极管
CN102483201B (zh) * 2010-07-20 2015-08-19 松下电器产业株式会社 灯泡型灯
RU2546469C2 (ru) 2010-09-08 2015-04-10 Чжэцзян Ледисон Оптоэлектроникс Ко., Лтд. Светодиодная лампа
CN103052839A (zh) 2010-11-04 2013-04-17 松下电器产业株式会社 灯泡型灯及照明装置
JP2012099726A (ja) * 2010-11-04 2012-05-24 Stanley Electric Co Ltd Ledモジュール及びledランプ
JP2012138454A (ja) * 2010-12-27 2012-07-19 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
WO2012090350A1 (ja) * 2010-12-27 2012-07-05 パナソニック株式会社 発光装置およびランプ
CN103443537B (zh) * 2011-01-11 2018-09-21 飞利浦照明控股有限公司 照明设备
CN103080631A (zh) * 2011-01-14 2013-05-01 松下电器产业株式会社 灯及照明装置
US9324924B2 (en) * 2011-03-03 2016-04-26 Cree, Inc. Tunable remote phosphor constructs
KR101865272B1 (ko) * 2011-07-26 2018-06-07 삼성전자주식회사 발광소자 모듈 및 이의 제조방법
JP5848562B2 (ja) * 2011-09-21 2016-01-27 シチズン電子株式会社 半導体発光装置及びその製造方法。
WO2013070696A1 (en) * 2011-11-07 2013-05-16 Cree, Inc. High voltage array light emitting diode (led) devices, fixtures and methods
US20130170174A1 (en) * 2011-12-29 2013-07-04 Intematix Technology Center Corp. Multi-cavities light emitting device
TWM433640U (en) 2012-04-12 2012-07-11 Lextar Electronics Corp Package structure of semiconductor light emitting device
JP6139071B2 (ja) * 2012-07-30 2017-05-31 日亜化学工業株式会社 発光装置とその製造方法
CN103000786B (zh) * 2012-11-14 2016-01-13 深圳大学 白光发光二极管
TWM459520U (zh) 2013-01-28 2013-08-11 廖旭文 雙面發光之led燈板結構
CN203205454U (zh) * 2013-02-06 2013-09-18 深圳市蓝科电子有限公司 一种led光源的封装结构
TWM461749U (zh) 2013-02-27 2013-09-11 東莞萬士達液晶顯示器有限公司 光源裝置
TWI610465B (zh) * 2013-10-07 2018-01-01 Epistar Corporation 發光二極體組件及製作方法

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