JP6581766B2 - 発光ダイオードモジュール及びその製造方法 - Google Patents

発光ダイオードモジュール及びその製造方法 Download PDF

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Publication number
JP6581766B2
JP6581766B2 JP2014205343A JP2014205343A JP6581766B2 JP 6581766 B2 JP6581766 B2 JP 6581766B2 JP 2014205343 A JP2014205343 A JP 2014205343A JP 2014205343 A JP2014205343 A JP 2014205343A JP 6581766 B2 JP6581766 B2 JP 6581766B2
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Prior art keywords
emitting diode
fluorescent powder
light emitting
light
powder layer
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Japanese (ja)
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JP2015076612A (ja
JP2015076612A5 (enExample
Inventor
パーン，チェン ジャー
パーン，チェン ジャー
チ，チョン ジュ
チ，チョン ジュ
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Epistar Corp
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Epistar Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2014205343A 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法 Active JP6581766B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法
TW102136176 2013-10-07

Related Child Applications (1)

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JP2019124909A Division JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015076612A JP2015076612A (ja) 2015-04-20
JP2015076612A5 JP2015076612A5 (enExample) 2017-11-16
JP6581766B2 true JP6581766B2 (ja) 2019-09-25

Family

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Family Applications (2)

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JP2014205343A Active JP6581766B2 (ja) 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法
JP2019124909A Active JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

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JP2019124909A Active JP7015278B2 (ja) 2013-10-07 2019-07-04 発光ダイオードモジュール及びその製造方法

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US (6) US9502622B2 (enExample)
JP (2) JP6581766B2 (enExample)
CN (3) CN110047823A (enExample)
TW (1) TWI610465B (enExample)

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Also Published As

Publication number Publication date
US20170040504A1 (en) 2017-02-09
CN104517947B (zh) 2019-01-18
CN110047823A (zh) 2019-07-23
US9947839B2 (en) 2018-04-17
US10319886B2 (en) 2019-06-11
US20230012204A1 (en) 2023-01-12
US20150097199A1 (en) 2015-04-09
JP7015278B2 (ja) 2022-02-02
US9502622B2 (en) 2016-11-22
US20190296198A1 (en) 2019-09-26
US20210151640A1 (en) 2021-05-20
TWI610465B (zh) 2018-01-01
CN110071205B (zh) 2022-04-26
JP2015076612A (ja) 2015-04-20
US11450791B2 (en) 2022-09-20
CN104517947A (zh) 2015-04-15
TW201515279A (zh) 2015-04-16
US20180233635A1 (en) 2018-08-16
US10910528B2 (en) 2021-02-02
CN110071205A (zh) 2019-07-30
JP2019197906A (ja) 2019-11-14
US11949050B2 (en) 2024-04-02

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