TWI801122B - 封裝結構及其製造方法 - Google Patents

封裝結構及其製造方法 Download PDF

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Publication number
TWI801122B
TWI801122B TW111104141A TW111104141A TWI801122B TW I801122 B TWI801122 B TW I801122B TW 111104141 A TW111104141 A TW 111104141A TW 111104141 A TW111104141 A TW 111104141A TW I801122 B TWI801122 B TW I801122B
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TW
Taiwan
Prior art keywords
manufacturing
package structure
package
Prior art date
Application number
TW111104141A
Other languages
English (en)
Other versions
TW202332084A (zh
Inventor
詹富為
陳冠勳
林宜欣
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW111104141A priority Critical patent/TWI801122B/zh
Priority to CN202210645202.6A priority patent/CN115132716A/zh
Priority to US18/062,603 priority patent/US20230246142A1/en
Priority to KR1020230001259A priority patent/KR20230116683A/ko
Application granted granted Critical
Publication of TWI801122B publication Critical patent/TWI801122B/zh
Publication of TW202332084A publication Critical patent/TW202332084A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW111104141A 2022-01-28 2022-01-28 封裝結構及其製造方法 TWI801122B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW111104141A TWI801122B (zh) 2022-01-28 2022-01-28 封裝結構及其製造方法
CN202210645202.6A CN115132716A (zh) 2022-01-28 2022-06-08 封装结构及其制造方法
US18/062,603 US20230246142A1 (en) 2022-01-28 2022-12-07 Package structure and manufacturing method thereof
KR1020230001259A KR20230116683A (ko) 2022-01-28 2023-01-04 패키지 구조체 및 그 제작 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111104141A TWI801122B (zh) 2022-01-28 2022-01-28 封裝結構及其製造方法

Publications (2)

Publication Number Publication Date
TWI801122B true TWI801122B (zh) 2023-05-01
TW202332084A TW202332084A (zh) 2023-08-01

Family

ID=83378853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111104141A TWI801122B (zh) 2022-01-28 2022-01-28 封裝結構及其製造方法

Country Status (4)

Country Link
US (1) US20230246142A1 (zh)
KR (1) KR20230116683A (zh)
CN (1) CN115132716A (zh)
TW (1) TWI801122B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106783828A (zh) * 2017-02-15 2017-05-31 中国人民大学 一种倒装led车灯
US20180138378A1 (en) * 2016-10-19 2018-05-17 Genesis Photonics Inc. Light-emitting device and manufacturing method thereof
TW202044503A (zh) * 2019-05-24 2020-12-01 晶元光電股份有限公司 封裝與顯示模組
US20210193635A1 (en) * 2018-09-11 2021-06-24 Lg Innotek Co., Ltd. Lighting module and lighting assembly including same
US20210223629A1 (en) * 2018-05-24 2021-07-22 Dai Nippon Printing Co., Ltd. Encapsulant sheet for self-luminous display or encapsulant sheet for direct backlight, self-luminous display, and direct backlight

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180138378A1 (en) * 2016-10-19 2018-05-17 Genesis Photonics Inc. Light-emitting device and manufacturing method thereof
CN106783828A (zh) * 2017-02-15 2017-05-31 中国人民大学 一种倒装led车灯
US20210223629A1 (en) * 2018-05-24 2021-07-22 Dai Nippon Printing Co., Ltd. Encapsulant sheet for self-luminous display or encapsulant sheet for direct backlight, self-luminous display, and direct backlight
US20210193635A1 (en) * 2018-09-11 2021-06-24 Lg Innotek Co., Ltd. Lighting module and lighting assembly including same
TW202044503A (zh) * 2019-05-24 2020-12-01 晶元光電股份有限公司 封裝與顯示模組

Also Published As

Publication number Publication date
KR20230116683A (ko) 2023-08-04
CN115132716A (zh) 2022-09-30
US20230246142A1 (en) 2023-08-03
TW202332084A (zh) 2023-08-01

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