CN104517947B - 发光二极管组件及制作方法 - Google Patents

发光二极管组件及制作方法 Download PDF

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Publication number
CN104517947B
CN104517947B CN201410507440.6A CN201410507440A CN104517947B CN 104517947 B CN104517947 B CN 104517947B CN 201410507440 A CN201410507440 A CN 201410507440A CN 104517947 B CN104517947 B CN 104517947B
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CN
China
Prior art keywords
light
emitting diode
powder layer
phosphor powder
transparent substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410507440.6A
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English (en)
Chinese (zh)
Other versions
CN104517947A (zh
Inventor
陈泽澎
郑子淇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaistar Lighting Xiamen Co Ltd
Epistar Corp
Original Assignee
Kaistar Lighting Xiamen Co Ltd
Epistar Corp
Huga Optotech Inc
Interlight Optotech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaistar Lighting Xiamen Co Ltd, Epistar Corp, Huga Optotech Inc, Interlight Optotech Corp filed Critical Kaistar Lighting Xiamen Co Ltd
Priority to CN201811583441.3A priority Critical patent/CN110047823A/zh
Priority to CN201811586001.3A priority patent/CN110071205B/zh
Publication of CN104517947A publication Critical patent/CN104517947A/zh
Application granted granted Critical
Publication of CN104517947B publication Critical patent/CN104517947B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201410507440.6A 2013-10-07 2014-09-28 发光二极管组件及制作方法 Active CN104517947B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201811583441.3A CN110047823A (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201811586001.3A CN110071205B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法
TW102136176 2013-10-07

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201811583441.3A Division CN110047823A (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201811586001.3A Division CN110071205B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

Publications (2)

Publication Number Publication Date
CN104517947A CN104517947A (zh) 2015-04-15
CN104517947B true CN104517947B (zh) 2019-01-18

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CN201811583441.3A Pending CN110047823A (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201410507440.6A Active CN104517947B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201811586001.3A Active CN110071205B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

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Application Number Title Priority Date Filing Date
CN201811586001.3A Active CN110071205B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

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US (6) US9502622B2 (enExample)
JP (2) JP6581766B2 (enExample)
CN (3) CN110047823A (enExample)
TW (1) TWI610465B (enExample)

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CN110335931B (zh) * 2019-07-05 2020-12-01 开发晶照明（厦门）有限公司 光电器件及其制作方法
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TWI801122B (zh) * 2022-01-28 2023-05-01 友達光電股份有限公司 封裝結構及其製造方法

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Also Published As

Publication number Publication date
US20170040504A1 (en) 2017-02-09
CN110047823A (zh) 2019-07-23
US9947839B2 (en) 2018-04-17
US10319886B2 (en) 2019-06-11
US20230012204A1 (en) 2023-01-12
US20150097199A1 (en) 2015-04-09
JP7015278B2 (ja) 2022-02-02
US9502622B2 (en) 2016-11-22
US20190296198A1 (en) 2019-09-26
US20210151640A1 (en) 2021-05-20
TWI610465B (zh) 2018-01-01
CN110071205B (zh) 2022-04-26
JP2015076612A (ja) 2015-04-20
US11450791B2 (en) 2022-09-20
CN104517947A (zh) 2015-04-15
TW201515279A (zh) 2015-04-16
US20180233635A1 (en) 2018-08-16
US10910528B2 (en) 2021-02-02
CN110071205A (zh) 2019-07-30
JP6581766B2 (ja) 2019-09-25
JP2019197906A (ja) 2019-11-14
US11949050B2 (en) 2024-04-02

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