JP2012151353A - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- JP2012151353A JP2012151353A JP2011009957A JP2011009957A JP2012151353A JP 2012151353 A JP2012151353 A JP 2012151353A JP 2011009957 A JP2011009957 A JP 2011009957A JP 2011009957 A JP2011009957 A JP 2011009957A JP 2012151353 A JP2012151353 A JP 2012151353A
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Abstract
【解決手段】上面に電子部品2が実装された基板1と、上面を封止する絶縁性の封止樹脂層3と、封止樹脂層3の基板1と反対側を覆う導電性の外装シールド4と、封止樹脂層3の内部に配置され、外装シールド4と、基板1に備えられた接地端子13とを電気的に接続する接続部5とを備えた半導体モジュールA。
【選択図】図2
Description
図1は本発明にかかる半導体モジュールの一例の概略斜視図であり、図2は図1に示す半導体モジュールをII−II線で切断したときの矢視断面図である。まず、図1及び図2を参照して、本発明にかかる半導体モジュールAの構造について説明する。
本発明にかかる半導体モジュールの他の例について図面を参照して説明する。図12は本発明にかかる半導体モジュールの他の例の概略断面図である。図12に示す半導体モジュールBは、モジュール基板1b、モジュール実装端子12b、接地ライン13b及び接続部5bが異なる以外は、半導体モジュールAと同じ構成を有している。半導体モジュールBを構成する部分のうち、半導体モジュールAを構成する部分と実質上同じ部分には、同じ符号を付すとともに、詳細な説明は省略する。
本発明にかかる半導体モジュールのさらに他の例について新たな図面を参照して説明する。図19は本発明にかかる半導体モジュールのさらに他の例を拡大した断面図である。図19に示す半導体モジュールCは、接続部5cが異なる以外は半導体モジュールBと同じ構成を有しており、実質上同じ部分には同じ符号を付すとともに、実質上同じ部分の詳細な説明は省略する。
本発明にかかる半導体モジュールのさらに他の例について図面を参照して説明する。図21は本発明にかかる半導体モジュールのさらに他の例の拡大断面図である。図21に示す半導体モジュールDは、半導体素子21d及び接続部5dが異なる以外、半導体モジュールCと同じ構成を有するものであり、実質上同じ部分には同じ符号を付すとともに、同じ部分の詳細な説明は省略する。さらに製造工程についても、穴あけ工程で形成する凹穴の位置が異なる以外は、同様の構成を有しているので、詳しい説明は省略する。
本発明の半導体モジュールの他の例について図面を参照して説明する。図22は本発明にかかる半導体モジュールのさらに他の例の拡大断面図である。図22に示す半導体モジュールEは、半導体モジュールEの厚み方向(上下方向)に立てて配置されたチップ部品23eを備えている以外は、半導体モジュールBと同じ構成を有しており、実質上同じ部分は、同じ符号を付すとともに、詳細な説明を省略する。
本発明にかかる半導体ユニットについて図面を参照して説明する。図23は本発明にかかる半導体モジュールの他の例の平面図であり、図24は図23に示す半導体モジュールの成膜工程が終了した後の集合基板を示す平面図である。半導体モジュールFは、外装シールド4fが異なる以外は、半導体モジュールBと同じ構成を有しており、実質上同じ部分は同じ符号を付すとともに、詳細な説明は省略する。
11 配線導体
12 モジュール実装端子
13 接地ライン
131 内層接地端子
132 下面接地端子
2 電子部品
21 半導体素子
22 受動部品
3 封止樹脂層
4 外装シールド
5 接続部
51 内周部分
52 接触部分
Claims (10)
- 上面に電子部品が実装された基板と、
前記電子部品が実装された上面を封止する絶縁性の封止樹脂層と、
前記封止樹脂層の前記基板と反対側を覆う導電性の外装シールドと、
前記封止樹脂層の内部に配置され、前記外装シールドと前記基板に備えられた接地端子とを電気的に接続する接続部とを備えていることを特徴とする半導体モジュール。 - 前記外装シールドを貫通し、少なくとも前記封止樹脂層の内部に到達する凹部が形成されており、
前記接続部は、前記凹部の内周面を覆う内周部分と前記接地端子と接触する接触部分とを備える請求項1に記載の半導体モジュール。 - 前記基板は下面に接地端子が配置されており、
前記凹部が、前記封止樹脂層、前記基板及び接地端子を貫通している請求項2に記載の半導体モジュール。 - 前記凹部は、前記封止樹脂層を貫通しており、
前記接続部の前記接触部分は前記凹部の底面を覆うように形成されており、
前記接触部分は前記基板の上面に形成された接地端子と接触する請求項2に記載の半導体モジュール。 - 前記凹部が前記電子部品の上部に形成されており、
前記電子部品の前記接地端子と接続された導体部分と前記接触部分とが接触している請求項2に記載の半導体モジュール。 - 前記電子部品が、シリコン貫通電極を備えた半導体素子である請求項5に記載の半導体モジュール。
- 前記接地端子が基板の上面に形成されており、
前記基板には、前記接地端子と接続し、前記基板の厚み方向に立設された導電体が実装されており、
前記接触部分が前記導電体と接触する請求項2に記載の半導体モジュール。 - 前記外装シールドは平面形状が前記基板よりも小さい請求項1から請求項7のいずれかに記載の半導体モジュール。
- 前記接続部が複数個備えられている請求項1から請求項8のいずれかに記載の半導体モジュール。
- 前記複数個の接続部は、少なくとも前記基板の対角位置に対を成すように配置されている請求項9に記載の半導体モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011009957A JP2012151353A (ja) | 2011-01-20 | 2011-01-20 | 半導体モジュール |
US13/323,495 US20120187551A1 (en) | 2011-01-20 | 2011-12-12 | Semiconductor module |
BRPI1105466-2A BRPI1105466A2 (pt) | 2011-01-20 | 2011-12-13 | Módulo semicondutor |
CN2011104521377A CN102610591A (zh) | 2011-01-20 | 2011-12-29 | 半导体模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011009957A JP2012151353A (ja) | 2011-01-20 | 2011-01-20 | 半導体モジュール |
Publications (1)
Publication Number | Publication Date |
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JP2012151353A true JP2012151353A (ja) | 2012-08-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011009957A Pending JP2012151353A (ja) | 2011-01-20 | 2011-01-20 | 半導体モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US20120187551A1 (ja) |
JP (1) | JP2012151353A (ja) |
CN (1) | CN102610591A (ja) |
BR (1) | BRPI1105466A2 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5466785B1 (ja) * | 2013-08-12 | 2014-04-09 | 太陽誘電株式会社 | 回路モジュール及びその製造方法 |
KR20140124339A (ko) * | 2013-04-16 | 2014-10-24 | 스카이워크스 솔루션즈, 인코포레이티드 | 표면 장착 디바이스들로 구현되는 접지 경로들과 관련된 장치들 및 방법들 |
KR20150002264A (ko) * | 2013-06-28 | 2015-01-07 | 삼성전기주식회사 | 반도체 패키지 |
WO2018029921A1 (ja) * | 2016-08-09 | 2018-02-15 | 株式会社村田製作所 | 半導体パッケージ、及び、配線基板 |
WO2021019877A1 (ja) * | 2019-07-30 | 2021-02-04 | 昭和電工マテリアルズ株式会社 | 電子部品装置を製造する方法、及び電子部品装置 |
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WO2021019877A1 (ja) * | 2019-07-30 | 2021-02-04 | 昭和電工マテリアルズ株式会社 | 電子部品装置を製造する方法、及び電子部品装置 |
JP7434758B2 (ja) | 2019-08-29 | 2024-02-21 | 株式会社レゾナック | 電子部品装置を製造する方法、及び電子部品装置 |
WO2022249600A1 (ja) * | 2021-05-26 | 2022-12-01 | 株式会社村田製作所 | 電子回路モジュール |
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CN102610591A (zh) | 2012-07-25 |
BRPI1105466A2 (pt) | 2015-09-01 |
US20120187551A1 (en) | 2012-07-26 |
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