TWI705538B - 指紋感測封裝模組的製法 - Google Patents
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Abstract
一種指紋感測封裝模組,包含一基板、一指紋感測晶片、多條金屬導線,以及一絕緣封裝體。該基板包括一安裝面,以及多個設置於該安裝面的電路接點。該指紋感測晶片設於該基板的安裝面,該指紋感測晶片具有一背對該安裝面的第一面、一位於該第一面的感應區,以及多個設置於該第一面且鄰接於該感應區周緣處的電性接點,該等電性接點與該感應區之間的距離小於300微米。該等金屬導線跨接於該等電路接點與該等電性接點之間。該絕緣封裝體覆蓋該基板的安裝面、該指紋感測晶片與該等金屬導線,且該絕緣封裝體形成有一使該感應區顯露出的開槽。
Description
本發明是有關於一種指紋感測封裝模組,特別是指一種指紋感測封裝模組及其製法。
一般指紋感測封裝模組在安裝完重要元件後通常會藉由封膠方式製作保護結構,但是,在封膠過程中,封膠材料容易因溢膠問題而沾染指紋感測晶片的感應區,此種情況將導致指紋感測晶片的靈敏度受到影響,並影響製程良率。
另外,由於指紋感測封裝模組經常應用於各式電子裝置例如手機、筆電等,由於一般電子裝置內部用於安裝各式模組的空間十分有限,故縮小指紋感測封裝模組的體積即為設計指紋感測封裝模組的一門重要的課題。
因此,本發明之其中一目的,即在提供一種能克服先前技術至少一個缺點的指紋感測封裝模組。
於是,本發明指紋感測封裝模組在一些實施態樣中,是包含一基板、一指紋感測晶片、多條金屬導線,以及一絕緣封裝體。該基板包括一安裝
面,以及多個設置於該安裝面的電路接點。該指紋感測晶片設於該基板的安裝面,該指紋感測晶片具有一背對該安裝面的第一面、一位於該第一面的感應區,以及多個設置於該第一面且鄰接於該感應區周緣處的電性接點,該等電性接點與該感應區之間的距離小於300微米。每一金屬導線的兩相反端分別跨接於該等電路接點的其中一者與該等電性接點的其中一者。該絕緣封裝體覆蓋該基板的安裝面、該指紋感測晶片與該等金屬導線,且該絕緣封裝體形成有一使該感應區顯露出的開槽。
在一些實施態樣中,還包含一覆設於該感應區並位於該開槽中的透光保護層。
在一些實施態樣中,該透光保護層的厚度小於該絕緣封裝體的該開槽的深度。
在一些實施態樣中,該透光保護層的厚度小於該等金屬導線的最高點至該指紋感測晶片的第一面之距離。
因此,本發明之其中另一目的,即在提供一種能克服先前技術至少一個缺點的指紋感測封裝模組的製法。
於是,本發明指紋感測封裝模組的製法在一些實施態樣中,包含以下步驟:提供一基板,該基板包括一安裝面,以及多個設置於該安裝面的電路接點;設置一指紋感測晶片於該基板的安裝面,該指紋感測晶片具有一背對該
安裝面的第一面、一位於該第一面的感應區,以及多個設置於該第一面且鄰接於該感應區周緣處的電性接點;形成一阻著層於該指紋感測晶片的感應區;於該基板的該等電路接點與該指紋感測晶片的該等電性接點之間分別以打線方式設置多條金屬導線,以使該指紋感測晶片與該基板電性連接;形成一絕緣封裝體以覆蓋該基板的安裝面、該指紋感測晶片與該等金屬導線,且該絕緣封裝體被該阻著層隔離而未接觸該感應區;以及移除覆蓋於該感應區的該阻著層,以使該絕緣封裝體形成有一使該感應區顯露出的開槽。
在一些實施態樣中,在移除該阻著層的步驟後還包含:形成一覆設於該感應區且位於該開槽中的透光保護層。
在一些實施態樣中,該阻著層是藉由黃光製程以可圖案化的感光材料形成。
於是,本發明指紋感測封裝模組的製法在一些實施態樣中,包含以下步驟:提供一基板,該基板包括一安裝面;設置一指紋感測晶片於該基板的安裝面,該指紋感測晶片具有一背對該安裝面的第一面,以及一位於該第一面的感應區,該感應區上覆蓋有一阻著層;形成一絕緣封裝體於該基板的安裝面以覆蓋該基板的安裝面與該指紋
感測晶片,且該絕緣封裝體被該阻著層隔離而未接觸該感應區;以及移除覆蓋於該感應區的該阻著層,以使該絕緣封裝體形成有一使該感應區顯露出的開槽。
在一些實施態樣中,該基板還包括多個設置於該安裝面的電路接點,該指紋感測晶片還具有一相反於該第一面且正對該安裝面的第二面,以及多個設置於該第二面且位置與該電路接點相對應的電性接點,設置該指紋感測晶片的步驟中,是以覆晶方式將該指紋感測晶片設於該基板的安裝面,以使該等電路接點分別與該等電性接點對接。
在一些實施態樣中,設置該指紋感測晶片的步驟中,是先設置該指紋感測晶片於該基板的安裝面,再形成一阻著層於該指紋感測晶片的感應區。
本發明至少具有以下功效:藉由該阻著層隔離該絕緣封裝體,以防止該絕緣封裝體覆蓋該感應區(也就是溢膠情形)而導致感應區的靈敏度下降的情況發生。並且,更進一步地,由於該阻著層是藉由黃光製程形成,故其尺寸及位置較為準確。如此一來,即使在該阻著層形成的尺寸及位置之誤差考量下,依然能夠更容易地將該阻著層的邊緣控制在不覆蓋至該等電性接點的位置,以使該絕緣封裝體能夠精確地覆蓋該等金屬導線與該等電性接點但不覆蓋該感應區,並且配合該阻著層防止溢膠情形,使用於與該等金屬導線連接的該等電性接點與該感應區之間的距離便能縮減至300微米以下,以使該指紋感測晶片的尺寸不致過大,進而縮減該指紋感測封裝模組的體積。
10:指紋感測封裝模組
1:基板
11:安裝面
12:電路接點
2:指紋感測晶片
21:第一面
22:感應區
23:電性接點
24:第二面
3:金屬導線
4:絕緣封裝體
41:開槽
5:透光保護層
6:阻著層
7:模具
71:下模
711:下定位面
72:上模
721:灌注流道
73:模穴
8:錫球
S11~S17:步驟
S21~S26:步驟
S:距離
D:深度
H:距離
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是本發明指紋感測封裝模組的一第一實施例的一剖視示意圖;圖2是一流程方塊圖,說明該第一實施例的製法;圖3至圖9是多個剖視示意圖,分別說明該第一實施例的製法的步驟S11至S17;圖10是本發明指紋感測封裝模組的製法一第二實施例的一流程方塊圖;及圖11至圖16是多個剖視示意圖,分別說明該第二實施例的步驟S21至S26。
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。
參閱圖1與圖2,為本發明指紋感測封裝模組10及其製法之一第一實施例,該指紋感測封裝模組10包含一基板1、一指紋感測晶片2、多條金屬導線3、一絕緣封裝體4,以及一透光保護層5。
該基板1例如為陶瓷電路板等各式電路板,包括一安裝面11,以及多個設置於該安裝面11的電路接點12。
該指紋感測晶片2設於該基板1的安裝面11,並具有一背對該安裝面11的第一面21、一位於該第一面21且適用於供指紋感測的感應區22,以及多個設置於該第一面21且鄰接於該感應區22周緣處的電性接點23,該等電性接點23與該感應區22之間的距離S小於300微米。由於該等電性接點23與該感應區22之間的距離非常接近,可縮減該第一面21上該感應區22以外區域的面積,以使該指紋感測晶片2的尺寸不致過大,進而縮減該指紋感測封裝模組10的體積。
每一金屬導線3的兩相反端分別跨接於該等電路接點12的其中一者與該等電性接點23的其中一者,透過該等金屬導線3使該指紋感測晶片2與該基板1電性連接。
該絕緣封裝體4覆蓋該基板1的安裝面11、該指紋感測晶片2與該等金屬導線3,且該絕緣封裝體4形成有一使該感應區22顯露出的開槽41。該絕緣封裝體4用以保護該基板1、該指紋感測晶片2與該等金屬導線3,舉例來說,該絕緣封裝體4的材質例如為環氧樹脂(epoxy),主要有防止該等金屬導線3被破壞、阻絕濕氣以避免濕氣接觸到該指紋感測晶片2,以及加強該指紋感測晶片2散熱性以防止該指紋感測晶片2溫度過高等的作用。
該透光保護層5覆設於該感應區22並位於該開槽41中,該透光保護層5具有高硬度、高透光度等特性,以保護該感應區22避免其受到刮傷而影響靈敏度。更進一步地說,在本第一實施例中,該透光保護層5的厚度可實施為小於該絕緣封裝體4的該開槽41的深度D與該等金屬導線3的最高點至該指紋感測晶片2的第一面21之距離H,藉此以避免該透光保護層5過厚而影響該感應
區22的靈敏度。但在其他實施態樣中,該指紋感測封裝模組10也可以不包含該透光保護層5,不以設置該透光保護層5的實施方式為限制。
在本第一實施例中,該指紋感測封裝模組10的製法的步驟說明如下。
參閱圖1、圖2及圖3,步驟S11是提供該基板1。該基板1的材質舉例來說可以為樹脂(或與玻璃纖維的混合物)、陶瓷、或玻璃等等。
參閱圖1、圖2及圖4,步驟S12是設置該指紋感測晶片2於該基板1的安裝面11。在本第一實施例中,本步驟S12是使用以黏著劑形成一連接於該指紋感測晶片2與該基板1的安裝面11之間的一黏著層(圖未示),以將該指紋感測晶片2設置於該基板1,但該指紋感測晶片2的安裝方式不以此為限制。
參閱圖1、圖2及圖5,步驟S13是形成一阻著層6於該指紋感測晶片2的感應區22。在本第一實施例中,該阻著層6是藉由黃光製程以可圖案化的感光材料形成。更進一步來說,是先在該指紋感測晶片2的該第一面21上以例如液態光阻或乾膜光阻覆蓋地形成一整面的阻著層6,再藉由曝光、顯影等步驟去除該整面的阻著層6多餘的部分,並保留該指紋感測晶片2的感應區22上的該阻著層6。但在其他變化實施態樣中,該阻著層6也可以是以黃光製程以外的方式形成,不以本第一實施例為限制。需要說明的是,若該阻著層6是以黃光製程以外的方式形成,則該阻著層6也能於設置該指紋感測晶片2於該基板1(步驟S12)之前便形成在該指紋感測晶片2的感應區22上,也就是說,在其他變化實施態樣中該步驟S12與本步驟S13的順序是可以調換的,不以本第一實施例為
限。
參閱圖1、圖2及圖6,步驟S14是以打線方式將該等金屬導線3設置於該基板1的該等電路接點12與該指紋感測晶片2的該等電性接點23之間,以使該指紋感測晶片2與該基板1電性連接。具體來說,在本第一實施例中的打線方式是例如藉由超音波焊接方式將該等金屬導線3設置於該等電路接點12與該指紋感測晶片2的該等電性接點23之間,但不以此為限制。
參閱圖1、圖2及圖7,步驟S15是形成該絕緣封裝體4以覆蓋該基板1的安裝面11、該指紋感測晶片2與該等金屬導線3,且該絕緣封裝體4被該阻著層6隔離而未接觸該感應區22。在本第一實施例中,是使用一具有一下模71、一上模72的模具7以封膠方式形成該絕緣封裝體4。詳細來說,是先將裝設有該指紋感測晶片2與該等金屬導線3的該基板1設置於該下模71的一下定位面711,接著將該上模72與該下模71合模而界定一容納該基板1的模穴73,再由該上模72的一灌注流道721灌注液態塑料(例如單液型環氧樹脂等等,圖未示)於該模穴73內,使液態塑料包覆該基板1的安裝面11、該指紋感測晶片2與該等金屬導線3,並經過加熱固化後形成該絕緣封裝體4,但由於該感應區22上覆蓋有該阻著層6,因此液態塑料與其固化後形成的該絕緣封裝體4均未接觸該感應區22。需要說明的是,在其他變化實施態樣中,形成該絕緣封裝體4的方法可以是藉由其他封膠製程、灌膠製程或是薄膜輔助成形(Film assisted molding)方式,不以本第一實施例為限制。
參閱圖1、圖2及圖8,步驟S16是移除覆蓋於該感應區22的該阻著
層6,以使該絕緣封裝體4形成有使該感應區22顯露出的該開槽41。在本第一實施例中,是藉由可溶解該阻著層6(即感光材料)且不與其他結構產生化學反應的中性藥水(圖未示),以移除該感應區22上的該阻著層6。但在其他實施態樣中,若該阻著層6是由非光阻材料所形成,則本步驟S16也可以是藉由可移除該種材料的其他物理或化學方式移除該阻著層6,不以此為限制。藉由該阻著層6隔離該絕緣封裝體4,以防止形成該絕緣封裝體4的液態塑料於灌注時流至該感應區22並覆蓋該感應區22(也就是溢膠情形),而導致感應區22的靈敏度下降的情況發生。一般來說,通常為了避免用以覆蓋金屬導線3的絕緣封裝體4覆蓋至感應區22,通常設計該指紋感測晶片2時需將該等電性接點23與該感應區22保持一間距。然而,由於本第一實施例藉由該阻著層6避免該絕緣封裝體4覆蓋至該感應區22的情況發生,因此在設計該指紋感測晶片2時便可將用於與該等金屬導線3連接的該等電性接點23與該感應區22之間的距離S大幅縮減,例如至300微米以下,以使該指紋感測晶片2的尺寸不致過大,進而縮減該指紋感測封裝模組10的體積。更進一步地,由於在本第一實施例中,該阻著層6是藉由黃光製程形成,故其尺寸及位置較為準確。如此一來,即使在該阻著層6形成的尺寸及位置之誤差考量下,依然能夠更容易地將該阻著層6的邊緣控制在不覆蓋至該等電性接點23的位置,以使後續該絕緣封裝體4能夠精確地覆蓋該等金屬導線3與該等電性接點23但不覆蓋該感應區22,因此也有助於縮減該等電性接點23與該感應區22之間的距離S。
參閱圖1、圖2及圖9,步驟S17是形成覆設於該感應區22且位於該
開槽41中的該透光保護層5。舉例來說,該透光保護層5可以是由例如環氧樹脂等材質所製成。另外,在其他實施態樣中,該指紋感測封裝模組10的製法也可以不包含本步驟S17,不以此為限制。
參閱圖10,本發明指紋感測封裝模組10的製法之一第二實施例,在本第二實施例中,該指紋感測封裝模組10的製法的步驟說明如下。
參閱圖10與圖11,步驟S21是提供一基板1,該基板1包括一安裝面11,以及多個設置於該安裝面11的電路接點12。
參閱圖10與圖12,步驟S22是設置一指紋感測晶片2於該基板1的安裝面11,該指紋感測晶片2具有一背對該安裝面11的第一面21、一位於該第一面21的感應區22、一相反於該第一面21且正對該安裝面11的第二面24,以及多個設置於該第二面24且位置與該電路接點12相對應的電性接點23。在該第一實施例中,該指紋感測晶片2與該基板1連接的方式是藉由打線方式連接,而在本第二實施例中,設置該指紋感測晶片2的步驟中,是以覆晶方式將該指紋感測晶片2設於該基板1的安裝面11,以使該指紋感測晶片2的該等電性接點23分別與該基板1的該等電路接點12對接。更進一步地說,本步驟S22中是先將多個錫球8分別設置於該指紋感測晶片2的該等電性接點23上,再使每一電性接點23分別對準對應的電路接點12地將該指紋感測晶片2覆設於該基板1,最後再經由加熱使該等錫球8分別熔接於該指紋感測晶片2的該等電性接點23分別與該基板1的該等電路接點12之間,以使該指紋感測晶片2與該基板1電性連接。
參閱圖10與圖13,本第二實施例的步驟S23大致與該第一實施例
的步驟S14大致相同,於此不再贅述。
參閱圖10與圖14,步驟S24是於形成一絕緣封裝體4於該基板1的安裝面11以覆蓋該基板1的安裝面11與該指紋感測晶片2,且該絕緣封裝體4被該阻著層6隔離而未接觸該感應區22。本第二實施例的步驟S24與該第一實施例的步驟S15大致相同,但由於本第二實施例的該指紋感測晶片2是以覆晶方式設置,因此該絕緣封裝體4並無包覆金屬導線3(見圖1),並且該絕緣封裝體4還填充形成於該指紋感測晶片2與該基板1之間的縫隙。
參閱圖10、圖15與圖16,本第二實施例的步驟S25~S26是要將該阻著層6(見圖14)移除後製作該透光保護層5,由於製作方式與前述第一實施例的步驟S16~S17大致相同,於此不再贅述。
綜上所述,本發明指紋感測封裝模組10及其製法,藉由該阻著層6隔離該絕緣封裝體4,以防止該絕緣封裝體4覆蓋該感應區22(也就是溢膠情形)而導致感應區22的靈敏度下降的情況發生。並且,更進一步地,由於該阻著層6是藉由黃光製程形成,故其尺寸及位置較為準確。如此一來,即使在該阻著層6形成的尺寸及位置之誤差考量下,依然能夠更容易地將該阻著層6的邊緣控制在不覆蓋至該等電性接點23的位置,以使該絕緣封裝體4能夠精確地覆蓋該等金屬導線3與該等電性接點23但不覆蓋該感應區22,並且配合該阻著層6防止溢膠情形,使用於與該等金屬導線3連接的該等電性接點23與該感應區22之間的距離便能縮減至300微米以下,以使該指紋感測晶片2的尺寸不致過大,進而縮減該指紋感測封裝模組10的體積,故能達成本發明的目的。
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。
10:指紋感測封裝模組
1:基板
11:安裝面
12:電路接點
2:指紋感測晶片
21:第一面
22:感應區
23:電性接點
3:金屬導線
4:絕緣封裝體
41:開槽
5:透光保護層
S:距離
D:深度
H:距離
Claims (6)
- 一種指紋感測封裝模組的製法,包含以下步驟:提供一基板,該基板包括一安裝面,以及多個設置於該安裝面的電路接點;設置一指紋感測晶片於該基板的安裝面,該指紋感測晶片具有一背對該安裝面的第一面、一位於該第一面的感應區,以及多個設置於該第一面且鄰接於該感應區周緣處的電性接點;形成一阻著層於該指紋感測晶片的感應區;於該基板的該等電路接點與該指紋感測晶片的該等電性接點之間分別以打線方式設置多條金屬導線,以使該指紋感測晶片與該基板電性連接;形成一絕緣封裝體以覆蓋該基板的安裝面、該指紋感測晶片、該等電性接點與該等金屬導線,且該絕緣封裝體被該阻著層隔離而未接觸該感應區;以及移除覆蓋於該感應區的該阻著層,以使該絕緣封裝體形成有一使該感應區顯露出的開槽。
- 如請求項1所述的指紋感測封裝模組的製法,其中,在移除該阻著層的步驟後還包含:形成一覆設於該感應區且位於該開槽中的透光保護層。
- 如請求項1所述的指紋感測封裝模組的製法,其中,該阻著層是藉由黃光製程以可圖案化的感光材料形成。
- 一種指紋感測封裝模組的製法,包含以下步驟:提供一基板,該基板包括一安裝面;設置一指紋感測晶片於該基板的安裝面,該指紋感測晶片具有 一背對該安裝面的第一面,以及一位於該第一面的感應區,該感應區上覆蓋有一阻著層;形成一絕緣封裝體於該基板的安裝面以覆蓋該基板的安裝面與該指紋感測晶片,且該絕緣封裝體被該阻著層隔離而未接觸該感應區;以及移除覆蓋於該感應區的該阻著層,以使該絕緣封裝體形成有一使該感應區顯露出的開槽。
- 如請求項4所述的指紋感測封裝模組的製法,其中,該基板還包括多個設置於該安裝面的電路接點,該指紋感測晶片還具有一相反於該第一面且正對該安裝面的第二面,以及多個設置於該第二面且位置與該電路接點相對應的電性接點,設置該指紋感測晶片的步驟中,是以覆晶方式將該指紋感測晶片設於該基板的安裝面,以使該等電路接點分別與該等電性接點對接。
- 如請求項4所述的指紋感測封裝模組的製法,其中,設置該指紋感測晶片的步驟中,是先設置該指紋感測晶片於該基板的安裝面,再形成一阻著層於該指紋感測晶片的感應區。
Priority Applications (3)
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TW107122571A TWI705538B (zh) | 2018-06-29 | 2018-06-29 | 指紋感測封裝模組的製法 |
US16/453,278 US10867158B2 (en) | 2018-06-29 | 2019-06-26 | Process for making a fingerprint sensor package module and the fingerprint sensor package module made thereby |
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