JP2008135675A5 - - Google Patents

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Publication number
JP2008135675A5
JP2008135675A5 JP2007093349A JP2007093349A JP2008135675A5 JP 2008135675 A5 JP2008135675 A5 JP 2008135675A5 JP 2007093349 A JP2007093349 A JP 2007093349A JP 2007093349 A JP2007093349 A JP 2007093349A JP 2008135675 A5 JP2008135675 A5 JP 2008135675A5
Authority
JP
Japan
Prior art keywords
seal ring
semiconductor substrate
semiconductor
wiring
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007093349A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008135675A (ja
JP5167671B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007093349A priority Critical patent/JP5167671B2/ja
Priority claimed from JP2007093349A external-priority patent/JP5167671B2/ja
Priority to US11/976,792 priority patent/US7675143B2/en
Publication of JP2008135675A publication Critical patent/JP2008135675A/ja
Publication of JP2008135675A5 publication Critical patent/JP2008135675A5/ja
Application granted granted Critical
Publication of JP5167671B2 publication Critical patent/JP5167671B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007093349A 2006-10-31 2007-03-30 半導体素子 Expired - Fee Related JP5167671B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007093349A JP5167671B2 (ja) 2006-10-31 2007-03-30 半導体素子
US11/976,792 US7675143B2 (en) 2006-10-31 2007-10-29 Semiconductor element, semiconductor device and mounting board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006296532 2006-10-31
JP2006296532 2006-10-31
JP2007093349A JP5167671B2 (ja) 2006-10-31 2007-03-30 半導体素子

Publications (3)

Publication Number Publication Date
JP2008135675A JP2008135675A (ja) 2008-06-12
JP2008135675A5 true JP2008135675A5 (enExample) 2010-01-28
JP5167671B2 JP5167671B2 (ja) 2013-03-21

Family

ID=39329130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007093349A Expired - Fee Related JP5167671B2 (ja) 2006-10-31 2007-03-30 半導体素子

Country Status (2)

Country Link
US (1) US7675143B2 (enExample)
JP (1) JP5167671B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009107182A1 (ja) * 2008-02-28 2009-09-03 パナソニック株式会社 電極パッドを有する半導体装置、及び該半導体装置を備えた無線回路装置
US8188578B2 (en) * 2008-05-29 2012-05-29 Mediatek Inc. Seal ring structure for integrated circuits
US8810001B2 (en) * 2011-06-13 2014-08-19 Mediatek Inc. Seal ring structure with capacitor
US8530997B1 (en) * 2012-07-31 2013-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Double seal ring
JP6026322B2 (ja) 2013-03-12 2016-11-16 ルネサスエレクトロニクス株式会社 半導体装置およびレイアウト設計システム
JP2015109496A (ja) * 2013-12-03 2015-06-11 株式会社東芝 半導体装置
JP5775139B2 (ja) * 2013-12-16 2015-09-09 ルネサスエレクトロニクス株式会社 半導体装置
CN106876318B (zh) * 2015-12-11 2020-05-08 中芯国际集成电路制造(北京)有限公司 半导体器件及其制造方法
US20200075507A1 (en) * 2018-08-30 2020-03-05 Nanya Technology Corporation Semiconductor device and method for preparing the same
CN111834359B (zh) * 2020-08-03 2025-07-29 牛芯半导体(深圳)有限公司 电容版图结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085630A (ja) * 1999-07-14 2001-03-30 Matsushita Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
JP2004179255A (ja) 2002-11-25 2004-06-24 Sony Corp 半導体集積回路
US20050110118A1 (en) 2003-11-26 2005-05-26 Texas Instruments Incorporated Scribe seal providing enhanced substrate noise isolation
WO2006011320A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
JP4689244B2 (ja) * 2004-11-16 2011-05-25 ルネサスエレクトロニクス株式会社 半導体装置
JP2007059676A (ja) * 2005-08-25 2007-03-08 Matsushita Electric Ind Co Ltd 半導体装置
JP4949733B2 (ja) * 2006-05-11 2012-06-13 ルネサスエレクトロニクス株式会社 半導体装置

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