JP2007504716A5 - - Google Patents

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Publication number
JP2007504716A5
JP2007504716A5 JP2006524859A JP2006524859A JP2007504716A5 JP 2007504716 A5 JP2007504716 A5 JP 2007504716A5 JP 2006524859 A JP2006524859 A JP 2006524859A JP 2006524859 A JP2006524859 A JP 2006524859A JP 2007504716 A5 JP2007504716 A5 JP 2007504716A5
Authority
JP
Japan
Prior art keywords
input
output pin
oscillator
oscillator circuit
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006524859A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007504716A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/027797 external-priority patent/WO2005022597A2/en
Publication of JP2007504716A publication Critical patent/JP2007504716A/ja
Publication of JP2007504716A5 publication Critical patent/JP2007504716A5/ja
Pending legal-status Critical Current

Links

JP2006524859A 2003-08-28 2004-08-27 マルチループ構成から形成されたインダクタンスループを有する集積回路パッケージ Pending JP2007504716A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49835403P 2003-08-28 2003-08-28
PCT/US2004/027797 WO2005022597A2 (en) 2003-08-28 2004-08-27 Integrated circuit package having an inductance loop formed from a multi-loop configuration

Publications (2)

Publication Number Publication Date
JP2007504716A JP2007504716A (ja) 2007-03-01
JP2007504716A5 true JP2007504716A5 (enExample) 2007-10-18

Family

ID=34272661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006524859A Pending JP2007504716A (ja) 2003-08-28 2004-08-27 マルチループ構成から形成されたインダクタンスループを有する集積回路パッケージ

Country Status (8)

Country Link
US (1) US7768097B2 (enExample)
EP (1) EP1665383A2 (enExample)
JP (1) JP2007504716A (enExample)
KR (1) KR100819134B1 (enExample)
CN (1) CN1868065A (enExample)
CA (1) CA2537259A1 (enExample)
TW (1) TW200520121A (enExample)
WO (1) WO2005022597A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489022B2 (en) * 2005-08-02 2009-02-10 Viasat, Inc. Radio frequency over-molded leadframe package
CN100511664C (zh) * 2006-07-11 2009-07-08 日月光半导体制造股份有限公司 芯片封装结构
US8035218B2 (en) * 2009-11-03 2011-10-11 Intel Corporation Microelectronic package and method of manufacturing same
US9999129B2 (en) 2009-11-12 2018-06-12 Intel Corporation Microelectronic device and method of manufacturing same
US9236872B2 (en) 2012-03-12 2016-01-12 Seiko Epson Corporation Voltage-controlled oscillator, signal generation apparatus, and electronic device
KR101888401B1 (ko) 2012-05-09 2018-08-16 삼성전자주식회사 집적 회로를 위한 인덕터
US10734298B2 (en) * 2018-06-22 2020-08-04 Microchip Technology Incorporated Methods of reinforcing integrated circuitry of semiconductor devices and related semiconductor devices and packages
FR3099667A1 (fr) * 2019-07-29 2021-02-05 Stmicroelectronics S.R.L. Oscillateur commandé en tension à transformateur actif distribué
CN111835308B (zh) * 2020-07-15 2023-09-05 武汉博畅通信设备有限责任公司 一种数控电调滤波器

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175884A (en) 1990-06-01 1992-12-29 Motorola, Inc. Voltage controlled oscillator with current control
JP2581398B2 (ja) 1993-07-12 1997-02-12 日本電気株式会社 Pll周波数シンセサイザ
US5739730A (en) 1995-12-22 1998-04-14 Microtune, Inc. Voltage controlled oscillator band switching technique
WO1997037432A1 (en) 1996-04-02 1997-10-09 Philips Electronics N.V. Portable radio comprising a connectable circuit
GB2317279B (en) 1996-09-11 2001-01-24 Nec Technologies Frequency synthesisers
US5839184A (en) * 1997-07-10 1998-11-24 Vlsi Technology, Inc. Method for creating on-package inductors for use with integrated circuits
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
US5886393A (en) * 1997-11-07 1999-03-23 National Semiconductor Corporation Bonding wire inductor for use in an integrated circuit package and method
US6034423A (en) * 1998-04-02 2000-03-07 National Semiconductor Corporation Lead frame design for increased chip pinout
US6137372A (en) 1998-05-29 2000-10-24 Silicon Laboratories Inc. Method and apparatus for providing coarse and fine tuning control for synthesizing high-frequency signals for wireless communications
US6335952B1 (en) 1998-07-24 2002-01-01 Gct Semiconductor, Inc. Single chip CMOS transmitter/receiver
US6194947B1 (en) 1998-07-24 2001-02-27 Global Communication Technology Inc. VCO-mixer structure
US6194774B1 (en) 1999-03-10 2001-02-27 Samsung Electronics Co., Ltd. Inductor including bonding wires
WO2001010025A1 (en) 1999-08-02 2001-02-08 Qualcomm Incorporated Method and apparatus for multiple band voltage controlled oscillator with noise immunity
US6323735B1 (en) * 2000-05-25 2001-11-27 Silicon Laboratories, Inc. Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
JP2002076250A (ja) * 2000-08-29 2002-03-15 Nec Corp 半導体装置
US6538336B1 (en) * 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits
DE10061241A1 (de) 2000-12-08 2002-06-27 Infineon Technologies Ag Oszillatorschaltung
US6803665B1 (en) * 2001-11-02 2004-10-12 Skyworks Solutions, Inc. Off-chip inductor
US6621140B1 (en) 2002-02-25 2003-09-16 Rf Micro Devices, Inc. Leadframe inductors
KR20020069181A (ko) * 2002-05-13 2002-08-29 주식회사 엠씨링크 에프엠 전송신호 발생기용 전압조정 발진기의 집적회로 설계방법
US6876266B2 (en) * 2002-06-10 2005-04-05 Gct Semiconductor, Inc. LC oscillator with wide tuning range and low phase noise
KR100399585B1 (ko) * 2002-09-12 2003-09-26 (주) 가인테크 상보성 트랜지스터를 이용한 전압 제어 발진기

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