CN1868065A - 具有由多环结构形成的电感环的集成电路封装 - Google Patents

具有由多环结构形成的电感环的集成电路封装 Download PDF

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Publication number
CN1868065A
CN1868065A CNA2004800298246A CN200480029824A CN1868065A CN 1868065 A CN1868065 A CN 1868065A CN A2004800298246 A CNA2004800298246 A CN A2004800298246A CN 200480029824 A CN200480029824 A CN 200480029824A CN 1868065 A CN1868065 A CN 1868065A
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pin
conductor
chip
semiconductor packages
pad
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English (en)
Chinese (zh)
Inventor
具利度
许炯基
李康润
李正雨
朴畯培
李京浩
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GCT Semiconductor Inc
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GCT Semiconductor Inc
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Publication of CN1868065A publication Critical patent/CN1868065A/zh
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
CNA2004800298246A 2003-08-28 2004-08-27 具有由多环结构形成的电感环的集成电路封装 Pending CN1868065A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49835403P 2003-08-28 2003-08-28
US60/498,354 2003-08-28

Publications (1)

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CN1868065A true CN1868065A (zh) 2006-11-22

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CNA2004800298246A Pending CN1868065A (zh) 2003-08-28 2004-08-27 具有由多环结构形成的电感环的集成电路封装

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Country Link
US (1) US7768097B2 (enExample)
EP (1) EP1665383A2 (enExample)
JP (1) JP2007504716A (enExample)
KR (1) KR100819134B1 (enExample)
CN (1) CN1868065A (enExample)
CA (1) CA2537259A1 (enExample)
TW (1) TW200520121A (enExample)
WO (1) WO2005022597A2 (enExample)

Cited By (1)

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CN112368832A (zh) * 2018-06-22 2021-02-12 微芯片技术股份有限公司 具有增强型集成电路的半导体器件及其制造方法

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US8035218B2 (en) * 2009-11-03 2011-10-11 Intel Corporation Microelectronic package and method of manufacturing same
US9999129B2 (en) 2009-11-12 2018-06-12 Intel Corporation Microelectronic device and method of manufacturing same
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FR3099667A1 (fr) * 2019-07-29 2021-02-05 Stmicroelectronics S.R.L. Oscillateur commandé en tension à transformateur actif distribué
CN111835308B (zh) * 2020-07-15 2023-09-05 武汉博畅通信设备有限责任公司 一种数控电调滤波器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112368832A (zh) * 2018-06-22 2021-02-12 微芯片技术股份有限公司 具有增强型集成电路的半导体器件及其制造方法
CN112368832B (zh) * 2018-06-22 2021-12-28 微芯片技术股份有限公司 具有增强型集成电路的半导体器件及其制造方法

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EP1665383A2 (en) 2006-06-07
KR20060115857A (ko) 2006-11-10
TW200520121A (en) 2005-06-16
CA2537259A1 (en) 2005-03-10
KR100819134B1 (ko) 2008-04-03
US7768097B2 (en) 2010-08-03
WO2005022597A2 (en) 2005-03-10
JP2007504716A (ja) 2007-03-01
WO2005022597A3 (en) 2005-08-04
US20050045986A1 (en) 2005-03-03

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