KR100819134B1 - 다중 루프 구성으로부터 형성된 인덕턴스 루프를 갖는집적회로 패키지 - Google Patents

다중 루프 구성으로부터 형성된 인덕턴스 루프를 갖는집적회로 패키지 Download PDF

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KR100819134B1
KR100819134B1 KR1020067004265A KR20067004265A KR100819134B1 KR 100819134 B1 KR100819134 B1 KR 100819134B1 KR 1020067004265 A KR1020067004265 A KR 1020067004265A KR 20067004265 A KR20067004265 A KR 20067004265A KR 100819134 B1 KR100819134 B1 KR 100819134B1
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package
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loop
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KR20060115857A (ko
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구이도
허형기
이강윤
이정우
박준배
이경호
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지씨티 세미컨덕터 인코포레이티드
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1020067004265A 2003-08-28 2004-08-27 다중 루프 구성으로부터 형성된 인덕턴스 루프를 갖는집적회로 패키지 Expired - Fee Related KR100819134B1 (ko)

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US49835403P 2003-08-28 2003-08-28
US60/498,354 2003-08-28

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KR20060115857A KR20060115857A (ko) 2006-11-10
KR100819134B1 true KR100819134B1 (ko) 2008-04-03

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Country Link
US (1) US7768097B2 (enExample)
EP (1) EP1665383A2 (enExample)
JP (1) JP2007504716A (enExample)
KR (1) KR100819134B1 (enExample)
CN (1) CN1868065A (enExample)
CA (1) CA2537259A1 (enExample)
TW (1) TW200520121A (enExample)
WO (1) WO2005022597A2 (enExample)

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US8035218B2 (en) * 2009-11-03 2011-10-11 Intel Corporation Microelectronic package and method of manufacturing same
US9999129B2 (en) 2009-11-12 2018-06-12 Intel Corporation Microelectronic device and method of manufacturing same
CN104160627B (zh) 2012-03-12 2017-05-17 精工爱普生株式会社 电压控制振荡器、信号发生装置以及电子设备
KR101888401B1 (ko) 2012-05-09 2018-08-16 삼성전자주식회사 집적 회로를 위한 인덕터
US10734298B2 (en) * 2018-06-22 2020-08-04 Microchip Technology Incorporated Methods of reinforcing integrated circuitry of semiconductor devices and related semiconductor devices and packages
FR3099667A1 (fr) * 2019-07-29 2021-02-05 Stmicroelectronics S.R.L. Oscillateur commandé en tension à transformateur actif distribué
CN111835308B (zh) * 2020-07-15 2023-09-05 武汉博畅通信设备有限责任公司 一种数控电调滤波器
CN114864531B (zh) * 2021-02-03 2025-12-19 瑞昱半导体股份有限公司 集成电路导线架及其半导体装置

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KR20020089226A (ko) * 2002-09-12 2002-11-29 (주) 가인테크 상보성 트랜지스터를 이용한 전압 제어 발진기

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US6194774B1 (en) 1999-03-10 2001-02-27 Samsung Electronics Co., Ltd. Inductor including bonding wires
US6323735B1 (en) 2000-05-25 2001-11-27 Silicon Laboratories, Inc. Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
KR20020069181A (ko) * 2002-05-13 2002-08-29 주식회사 엠씨링크 에프엠 전송신호 발생기용 전압조정 발진기의 집적회로 설계방법
KR20020089226A (ko) * 2002-09-12 2002-11-29 (주) 가인테크 상보성 트랜지스터를 이용한 전압 제어 발진기

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WO2005022597A3 (en) 2005-08-04
JP2007504716A (ja) 2007-03-01
WO2005022597A2 (en) 2005-03-10
KR20060115857A (ko) 2006-11-10
TW200520121A (en) 2005-06-16
US20050045986A1 (en) 2005-03-03
US7768097B2 (en) 2010-08-03
CN1868065A (zh) 2006-11-22
EP1665383A2 (en) 2006-06-07
CA2537259A1 (en) 2005-03-10

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