JP2007504716A - マルチループ構成から形成されたインダクタンスループを有する集積回路パッケージ - Google Patents

マルチループ構成から形成されたインダクタンスループを有する集積回路パッケージ Download PDF

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JP2007504716A
JP2007504716A JP2006524859A JP2006524859A JP2007504716A JP 2007504716 A JP2007504716 A JP 2007504716A JP 2006524859 A JP2006524859 A JP 2006524859A JP 2006524859 A JP2006524859 A JP 2006524859A JP 2007504716 A JP2007504716 A JP 2007504716A
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input
output pin
package
output
chip
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JP2007504716A5 (enExample
Inventor
イド コ
ヒュンキ フー
カン ヨン イ
ジョン−ウ イ
ジョンペ パク
キョンホ イ
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ジーシーティー セミコンダクター インコーポレイテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/30107—Inductance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP2006524859A 2003-08-28 2004-08-27 マルチループ構成から形成されたインダクタンスループを有する集積回路パッケージ Pending JP2007504716A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49835403P 2003-08-28 2003-08-28
PCT/US2004/027797 WO2005022597A2 (en) 2003-08-28 2004-08-27 Integrated circuit package having an inductance loop formed from a multi-loop configuration

Publications (2)

Publication Number Publication Date
JP2007504716A true JP2007504716A (ja) 2007-03-01
JP2007504716A5 JP2007504716A5 (enExample) 2007-10-18

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JP2006524859A Pending JP2007504716A (ja) 2003-08-28 2004-08-27 マルチループ構成から形成されたインダクタンスループを有する集積回路パッケージ

Country Status (8)

Country Link
US (1) US7768097B2 (enExample)
EP (1) EP1665383A2 (enExample)
JP (1) JP2007504716A (enExample)
KR (1) KR100819134B1 (enExample)
CN (1) CN1868065A (enExample)
CA (1) CA2537259A1 (enExample)
TW (1) TW200520121A (enExample)
WO (1) WO2005022597A2 (enExample)

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WO2013136766A1 (ja) * 2012-03-12 2013-09-19 セイコーエプソン株式会社 電圧制御発振器、信号発生装置、及び、電子機器

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US8035218B2 (en) * 2009-11-03 2011-10-11 Intel Corporation Microelectronic package and method of manufacturing same
US9999129B2 (en) 2009-11-12 2018-06-12 Intel Corporation Microelectronic device and method of manufacturing same
KR101888401B1 (ko) 2012-05-09 2018-08-16 삼성전자주식회사 집적 회로를 위한 인덕터
US10734298B2 (en) * 2018-06-22 2020-08-04 Microchip Technology Incorporated Methods of reinforcing integrated circuitry of semiconductor devices and related semiconductor devices and packages
FR3099667A1 (fr) * 2019-07-29 2021-02-05 Stmicroelectronics S.R.L. Oscillateur commandé en tension à transformateur actif distribué
CN111835308B (zh) * 2020-07-15 2023-09-05 武汉博畅通信设备有限责任公司 一种数控电调滤波器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013136766A1 (ja) * 2012-03-12 2013-09-19 セイコーエプソン株式会社 電圧制御発振器、信号発生装置、及び、電子機器
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Also Published As

Publication number Publication date
EP1665383A2 (en) 2006-06-07
KR20060115857A (ko) 2006-11-10
TW200520121A (en) 2005-06-16
CA2537259A1 (en) 2005-03-10
KR100819134B1 (ko) 2008-04-03
US7768097B2 (en) 2010-08-03
WO2005022597A2 (en) 2005-03-10
WO2005022597A3 (en) 2005-08-04
CN1868065A (zh) 2006-11-22
US20050045986A1 (en) 2005-03-03

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