JP2010199553A5 - - Google Patents
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- Publication number
- JP2010199553A5 JP2010199553A5 JP2009279911A JP2009279911A JP2010199553A5 JP 2010199553 A5 JP2010199553 A5 JP 2010199553A5 JP 2009279911 A JP2009279911 A JP 2009279911A JP 2009279911 A JP2009279911 A JP 2009279911A JP 2010199553 A5 JP2010199553 A5 JP 2010199553A5
- Authority
- JP
- Japan
- Prior art keywords
- ground pattern
- signal
- wiring
- printed circuit
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009279911A JP5409312B2 (ja) | 2009-01-30 | 2009-12-09 | 多層プリント回路板 |
| US13/140,094 US8530750B2 (en) | 2009-01-30 | 2010-01-28 | Multilayer printed circuit board |
| CN201080005398.8A CN102293068B (zh) | 2009-01-30 | 2010-01-28 | 多层印刷电路板 |
| PCT/JP2010/051547 WO2010087506A1 (en) | 2009-01-30 | 2010-01-28 | Multilayer printed circuit board |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009019297 | 2009-01-30 | ||
| JP2009019297 | 2009-01-30 | ||
| JP2009279911A JP5409312B2 (ja) | 2009-01-30 | 2009-12-09 | 多層プリント回路板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010199553A JP2010199553A (ja) | 2010-09-09 |
| JP2010199553A5 true JP2010199553A5 (enExample) | 2013-09-12 |
| JP5409312B2 JP5409312B2 (ja) | 2014-02-05 |
Family
ID=42026336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009279911A Expired - Fee Related JP5409312B2 (ja) | 2009-01-30 | 2009-12-09 | 多層プリント回路板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8530750B2 (enExample) |
| JP (1) | JP5409312B2 (enExample) |
| CN (1) | CN102293068B (enExample) |
| WO (1) | WO2010087506A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201316895A (zh) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | 可抑制電磁干擾的電路板 |
| JP5348259B2 (ja) | 2012-02-02 | 2013-11-20 | 横河電機株式会社 | 絶縁回路及び通信機器 |
| US8913401B2 (en) | 2012-11-14 | 2014-12-16 | Fuji Xerox Co., Ltd. | Multilayer wiring board |
| JP5803961B2 (ja) * | 2013-03-21 | 2015-11-04 | 株式会社豊田自動織機 | 基板間隔保持部材及びインバータ装置 |
| WO2015140856A1 (ja) * | 2014-03-18 | 2015-09-24 | パナソニックＩｐマネジメント株式会社 | 電子機器 |
| JP6399969B2 (ja) * | 2015-05-22 | 2018-10-03 | 三菱電機株式会社 | プリント基板 |
| WO2019159549A1 (ja) * | 2018-02-15 | 2019-08-22 | パナソニックＩｐマネジメント株式会社 | 回路基板、電子機器 |
| KR102616482B1 (ko) | 2018-07-26 | 2023-12-26 | 삼성전자주식회사 | 전원 배선에서 발생된 전자기파를 상쇄하기 위한 접지 배선을 포함하는 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
| JP7547036B2 (ja) * | 2019-08-09 | 2024-09-09 | キヤノン株式会社 | プリント基板 |
| JP7160012B2 (ja) * | 2019-10-03 | 2022-10-25 | 株式会社デンソー | 電子制御装置 |
| US12127330B2 (en) * | 2019-12-27 | 2024-10-22 | Hitachi Astemo, Ltd. | Electronic control device |
| JP7705765B2 (ja) * | 2021-09-22 | 2025-07-10 | 理想科学工業株式会社 | 電子機器 |
| CN115175441B (zh) * | 2022-08-01 | 2024-03-12 | 哈尔滨理工大学 | 真空低介电常数及低电导率的微电流传输电路板 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10208791A (ja) * | 1997-01-21 | 1998-08-07 | Canon Inc | 筐体内部のフレームグラウンド間接続方法 |
| JPH11177274A (ja) * | 1997-12-08 | 1999-07-02 | Canon Inc | プリント配線基板とケーブルおよび筐体との接続方法、および電子機器 |
| JP3703362B2 (ja) * | 2000-03-14 | 2005-10-05 | キヤノン株式会社 | 電子機器 |
| US6573804B2 (en) * | 2000-03-14 | 2003-06-03 | Canon Kabushiki Kaisha | Electronic apparatus having a printed circuit board with multi-point grounding |
| US6507495B1 (en) * | 2000-06-28 | 2003-01-14 | Dell Products L.P. | Three-dimensional technique for improving the EMC characteristics of a printed circuit board |
| US6937480B2 (en) | 2001-05-14 | 2005-08-30 | Fuji Xerox Co., Ltd. | Printed wiring board |
| JP2003163467A (ja) * | 2001-05-14 | 2003-06-06 | Fuji Xerox Co Ltd | プリント配線基板及びプリント配線基板設計支援装置 |
| KR100731544B1 (ko) * | 2006-04-13 | 2007-06-22 | 한국전자통신연구원 | 다층배선 코플래너 웨이브가이드 |
| JP5025376B2 (ja) * | 2006-09-11 | 2012-09-12 | キヤノン株式会社 | プリント配線板及び電子機器 |
-
2009
- 2009-12-09 JP JP2009279911A patent/JP5409312B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-28 CN CN201080005398.8A patent/CN102293068B/zh not_active Expired - Fee Related
- 2010-01-28 US US13/140,094 patent/US8530750B2/en not_active Expired - Fee Related
- 2010-01-28 WO PCT/JP2010/051547 patent/WO2010087506A1/en not_active Ceased