JP2008193000A5 - - Google Patents

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Publication number
JP2008193000A5
JP2008193000A5 JP2007028527A JP2007028527A JP2008193000A5 JP 2008193000 A5 JP2008193000 A5 JP 2008193000A5 JP 2007028527 A JP2007028527 A JP 2007028527A JP 2007028527 A JP2007028527 A JP 2007028527A JP 2008193000 A5 JP2008193000 A5 JP 2008193000A5
Authority
JP
Japan
Prior art keywords
signal wiring
wiring
width
substrate according
connecting land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007028527A
Other languages
English (en)
Japanese (ja)
Other versions
JP4851954B2 (ja
JP2008193000A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007028527A priority Critical patent/JP4851954B2/ja
Priority claimed from JP2007028527A external-priority patent/JP4851954B2/ja
Publication of JP2008193000A publication Critical patent/JP2008193000A/ja
Publication of JP2008193000A5 publication Critical patent/JP2008193000A5/ja
Application granted granted Critical
Publication of JP4851954B2 publication Critical patent/JP4851954B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007028527A 2007-02-07 2007-02-07 基板および電子機器 Expired - Fee Related JP4851954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007028527A JP4851954B2 (ja) 2007-02-07 2007-02-07 基板および電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007028527A JP4851954B2 (ja) 2007-02-07 2007-02-07 基板および電子機器

Publications (3)

Publication Number Publication Date
JP2008193000A JP2008193000A (ja) 2008-08-21
JP2008193000A5 true JP2008193000A5 (enExample) 2010-03-18
JP4851954B2 JP4851954B2 (ja) 2012-01-11

Family

ID=39752783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007028527A Expired - Fee Related JP4851954B2 (ja) 2007-02-07 2007-02-07 基板および電子機器

Country Status (1)

Country Link
JP (1) JP4851954B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010206069A (ja) * 2009-03-05 2010-09-16 Nec Corp 回路基板
JP5966875B2 (ja) 2012-11-16 2016-08-10 富士通株式会社 コネクタ及びフレキシブルプリント基板
JP6734911B2 (ja) 2018-12-04 2020-08-05 日本航空電子工業株式会社 回路基板及びそれを備えるケーブルハーネス
WO2021201466A1 (ko) * 2020-03-31 2021-10-07 삼성전자 주식회사 고주파 대역의 신호를 전달하는 인쇄 회로 기판 및 그것을 포함하는 전자 장치
EP4646040A1 (en) * 2022-12-30 2025-11-05 LG Electronics Inc. Flexible printed circuit board and antenna assembly comprising same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6484622A (en) * 1987-09-28 1989-03-29 Toshiba Corp Semiconductor integrated circuit package
JP2001203300A (ja) * 2000-01-18 2001-07-27 Matsushita Electric Ind Co Ltd 配線用基板と半導体装置および配線用基板の製造方法
JP2001313504A (ja) * 2000-04-14 2001-11-09 Internatl Business Mach Corp <Ibm> 信号伝送線路接続用コネクタ、信号伝送線路、及び基板
JP2002043810A (ja) * 2000-07-21 2002-02-08 Sony Corp マイクロストリップ線路
JP2003124712A (ja) * 2001-10-17 2003-04-25 Opnext Japan Inc 高周波伝送線路およびそれを用いた電子部品または電子装置
JP2003186942A (ja) * 2001-12-18 2003-07-04 Fuji Xerox Co Ltd プリント配線基板設計支援装置及び方法並びにプログラム及び記録媒体

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