JP2016219553A5 - - Google Patents

Download PDF

Info

Publication number
JP2016219553A5
JP2016219553A5 JP2015101404A JP2015101404A JP2016219553A5 JP 2016219553 A5 JP2016219553 A5 JP 2016219553A5 JP 2015101404 A JP2015101404 A JP 2015101404A JP 2015101404 A JP2015101404 A JP 2015101404A JP 2016219553 A5 JP2016219553 A5 JP 2016219553A5
Authority
JP
Japan
Prior art keywords
circuit board
slit
signal ground
board according
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015101404A
Other languages
English (en)
Japanese (ja)
Other versions
JP6422395B2 (ja
JP2016219553A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015101404A priority Critical patent/JP6422395B2/ja
Priority claimed from JP2015101404A external-priority patent/JP6422395B2/ja
Publication of JP2016219553A publication Critical patent/JP2016219553A/ja
Publication of JP2016219553A5 publication Critical patent/JP2016219553A5/ja
Application granted granted Critical
Publication of JP6422395B2 publication Critical patent/JP6422395B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015101404A 2015-05-18 2015-05-18 回路基板 Active JP6422395B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015101404A JP6422395B2 (ja) 2015-05-18 2015-05-18 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015101404A JP6422395B2 (ja) 2015-05-18 2015-05-18 回路基板

Publications (3)

Publication Number Publication Date
JP2016219553A JP2016219553A (ja) 2016-12-22
JP2016219553A5 true JP2016219553A5 (enExample) 2017-12-21
JP6422395B2 JP6422395B2 (ja) 2018-11-14

Family

ID=57581496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015101404A Active JP6422395B2 (ja) 2015-05-18 2015-05-18 回路基板

Country Status (1)

Country Link
JP (1) JP6422395B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109565927A (zh) * 2017-03-24 2019-04-02 三菱电机株式会社 电路基板
JP6479288B1 (ja) 2017-06-09 2019-03-06 三菱電機株式会社 プリント基板
JP6999447B2 (ja) * 2018-02-27 2022-01-18 Hoya株式会社 内視鏡システム、及びプロセッサ
JP6867036B2 (ja) * 2018-03-26 2021-04-28 Necプラットフォームズ株式会社 無線通信装置およびノイズ抑制方法
JP7058563B2 (ja) * 2018-06-14 2022-04-22 三菱電機株式会社 回路基板ユニット
CN113711160B (zh) * 2019-04-23 2022-10-21 三菱电机株式会社 电子设备
JP7547036B2 (ja) * 2019-08-09 2024-09-09 キヤノン株式会社 プリント基板
JP6843312B1 (ja) * 2020-03-25 2021-03-17 三菱電機株式会社 回路基板及び電子機器
US12057414B2 (en) 2021-04-06 2024-08-06 Mitsubishi Electric Corporation Printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5063529B2 (ja) * 2008-08-22 2012-10-31 キヤノン株式会社 プリント回路板
JP5868285B2 (ja) * 2012-08-09 2016-02-24 三菱電機株式会社 プリント基板
JP5740427B2 (ja) * 2013-03-29 2015-06-24 本田技研工業株式会社 回路基板を備える制御装置
JP6076174B2 (ja) * 2013-03-29 2017-02-08 本田技研工業株式会社 雑音耐性の高い制御装置

Similar Documents

Publication Publication Date Title
JP2016219553A5 (enExample)
JP2016134615A5 (enExample)
JP2016207958A5 (enExample)
JP2013225610A5 (enExample)
TW201613053A (en) Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication
JP2017212377A5 (enExample)
WO2015015319A3 (en) Architecture of spare wiring structures for improved engineering change orders
JP2014082455A5 (ja) フレキシブル基板、基板接続構造及び光モジュール
WO2016118210A3 (en) Interconnect structures for assembly of multi-layer semiconductor devices
JP2014197522A5 (ja) 発光装置
GB2557101A (en) Tamper-respondent sensors with formed flexible layer(s)
JP2016207957A5 (enExample)
JP2016063046A5 (enExample)
JP2015076597A5 (enExample)
EP2770409A3 (en) Touch panel and manufacturing method thereof
JP2018174302A5 (enExample)
JP2011134957A5 (enExample)
JP2013219191A5 (enExample)
JP2016207959A5 (enExample)
JP2014110390A5 (enExample)
JP2016086043A5 (enExample)
JP2013247225A5 (enExample)
JP2010050298A5 (enExample)
JP2019211676A5 (enExample)
LT3600865T (lt) Daugiasluoksnio pado gamybos tiesiai ant batviršio būdas