JP2018174302A5 - - Google Patents

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Publication number
JP2018174302A5
JP2018174302A5 JP2018011616A JP2018011616A JP2018174302A5 JP 2018174302 A5 JP2018174302 A5 JP 2018174302A5 JP 2018011616 A JP2018011616 A JP 2018011616A JP 2018011616 A JP2018011616 A JP 2018011616A JP 2018174302 A5 JP2018174302 A5 JP 2018174302A5
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JP
Japan
Prior art keywords
prefabricated
simplify
assembly
component
layer
Prior art date
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Application number
JP2018011616A
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English (en)
Japanese (ja)
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JP2018174302A (ja
JP7109927B2 (ja
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Publication date
Priority claimed from NL2018244A external-priority patent/NL2018244B1/en
Application filed filed Critical
Publication of JP2018174302A publication Critical patent/JP2018174302A/ja
Publication of JP2018174302A5 publication Critical patent/JP2018174302A5/ja
Application granted granted Critical
Publication of JP7109927B2 publication Critical patent/JP7109927B2/ja
Active legal-status Critical Current
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JP2018011616A 2017-01-27 2018-01-26 エンドエフェクタ Active JP7109927B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2018244A NL2018244B1 (en) 2017-01-27 2017-01-27 Endeffektor
NL2018244 2017-01-27

Publications (3)

Publication Number Publication Date
JP2018174302A JP2018174302A (ja) 2018-11-08
JP2018174302A5 true JP2018174302A5 (enExample) 2019-12-26
JP7109927B2 JP7109927B2 (ja) 2022-08-01

Family

ID=58606566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018011616A Active JP7109927B2 (ja) 2017-01-27 2018-01-26 エンドエフェクタ

Country Status (9)

Country Link
US (1) US10343292B2 (enExample)
JP (1) JP7109927B2 (enExample)
KR (1) KR20180088597A (enExample)
CN (1) CN108364896A (enExample)
AT (1) AT519588B1 (enExample)
DE (1) DE102018100855A1 (enExample)
NL (1) NL2018244B1 (enExample)
SG (1) SG10201800713TA (enExample)
TW (1) TWI710437B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7175735B2 (ja) * 2018-12-11 2022-11-21 平田機工株式会社 基板搬送装置
KR102700312B1 (ko) * 2018-12-11 2024-08-30 로제 가부시키가이샤 정전 용량 센서
US11574837B2 (en) 2020-06-12 2023-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Robot blade having multiple sensors for multiple different alignment tasks
FR3112980B1 (fr) * 2020-07-28 2022-07-22 Defitech Caisson d’aspiration pour un préhenseur
USD949219S1 (en) * 2020-08-20 2022-04-19 Grey Orange Pte. Ltd. Spatula gripper
JP7741631B2 (ja) 2020-12-21 2025-09-18 キヤノン株式会社 搬送ハンド
TWI796709B (zh) * 2021-06-16 2023-03-21 盛詮科技股份有限公司 晶圓懸浮手臂
EP4273911A1 (de) 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
CN118156204A (zh) * 2022-12-07 2024-06-07 纬创资通(重庆)有限公司 晶圆搬运设备及其吸盘模块
CN115632023B (zh) * 2022-12-22 2023-08-04 河北博特半导体设备科技有限公司 一种双臂晶圆传输装置
TWI814679B (zh) * 2023-02-13 2023-09-01 盛詮科技股份有限公司 載板懸浮手臂
CN116313977A (zh) * 2023-03-21 2023-06-23 上海卡贝尼精密陶瓷有限公司 真空手臂及其制造方法
KR102849386B1 (ko) * 2023-06-23 2025-08-22 주식회사 쎄믹스 웨이퍼 지지 구조체 및 이를 구비한 웨이퍼 이송 장치
WO2024262825A1 (ko) * 2023-06-23 2024-12-26 (주)쎄믹스 웨이퍼 지지 구조체 및 이를 구비한 웨이퍼 이송 장치

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
US4620738A (en) * 1985-08-19 1986-11-04 Varian Associates, Inc. Vacuum pick for semiconductor wafers
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
EP0634787B1 (en) * 1993-07-15 1997-05-02 Applied Materials, Inc. Subsrate tray and ceramic blade for semiconductor processing apparatus
JPH09139413A (ja) * 1995-11-14 1997-05-27 Du Pont Kk 基板搬送部品および基板搬送装置
JPH11354607A (ja) * 1998-06-10 1999-12-24 Mitsubishi Chemical Corp 搬送装置用ハンド
US6244641B1 (en) * 1999-12-02 2001-06-12 M.E.C. Technology, Inc. Wafer transfer arm
JP2003168718A (ja) * 2001-11-30 2003-06-13 Murata Mach Ltd 枚葉移載装置
KR100989012B1 (ko) * 2002-07-29 2010-10-20 신닛뽄 세끼유 가부시끼가이샤 반사 표면을 갖는 탄소섬유 복합물 전달 부재
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
JP4214509B2 (ja) * 2002-12-03 2009-01-28 株式会社ニコン 吸着保持部材及び吸着保持装置
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
DE102006031434B4 (de) * 2006-07-07 2019-11-14 Erich Thallner Handhabungsvorrichtung sowie Handhabungsverfahren für Wafer
US20080247857A1 (en) * 2007-04-05 2008-10-09 Ichiro Yuasa End effector and robot for transporting substrate
JP2009285823A (ja) * 2008-05-28 2009-12-10 Meian Kokusai Gigyo Kofun Yugenkoshi ロボットアーム、並びに、その保持手段の構成材及び該構成材の製造方法
JP2011110682A (ja) * 2009-11-30 2011-06-09 Jx Nippon Oil & Energy Corp ロボットハンド及びその製造方法
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JP2013078810A (ja) * 2011-10-03 2013-05-02 Smc Corp 真空吸着装置
CN105556654B (zh) * 2013-09-26 2019-07-26 应用材料公司 用于传送基板的气动终端受动器装置、基板传送系统与方法
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
US9415519B2 (en) * 2014-07-01 2016-08-16 Varian Semiconductor Equipment Associates, Inc. Composite end effector and method of making a composite end effector
US20160254176A1 (en) * 2015-02-27 2016-09-01 AZSimilate, LLC Positive Pressure Bernoulli Wand with Coiled Path

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