CN115632023B - 一种双臂晶圆传输装置 - Google Patents
一种双臂晶圆传输装置 Download PDFInfo
- Publication number
- CN115632023B CN115632023B CN202211651699.9A CN202211651699A CN115632023B CN 115632023 B CN115632023 B CN 115632023B CN 202211651699 A CN202211651699 A CN 202211651699A CN 115632023 B CN115632023 B CN 115632023B
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- assembly
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- wafer
- driving
- adsorption
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 88
- 238000001179 sorption measurement Methods 0.000 claims abstract description 57
- 230000001360 synchronised effect Effects 0.000 claims description 25
- 238000012546 transfer Methods 0.000 claims description 18
- 238000000429 assembly Methods 0.000 claims description 13
- 230000000712 assembly Effects 0.000 claims description 13
- 230000009977 dual effect Effects 0.000 claims description 12
- 238000012360 testing method Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 85
- 238000000034 method Methods 0.000 description 5
- 238000005086 pumping Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211651699.9A CN115632023B (zh) | 2022-12-22 | 2022-12-22 | 一种双臂晶圆传输装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211651699.9A CN115632023B (zh) | 2022-12-22 | 2022-12-22 | 一种双臂晶圆传输装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115632023A CN115632023A (zh) | 2023-01-20 |
CN115632023B true CN115632023B (zh) | 2023-08-04 |
Family
ID=84910851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211651699.9A Active CN115632023B (zh) | 2022-12-22 | 2022-12-22 | 一种双臂晶圆传输装置 |
Country Status (1)
Country | Link |
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CN (1) | CN115632023B (zh) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060040125A (ko) * | 2004-11-04 | 2006-05-10 | 삼성전자주식회사 | 웨이퍼 라벨링 설비용 웨이퍼 이송 암 |
CN103476551A (zh) * | 2010-11-10 | 2013-12-25 | 布鲁克斯自动化公司 | 双臂机器人 |
CN103794537A (zh) * | 2014-02-28 | 2014-05-14 | 深圳市华龙精密模具有限公司 | 一种半导体自动排片设备的抓料机械手 |
CN106409740A (zh) * | 2016-10-21 | 2017-02-15 | 山东大学 | 一种单臂三自由度的晶圆传输机械手及使用方法 |
JP2018010922A (ja) * | 2016-07-12 | 2018-01-18 | 東京エレクトロン株式会社 | 基板搬送装置および接合システム |
CN108364896A (zh) * | 2017-01-27 | 2018-08-03 | 苏斯微技术光刻有限公司 | 末端执行器 |
CN109192687A (zh) * | 2018-08-16 | 2019-01-11 | 北京华卓精科科技股份有限公司 | 一种传输硅片的机械装置 |
CN213042902U (zh) * | 2020-07-27 | 2021-04-23 | 憬承光电科技(厦门)有限公司 | 一种晶圆自动夹取双手臂机械手 |
CN213212139U (zh) * | 2021-03-19 | 2021-05-14 | 台湾积体电路制造股份有限公司 | 晶圆载具的夹取装置 |
CN214569097U (zh) * | 2021-02-05 | 2021-11-02 | 苏州新尚思自动化设备有限公司 | 一种双臂式晶圆取放机构 |
CN215521827U (zh) * | 2021-04-07 | 2022-01-14 | 东莞怡合达自动化股份有限公司 | 一种用于同步带传动型模组的同步带夹持块 |
TW202208134A (zh) * | 2020-07-02 | 2022-03-01 | 美商應用材料股份有限公司 | 用於在電子裝置製造中運輸基板的機器人設備和系統及方法 |
US11358809B1 (en) * | 2021-03-01 | 2022-06-14 | Applied Materials, Inc. | Vacuum robot apparatus for variable pitch access |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10381257B2 (en) * | 2015-08-31 | 2019-08-13 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and substrate processing system with pair of blade members arranged in position out of vertical direction |
-
2022
- 2022-12-22 CN CN202211651699.9A patent/CN115632023B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060040125A (ko) * | 2004-11-04 | 2006-05-10 | 삼성전자주식회사 | 웨이퍼 라벨링 설비용 웨이퍼 이송 암 |
CN103476551A (zh) * | 2010-11-10 | 2013-12-25 | 布鲁克斯自动化公司 | 双臂机器人 |
CN103794537A (zh) * | 2014-02-28 | 2014-05-14 | 深圳市华龙精密模具有限公司 | 一种半导体自动排片设备的抓料机械手 |
JP2018010922A (ja) * | 2016-07-12 | 2018-01-18 | 東京エレクトロン株式会社 | 基板搬送装置および接合システム |
CN106409740A (zh) * | 2016-10-21 | 2017-02-15 | 山东大学 | 一种单臂三自由度的晶圆传输机械手及使用方法 |
CN108364896A (zh) * | 2017-01-27 | 2018-08-03 | 苏斯微技术光刻有限公司 | 末端执行器 |
CN109192687A (zh) * | 2018-08-16 | 2019-01-11 | 北京华卓精科科技股份有限公司 | 一种传输硅片的机械装置 |
TW202208134A (zh) * | 2020-07-02 | 2022-03-01 | 美商應用材料股份有限公司 | 用於在電子裝置製造中運輸基板的機器人設備和系統及方法 |
CN213042902U (zh) * | 2020-07-27 | 2021-04-23 | 憬承光电科技(厦门)有限公司 | 一种晶圆自动夹取双手臂机械手 |
CN214569097U (zh) * | 2021-02-05 | 2021-11-02 | 苏州新尚思自动化设备有限公司 | 一种双臂式晶圆取放机构 |
US11358809B1 (en) * | 2021-03-01 | 2022-06-14 | Applied Materials, Inc. | Vacuum robot apparatus for variable pitch access |
CN213212139U (zh) * | 2021-03-19 | 2021-05-14 | 台湾积体电路制造股份有限公司 | 晶圆载具的夹取装置 |
CN215521827U (zh) * | 2021-04-07 | 2022-01-14 | 东莞怡合达自动化股份有限公司 | 一种用于同步带传动型模组的同步带夹持块 |
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CN115632023A (zh) | 2023-01-20 |
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Address after: No.1 Hanwang Road, Yanjiao Development Zone, Sanhe City, Langfang City, Hebei Province 065201 Patentee after: Hebei Bote Semiconductor Equipment Technology Co.,Ltd. Country or region after: China Patentee after: Beijing Ruihuayu Semiconductor Equipment Co.,Ltd. Address before: No.1 Hanwang Road, Yanjiao Development Zone, Sanhe City, Langfang City, Hebei Province 065201 Patentee before: Hebei Bote Semiconductor Equipment Technology Co.,Ltd. Country or region before: China Patentee before: Beijing Ketai optical core semiconductor equipment Technology Co.,Ltd. |
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Effective date of registration: 20240318 Address after: 528248, No. 16 Guangming Avenue, New Light Source Industrial Base, Shishan Town, Nanhai District, Foshan City, Guangdong Province (Residence application, multiple photos for one address) Patentee after: Foshan Xince Technology Co.,Ltd. Country or region after: China Address before: No.1 Hanwang Road, Yanjiao Development Zone, Sanhe City, Langfang City, Hebei Province 065201 Patentee before: Hebei Bote Semiconductor Equipment Technology Co.,Ltd. Country or region before: China Patentee before: Beijing Ruihuayu Semiconductor Equipment Co.,Ltd. |