JP6422395B2 - 回路基板 - Google Patents

回路基板 Download PDF

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Publication number
JP6422395B2
JP6422395B2 JP2015101404A JP2015101404A JP6422395B2 JP 6422395 B2 JP6422395 B2 JP 6422395B2 JP 2015101404 A JP2015101404 A JP 2015101404A JP 2015101404 A JP2015101404 A JP 2015101404A JP 6422395 B2 JP6422395 B2 JP 6422395B2
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Japan
Prior art keywords
wiring layer
layer
wiring
circuit board
slit
Prior art date
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Active
Application number
JP2015101404A
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English (en)
Japanese (ja)
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JP2016219553A5 (enExample
JP2016219553A (ja
Inventor
雄大 米岡
雄大 米岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2015101404A priority Critical patent/JP6422395B2/ja
Publication of JP2016219553A publication Critical patent/JP2016219553A/ja
Publication of JP2016219553A5 publication Critical patent/JP2016219553A5/ja
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Publication of JP6422395B2 publication Critical patent/JP6422395B2/ja
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  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2015101404A 2015-05-18 2015-05-18 回路基板 Active JP6422395B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015101404A JP6422395B2 (ja) 2015-05-18 2015-05-18 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015101404A JP6422395B2 (ja) 2015-05-18 2015-05-18 回路基板

Publications (3)

Publication Number Publication Date
JP2016219553A JP2016219553A (ja) 2016-12-22
JP2016219553A5 JP2016219553A5 (enExample) 2017-12-21
JP6422395B2 true JP6422395B2 (ja) 2018-11-14

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ID=57581496

Family Applications (1)

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JP2015101404A Active JP6422395B2 (ja) 2015-05-18 2015-05-18 回路基板

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JP (1) JP6422395B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109565927A (zh) * 2017-03-24 2019-04-02 三菱电机株式会社 电路基板
JP6479288B1 (ja) 2017-06-09 2019-03-06 三菱電機株式会社 プリント基板
JP6999447B2 (ja) * 2018-02-27 2022-01-18 Hoya株式会社 内視鏡システム、及びプロセッサ
JP6867036B2 (ja) * 2018-03-26 2021-04-28 Ｎｅｃプラットフォームズ株式会社 無線通信装置およびノイズ抑制方法
JP7058563B2 (ja) * 2018-06-14 2022-04-22 三菱電機株式会社 回路基板ユニット
CN113711160B (zh) * 2019-04-23 2022-10-21 三菱电机株式会社 电子设备
JP7547036B2 (ja) * 2019-08-09 2024-09-09 キヤノン株式会社 プリント基板
JP6843312B1 (ja) * 2020-03-25 2021-03-17 三菱電機株式会社 回路基板及び電子機器
US12057414B2 (en) 2021-04-06 2024-08-06 Mitsubishi Electric Corporation Printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5063529B2 (ja) * 2008-08-22 2012-10-31 キヤノン株式会社 プリント回路板
JP5868285B2 (ja) * 2012-08-09 2016-02-24 三菱電機株式会社 プリント基板
JP5740427B2 (ja) * 2013-03-29 2015-06-24 本田技研工業株式会社 回路基板を備える制御装置
JP6076174B2 (ja) * 2013-03-29 2017-02-08 本田技研工業株式会社 雑音耐性の高い制御装置

Also Published As

Publication number Publication date
JP2016219553A (ja) 2016-12-22

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