JP2008153542A5 - - Google Patents

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Publication number
JP2008153542A5
JP2008153542A5 JP2006341778A JP2006341778A JP2008153542A5 JP 2008153542 A5 JP2008153542 A5 JP 2008153542A5 JP 2006341778 A JP2006341778 A JP 2006341778A JP 2006341778 A JP2006341778 A JP 2006341778A JP 2008153542 A5 JP2008153542 A5 JP 2008153542A5
Authority
JP
Japan
Prior art keywords
wiring
ground
signal
pad
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006341778A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008153542A (ja
JP4916300B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006341778A priority Critical patent/JP4916300B2/ja
Priority claimed from JP2006341778A external-priority patent/JP4916300B2/ja
Priority to KR1020070129551A priority patent/KR20080057153A/ko
Priority to US12/000,730 priority patent/US8076588B2/en
Priority to TW096148386A priority patent/TWI423753B/zh
Publication of JP2008153542A publication Critical patent/JP2008153542A/ja
Publication of JP2008153542A5 publication Critical patent/JP2008153542A5/ja
Application granted granted Critical
Publication of JP4916300B2 publication Critical patent/JP4916300B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006341778A 2006-12-19 2006-12-19 多層配線基板 Active JP4916300B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006341778A JP4916300B2 (ja) 2006-12-19 2006-12-19 多層配線基板
KR1020070129551A KR20080057153A (ko) 2006-12-19 2007-12-13 다층 배선 기판
US12/000,730 US8076588B2 (en) 2006-12-19 2007-12-17 Multilayer wiring board
TW096148386A TWI423753B (zh) 2006-12-19 2007-12-18 多層佈線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006341778A JP4916300B2 (ja) 2006-12-19 2006-12-19 多層配線基板

Publications (3)

Publication Number Publication Date
JP2008153542A JP2008153542A (ja) 2008-07-03
JP2008153542A5 true JP2008153542A5 (enExample) 2009-11-19
JP4916300B2 JP4916300B2 (ja) 2012-04-11

Family

ID=39640156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006341778A Active JP4916300B2 (ja) 2006-12-19 2006-12-19 多層配線基板

Country Status (4)

Country Link
US (1) US8076588B2 (enExample)
JP (1) JP4916300B2 (enExample)
KR (1) KR20080057153A (enExample)
TW (1) TWI423753B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4586820B2 (ja) 2007-05-07 2010-11-24 ソニー株式会社 巻回型非水電解質二次電池
US8350375B2 (en) * 2008-05-15 2013-01-08 Lsi Logic Corporation Flipchip bump patterns for efficient I-mesh power distribution schemes
JP5311653B2 (ja) * 2009-04-28 2013-10-09 京セラＳｌｃテクノロジー株式会社 配線基板
US9099340B2 (en) 2011-10-07 2015-08-04 Volterra Semiconductor Corporation Power management applications of interconnect substrates
US20140034376A1 (en) * 2012-08-01 2014-02-06 Samtec, Inc. Multi-layer transmission lines
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
JP6429647B2 (ja) 2015-01-26 2018-11-28 ルネサスエレクトロニクス株式会社 半導体装置
JP6853774B2 (ja) * 2017-12-21 2021-03-31 ルネサスエレクトロニクス株式会社 半導体装置
JP7145068B2 (ja) * 2018-12-28 2022-09-30 新光電気工業株式会社 配線基板及びその製造方法
US11234325B2 (en) * 2019-06-20 2022-01-25 Infinera Corporation Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures
US11950357B2 (en) * 2019-11-27 2024-04-02 Qing Ding Precision Electronics (Huaian) Co., Ltd Circuit board for transmitting high-frequency signal and method for manufacturing the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023631Y2 (enExample) * 1984-12-28 1990-01-29
JPS63136694A (ja) * 1986-11-28 1988-06-08 日本電気株式会社 多層配線基板
JP3617073B2 (ja) 1994-03-25 2005-02-02 イビデン株式会社 電子部品搭載用基板及びその製造方法
JPH1041637A (ja) * 1996-07-23 1998-02-13 Nec Corp 高密度多層配線基板
JP3201345B2 (ja) * 1998-05-13 2001-08-20 日本電気株式会社 多層プリント配線板
JP3669219B2 (ja) * 1999-08-10 2005-07-06 日本電気株式会社 多層プリント配線板
JP3539331B2 (ja) * 2000-02-28 2004-07-07 日本電気株式会社 多層プリント配線板
JP3792472B2 (ja) 2000-03-28 2006-07-05 京セラ株式会社 多層配線基板
JP2002093940A (ja) 2000-09-14 2002-03-29 Kyocera Corp 多層配線基板
JP3745276B2 (ja) * 2001-01-17 2006-02-15 キヤノン株式会社 多層プリント配線板
US6900992B2 (en) * 2001-09-18 2005-05-31 Intel Corporation Printed circuit board routing and power delivery for high frequency integrated circuits
JP2004140295A (ja) 2002-10-21 2004-05-13 Shinko Electric Ind Co Ltd 高周波素子用基板及び電子装置
JP4371766B2 (ja) * 2003-10-20 2009-11-25 Ｎｅｃインフロンティア株式会社 プリント配線板
US7478472B2 (en) * 2004-03-03 2009-01-20 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate with signal wire shielding

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