JP2010177501A - 光学素子パッケージおよび光学素子パッケージの製造方法 - Google Patents
光学素子パッケージおよび光学素子パッケージの製造方法 Download PDFInfo
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/484—Connecting portions
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- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
【解決手段】チップ状の光学素子13と、この光学素子13における光学的機能面を覆う凸レンズ面Sを有しするレンズ樹脂19とを備えた光学素子パッケージである。そして特にレンズ樹脂19における凸レンズ面Sが、各凸レンズ面部分に接する平面に対して垂直な方向を頂点とする複数の微小凸曲面S1を有する粗面として構成されている。このような凸レンズ面Sは、放電加工によって成形されたレンズ形成面を有する母型を用いた樹脂成形によって形成され、複数の微小凸曲面は、それぞれが異なる高さまたは大きさを有する形状に形成されている。
【選択図】図1
Description
1.光学素子パッケージの構成
2.光学素子パッケージの製造方法
3.レンズ成形用母型の形成方法
図1は、本発明を適用した実施形態の光学素子パッケージ1の概略断面図である。この図に示す光学素子パッケージ1は、チップ状の発光素子を実装基板上に実装するためのパッケージであり、次のように構成されている。
図4〜図7は本発明の光学素子パッケージの製造方法を示す製造工程図である。以下、これらの図面にしたがって光学素子パッケージの製造方法の実施形態を説明する。
図8には、以上の製造工程においてレンズ樹脂の成形に用いる母型の作製方法を示す。
Claims (11)
- チップ状の光学素子と、
前記光学素子における光学的機能面を覆う凸レンズ面を有し、当該凸レンズ面が各凸レンズ面部分に接する平面に対して垂直な方向を頂点とする複数の微小凸曲面を有する粗面として構成されているレンズ樹脂とを備えた
光学素子パッケージ。 - 前記複数の微小凸曲面は、各凸レンズ面S部分に接する平面に対して垂直な方向を軸にして対称である
請求項1に記載の光学素子パッケージ。 - 前記複数の微小凸曲面は、それぞれが異なる高さまたは大きさを有する形状に形成されている
請求項1または2記載の光学素子パッケージ。 - 前記複数の微小凸曲面は、その底面の径よりも、小さい高さである
請求項1〜3の何れかに記載の光学素子パッケージ。 - 前記光学素子を実装してなるリード電極と、
前記光学素子が実装された前記リード電極部分を底部とした凹部を有する形状で前記リード電極および前記レンズ樹脂に一体形成されたパッケージ樹脂とを備えた
請求項1〜4の何れかに記載の光学素子パッケージ。 - チップ状の光学素子における光学的機能面を覆うレンズ樹脂を形成する際、
凹状のレンズ成形面を有し、当該レンズ成形面が各レンズ成形面部分に接する平面に対して垂直な方向に凹となる複数の微小凹曲面を有する粗面として構成された母型を用いて樹脂成形を行なう
光学素子パッケージの製造方法。 - 前記複数の微小凹曲面は、各レンズ成型面部分に接する平面に対して垂直な方向を軸にして対称に形成されている
請求項6に記載の光学素子パッケージの製造方法。 - 前記複数の微小凹曲面は、それぞれが異なる深さまたは大きさを有する形状で形成されている
請求項6または7記載の光学素子パッケージの製造方法。 - 前記複数の微小凹曲面は、その底面の径よりも、小さい深さに形成されている
請求項6〜8の何れかに記載の光学素子パッケージの製造方法。 - 前記母型は、凸状のレンズ形状に成型された放電曲面を有する放電電極を用いた放電加工によって形成されたものである
請求項6〜9の何れかに記載の光学素子パッケージの製造方法。 - 前記レンズ樹脂を形成する際には、前記母型を用いて構成されたキャビティ内に前記光学素子を収容した状態で未硬化の樹脂を充填注入する
請求項6〜10の何れかに記載の光学素子パッケージの製造方法。
Priority Applications (5)
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JP2009019320A JP5428358B2 (ja) | 2009-01-30 | 2009-01-30 | 光学素子パッケージの製造方法 |
US12/693,188 US8158997B2 (en) | 2009-01-30 | 2010-01-25 | Optical element package and method of manufacturing the same |
CN201010110610.9A CN101794856B (zh) | 2009-01-30 | 2010-01-29 | 光学元件封装件及其制造方法 |
CN201510296704.2A CN104916767A (zh) | 2009-01-30 | 2010-01-29 | 光学元件封装件 |
US13/426,244 US8962355B2 (en) | 2009-01-30 | 2012-03-21 | Optical element package and method of manufacturing the same |
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JP2009019320A JP5428358B2 (ja) | 2009-01-30 | 2009-01-30 | 光学素子パッケージの製造方法 |
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JP5428358B2 JP5428358B2 (ja) | 2014-02-26 |
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JP2016105518A (ja) * | 2016-03-03 | 2016-06-09 | 大日本印刷株式会社 | 樹脂付リードフレーム、多面付ledパッケージ、樹脂付リードフレームの製造方法およびledパッケージの製造方法 |
JP2018101147A (ja) * | 2018-02-07 | 2018-06-28 | 株式会社nittoh | 光学部材 |
WO2023182101A1 (ja) * | 2022-03-25 | 2023-09-28 | ソニーグループ株式会社 | 半導体発光装置 |
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JP5010693B2 (ja) * | 2010-01-29 | 2012-08-29 | 株式会社東芝 | Ledパッケージ |
TW201219840A (en) * | 2010-11-03 | 2012-05-16 | Foxsemicon Integrated Tech Inc | Lens and light source module |
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CN102306698A (zh) * | 2011-09-30 | 2012-01-04 | 深圳市灏天光电有限公司 | 一种新型led封装结构 |
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US20070257610A1 (en) * | 2006-05-02 | 2007-11-08 | Ming-Hsien Shen | Light emitting diode |
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CN1978982A (zh) * | 2005-12-01 | 2007-06-13 | 陈钜泯 | 发光装置 |
TWM328670U (en) * | 2007-07-10 | 2008-03-11 | Everlight Electronics Co Ltd | LED lamp lens |
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- 2010-01-29 CN CN201010110610.9A patent/CN101794856B/zh not_active Expired - Fee Related
- 2010-01-29 CN CN201510296704.2A patent/CN104916767A/zh active Pending
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JP2007288198A (ja) * | 2006-04-17 | 2007-11-01 | Samsung Electro-Mechanics Co Ltd | 発光ダイオードパッケージ及びその製造方法 |
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US9773960B2 (en) | 2010-11-02 | 2017-09-26 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
US8933548B2 (en) | 2010-11-02 | 2015-01-13 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
US9159655B2 (en) | 2010-11-02 | 2015-10-13 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
US9214414B2 (en) | 2010-11-02 | 2015-12-15 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
JP5896302B2 (ja) * | 2010-11-02 | 2016-03-30 | 大日本印刷株式会社 | Led素子搭載用リードフレーム、樹脂付リードフレーム、半導体装置の製造方法、および半導体素子搭載用リードフレーム |
US9362473B2 (en) | 2010-11-02 | 2016-06-07 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
US9412923B2 (en) | 2010-11-02 | 2016-08-09 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
US9553247B2 (en) | 2010-11-02 | 2017-01-24 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
WO2012060336A1 (ja) * | 2010-11-02 | 2012-05-10 | 大日本印刷株式会社 | Led素子搭載用リードフレーム、樹脂付リードフレーム、半導体装置の製造方法、および半導体素子搭載用リードフレーム |
US9899583B2 (en) | 2010-11-02 | 2018-02-20 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
JP2016105518A (ja) * | 2016-03-03 | 2016-06-09 | 大日本印刷株式会社 | 樹脂付リードフレーム、多面付ledパッケージ、樹脂付リードフレームの製造方法およびledパッケージの製造方法 |
JP2018101147A (ja) * | 2018-02-07 | 2018-06-28 | 株式会社nittoh | 光学部材 |
WO2023182101A1 (ja) * | 2022-03-25 | 2023-09-28 | ソニーグループ株式会社 | 半導体発光装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5428358B2 (ja) | 2014-02-26 |
US20100193821A1 (en) | 2010-08-05 |
CN101794856B (zh) | 2016-02-17 |
CN101794856A (zh) | 2010-08-04 |
US8158997B2 (en) | 2012-04-17 |
CN104916767A (zh) | 2015-09-16 |
US8962355B2 (en) | 2015-02-24 |
US20120175793A1 (en) | 2012-07-12 |
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