JP2010046831A - 樹脂と金属との接合方法および装置 - Google Patents
樹脂と金属との接合方法および装置 Download PDFInfo
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- JP2010046831A JP2010046831A JP2008211081A JP2008211081A JP2010046831A JP 2010046831 A JP2010046831 A JP 2010046831A JP 2008211081 A JP2008211081 A JP 2008211081A JP 2008211081 A JP2008211081 A JP 2008211081A JP 2010046831 A JP2010046831 A JP 2010046831A
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- Prior art keywords
- resin
- metal
- bonding
- joining
- resin member
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- Granted
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Images
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
【解決手段】樹脂部材4と金属部材3とを加熱により接合する接合方法であって、前記樹脂部材4と金属部材3との接合界面を、樹脂部材4の分解温度tb以上かつ樹脂部材4に気泡が発生する温度tc未満の範囲の温度に加熱するとともに、樹脂部材4の金属部材3との接合面5とは反対側の面を、樹脂部材4の融点ta未満の温度に冷却することにより、樹脂部材4と金属部材3との接合を行う。
【選択図】 図2
Description
また、表面処理後の金属部材は洗浄・乾燥する必要があるが、この洗浄・乾燥に長時間を要するため、自動車用途等に用いられる部品のように高生産性が必要とされる部品に適用するのには不適である。
さらに、金属部材と樹脂部材との接合が金属部材に熱可塑性樹脂をインサート成形することにより行われるため、接合体の形状に制約が生じるという問題がある。
一方、樹脂部材は、オーブン内の加熱雰囲気やヒータ等により加熱されるが、加熱温度が高くなり過ぎると樹脂内部に気泡が発生して、接合後に樹脂部材にクラックが生じる原因となってしまう。
さらに、樹脂部材を全体的に加熱すると、樹脂部材が全体的に溶融してしまい、樹脂部材の外表面の意匠性が損なわれてしまうため、樹脂部材と金属部材との接合体の用途が限られてしまうといった問題もある。
即ち、請求項1記載の如く、樹脂と金属とを加熱により接合する接合方法であって、前記樹脂と金属との接合界面を、樹脂の分解温度以上かつ樹脂に気泡が発生する温度未満の範囲の温度に加熱することにより、前記樹脂と金属との接合を行う。
これにより、表面処理剤を用いることなく、必要十分な接合強度を短時間で得ることができ、樹脂と金属との接合工程における環境負荷を低減することが可能となる。
また、樹脂と金属との接合後に、樹脂と金属との接合界面に気泡を起点とするクラックが発生することを防止することができ、樹脂と金属との接合強度を確保することが可能となる。
これにより、表面処理剤を用いることなく、必要十分な接合強度を短時間で得ることができ、樹脂と金属との接合工程における環境負荷を低減することが可能となる。
また、樹脂と金属との接合時における樹脂の熱変形を防止しつつ、樹脂と金属との接合を行うことができるので、樹脂と金属との接合体における樹脂側の外面の意匠性を低下させることがなく、前記接合体の製品価値を向上することができる。
これにより、表面処理剤を用いることなく、必要十分な接合強度を短時間で得ることができ、樹脂と金属との接合工程における環境負荷を低減することが可能となる。
また、樹脂と金属との接合後に、樹脂と金属との接合界面に気泡を起点とするクラックが発生することを防止することができ、樹脂と金属との接合強度を確保することが可能となる。
これにより、金属が、熱伝導率が高く電気抵抗が小さな材料で構成されている場合でも、金属と樹脂との接合範囲への入熱効率を高めることができ、金属と樹脂との接合界面を簡単な工程かつ短時間で適切に加熱して接合することができ、十分な接合強度を得ることが可能となる。
これにより、金属がレーザー光の反射率が高い部材であっても、金属と樹脂との接合範囲への入熱効率を高めることができ金属と樹脂との接合界面を簡単な工程かつ短時間で適切に加熱して接合することができ、十分な接合強度を得ることが可能となる。
これにより、金属と樹脂との接合時に、軟化した樹脂が前記凹部の内部に侵入して、アンカー効果が生じるため、接合後の金属と樹脂との接合強度を向上させることが可能となる。
これにより、表面処理剤を用いることなく、必要十分な接合強度を短時間で得ることができ、樹脂と金属との接合工程における環境負荷を低減することが可能となる。
また、樹脂と金属との接合時における樹脂の熱変形を防止しつつ、樹脂と金属との接合を行うことができるので、樹脂と金属との接合体における樹脂側の外面の意匠性を低下させることがなく、前記接合体の製品価値を向上することができる。
これにより、表面処理剤を用いることなく、必要十分な接合強度を短時間で得ることができ、樹脂と金属との接合工程における環境負荷を低減することが可能となる。
また、樹脂と金属との接合後に、樹脂と金属との接合界面に気泡を起点とするクラックが発生することを防止することができ、樹脂と金属との接合強度を確保することが可能となる。
また、前記加熱体1による加熱は、樹脂部材4の金属部材3との接合面5が、樹脂部材4の分解温度以上かつ樹脂部材4に気泡が発生する温度未満の範囲の温度となるように行う。
そして、樹脂部材4と金属部材3との接合を行う際には、樹脂部材4と金属部材3との接合界面、より厳密には樹脂部材4の前記接合面5を、樹脂部材4の分解温度以上かつ樹脂部材4に気泡が発生する温度未満の範囲(図2においてハッチングにて示した部分に含まれる範囲)の温度に所定の時間ΔTだけ保持することにより、両者の接合が行われる。
これに対し、前述のごとく樹脂部材4の接合面5を樹脂部材4の分解温度以上に加熱すると、前記接合面5における樹脂部材4が分解して該接合面5に溶着活性基が創生される。
樹脂部材4の接合面5に創生される溶着活性基は、金属部材3の樹脂部材4との接合面との間で分子間力による結合を行うものであり、樹脂部材4と金属部材3との接合界面において前記アンカー効果による接合に加えて、この溶着活性基の分子間力による接合が行われることにより、大きな接合強度を得ることが可能となっている。
また、樹脂部材4の接合面5の加熱温度は、樹脂部材4に気泡が発生する温度未満であるので、加熱により樹脂部材4の接合面5に気泡が発生することがなく、樹脂部材4と金属部材3との接合後に、樹脂部材4と金属部材3との接合界面に気泡を起点とするクラックが発生することを防止することができ、樹脂部材4と金属部材3との接合強度を確保することが可能となる。
このように、樹脂部材4と金属部材3との接合時における樹脂部材4の熱変形を防止することができるので、樹脂部材4と金属部材3との接合体の樹脂部材4側の外面の意匠性を低下させることがなく、前記接合体の製品価値を向上させることができる。
さらに、樹脂部材4は、機械的強度等を向上するための炭素繊維、ガラス繊維、タルク、マイカ、カオリン、および炭酸カルシウム等のフィラーを、前述の素材に混入させて構成することもできる。
このように乾式表面処理を施した後に樹脂部材4と金属部材3との接合を行うことで、環境負荷が少ない表面処理方法にて前記接合面5に溶着活性基を導入することができ、接合強度の向上を図ることができる。
このように金属部材3の樹脂部材4との接合面に粗さや凹凸を付与することで、加熱された樹脂部材4が金属部材3の接合面に入り込んでアンカー効果を発揮することが可能となる。
さらに加熱体1としては、例えば通電抵抗、高周波、赤外線、およびレーザー等を用いて前記接合面5を加熱するものや、振動または超音波等による摩擦熱を用いて前記接合面5を加熱するものに構成することができるが、これらのものに限定するものではなく、他の加熱手段を用いることもできる。
そして、前記加熱体1を金属部材3に押し付けるとともに冷却体2を樹脂部材4に押し付けて、重ね合わせた状態の金属部材3および樹脂部材4をプレスすることにより、加熱体1からの熱で樹脂部材4の接合面5が溶融し、さらに分解することで、金属部材3と樹脂部材4とが接合される。
この場合、樹脂部材4の冷却体2が当接している側の面は、該冷却体2により冷却されているので、熱変形することがない。
このように、加熱体1および冷却体2をスポット溶接機のガンと同様の形状に形成することで、金属部材3と樹脂部材4とを接合する工程に、従来から使用しているスポット溶接機のラインやシステムを流用することができる。
ローラー部材にて構成された加熱体1と冷却体2とは、重ね合わした状態の金属部材3と樹脂部材4との厚み寸法、またはその厚み寸法より若干小さい寸法だけ間隔を隔てて対向配置されている。
この場合、樹脂部材4の冷却体2が当接している側の面は、該冷却体2により冷却されているので、熱変形することがない。
金属部材3と樹脂部材4との接合を行う際には、ローラー状の加熱体1と冷却体2との間に送り込まれた金属部材3および樹脂部材4を、該加熱体1と冷却体2とを回転させて順次送り出すことで、金属部材3と樹脂部材4との接合をシーム溶接のように連続的に行うことが可能となる。
つまり、図5〜図7に示すように、金属部材3における、金属部材3と樹脂部材4との接合範囲6の周囲にスリット(空洞)3aを形成することができる。
スリット3aは、金属部材3の樹脂部材4に対する接合方向に貫通しており、前記接合範囲6の周囲の複数箇所に形成されている。
従って、加熱体1から金属部材3を通じて該金属部材3と樹脂部材4との接合界面に供給される熱が接合範囲6の平面方向外側へ拡散することを防止でき(図6参照)、前記接合範囲6を効率的に加熱することができる。
また、スリット3aの外側には熱が伝達されずに金属部材3と樹脂部材4との接合が行われないので、前記接合範囲6を精度良く制御することができる。
このように、樹脂部材4が金属部材3のスリット3a内に入り込んだ部分ではアンカー効果が生じるため、接合後の金属部材3と樹脂部材4との接合強度を向上させることが可能となる。
すなわち、前記接合範囲6へ伝達される熱の平面方向への拡散を抑える程度に応じて、スリット3aにより覆う範囲を適宜決定することができる。
また、金属部材3に形成されるスリット3aは、刃具による切削やパンチングなどの加工により形成する他、レーザーや電子ビームによる加工などにて形成することができる。
溝3bは、金属部材3の樹脂部材4との接合面とは反対側の面から、前記接合界面側へ向けて形成されている。つまり、溝3bにおいては、金属部材3の樹脂部材4との接合面とは反対側の面に開口しており、金属部材3の樹脂部材4との接合界面側は閉じて底部を有している。
このように、接合範囲6へ伝達される熱の平面方向への拡散を抑える構成として、溝3bを形成した場合、溝3bにおける金属部材3と樹脂部材4との接合界面側には底部が形成されていて、溝3bが金属部材3を前述のスリット3aのように貫通していないので、金属部材3にスリット3aを形成した場合に比べて金属部材3の剛性を高くすることができる。
溝3cは金属部材3の樹脂部材4との接合面に開口し、金属部材3の樹脂部材4との接合方向における途中部に底部を有している。
溝3dは前記接合界面とは反対側の面に開口し、金属部材3の樹脂部材4との接合方向における途中部に底部を有している。
本例の場合、溝3cと溝3dとは、金属部材3と樹脂部材4との接合方向において略同じ位置に配置されており、前記溝3cの底部と溝3dの底部とは共通している。
このように、接合範囲6へ伝達される熱の平面方向への拡散を抑える構成として、溝3c・3dを形成した場合、金属部材3内の溝3cと溝3dとの間に各溝3c・3dの底部が形成されていて、溝3c・3dが金属部材3を前述のスリット3aのように貫通していないので、金属部材3にスリット3aを形成した場合に比べて金属部材3の剛性を高くすることができる。
溝3eは、金属部材3の樹脂部材4との接合面から、該接合面とは反対側の面へ向けて形成されている。つまり、溝3eは、金属部材3の樹脂部材4との接合面に開口しており、金属部材3の樹脂部材4との接合面とは反対側の面は閉じて底部を有している。
このように、接合範囲6へ伝達される熱の平面方向への拡散を抑える構成として、溝3eを形成した場合、金属部材3の樹脂部材4との接合面とは反対側の面には溝3eの底部が形成されていて、溝3eが金属部材3を前述のスリット3aのように貫通していないので、金属部材3にスリット3aを形成した場合に比べて金属部材3の剛性を高くすることができる。
また、図12、図13に示した溝3eを金属部材3に形成する構成は、後述する高周波加熱装置11やレーザー照射装置12を用いて金属部材3と樹脂部材4との接合界面を樹脂部材4側から加熱するように構成した場合に特に適している。
さらに、図5〜図7に示したスリット3a、および図11に示した溝3c・3dを金属部材3に形成する構成は、金属部材3側から加熱を行うように構成した場合、および樹脂部材4側から加熱するように構成した場合の両方に適している。
高周波加熱装置11を用いて前記接合界面を加熱する場合、金属部材3の樹脂部材4との間に薄膜8を介装し、前記高周波加熱装置11を樹脂部材4の接合面5側とは反対の面側に配置する。
また、薄膜8は、例えば金属部材3の樹脂部材4との接合面に前記金属材料をメッキ、溶射、またはコールドスプレー等の種々の方法を施すことにより薄膜として付与することができる。
そして、薄膜8が付与された金属部材3と樹脂部材4とを重ね合わせたうえで、前記高周波加熱装置11にて、金属部材3の樹脂部材4との接合界面に介装されている薄膜8を高周波加熱することにより、金属部材3の樹脂部材4との接合を行う。
また、加熱体1を高周波加熱装置11にて構成し、該高周波加熱装置11の加熱コイルを接合範囲6の大きさに応じた大きさに形成することで、金属部材3と樹脂部材4との接合界面に対する入熱範囲を制御することができる。
これにより、金属部材3と樹脂部材4との接合界面を簡単な工程かつ短時間で適切に加熱して接合することができ、十分な接合強度を得ることが可能となる。
なお、本例では金属部材3の樹脂部材4との接合界面を加熱する加熱具として高周波加熱装置11のみを用いているが、該高周波加熱装置11と前記加熱体1および/または冷却体2とを併用することも可能である。
レーザー照射装置12からレーザー光を前記接合界面に照射して加熱を行う場合、金属部材3と樹脂部材4との間に薄膜9を介装し、前記レーザー照射装置12を樹脂部材4の接合面5側とは反対の面側に配置する。
また、薄膜9は、例えば金属部材3の樹脂部材4との接合面に前記金属材料をメッキ、溶射、またはコールドスプレー等の種々の方法を施すことにより薄膜として付与することができる。
なお、前記レーザー照射装置12は、YAGレーザーや、半導体レーザーや、CO2レーザー等の赤外レーザー光を照射する装置に構成することが望ましい。
また、加熱体1をレーザー照射装置12にて構成し、該レーザー照射装置12からのレーザー光の照射範囲を接合範囲6の大きさに応じた大きさに形成することで、金属部材3と樹脂部材4との接合界面に対する入熱範囲を制御することができる。
これにより、金属部材3と樹脂部材4との接合界面を簡単な工程かつ短時間で適切に加熱して接合することができ、十分な接合強度を得ることが可能となる。
なお、本例では金属部材3の樹脂部材4との接合界面を加熱する加熱具としてレーザー照射装置12のみを用いているが、該レーザー照射装置12と前記加熱体1および/または冷却体2とを併用することも可能である。
2 冷却体
3 金属部材
3a スリット
3b・3c・3d・3e 溝
4 樹脂部材
5 (樹脂部材の)接合面
6 接合範囲
8・9 薄膜
11 高周波加熱装置
12 レーザー照射装置
Claims (8)
- 樹脂と金属とを加熱により接合する接合方法であって、
前記樹脂と金属との接合界面を、樹脂の分解温度以上かつ樹脂に気泡が発生する温度未満の範囲の温度に加熱することにより、前記樹脂と金属との接合を行う、
ことを特徴とする樹脂と金属との接合方法。 - 樹脂と金属とを加熱により接合する接合方法であって、
前記樹脂と金属との接合界面を、前記金属の樹脂との接合面とは反対側の面から加熱するとともに、
前記樹脂の金属との接合面とは反対側の面を、樹脂の融点未満の温度に冷却することにより、
前記樹脂と金属との接合を行う、
ことを特徴とする樹脂と金属との接合方法。 - 前記樹脂と金属との接合界面の加熱温度は、
前記樹脂の分解温度以上かつ樹脂に気泡が発生する温度未満の範囲の温度である、
ことを特徴とする請求項2に記載の樹脂と金属との接合方法。 - 樹脂と金属との接合界面に、前記金属よりも高い電気抵抗を有する薄膜を介装し、
前記薄膜を、前記樹脂の金属との接合面側とは反対の面側から高周波加熱することにより、
前記樹脂と金属との接合を行う、
ことを特徴とする請求項1〜3の何れか一項に記載の樹脂と金属との接合方法。 - 樹脂と金属との接合界面に、前記金属よりも低いレーザー反射率を有する薄膜を介装し、
前記樹脂をレーザー光が透過可能な素材にて構成し、
前記樹脂の金属との接合面側とは反対の面側から前記薄膜へ向けてレーザー光を照射して、前記薄膜を加熱することにより、
前記樹脂と金属との接合を行う、
ことを特徴とする請求項1〜3の何れか一項に記載の樹脂と金属との接合方法。 - 前記金属と樹脂との接合界面における、前記樹脂と金属との接合範囲の周辺箇所に、加熱された樹脂が侵入可能な凹部を形成した、
ことを特徴とする請求項1〜請求項5の何れか一項に記載の樹脂と金属との接合方法。 - 樹脂と金属とを加熱により接合する際に用いる接合装置であって、
前記樹脂と金属との接合界面を、前記金属の樹脂との接合面とは反対側の面から加熱する加熱具と、
前記樹脂の金属との接合面とは反対側の面を、樹脂の融点未満の温度に冷却する冷却具とを備える、
ことを特徴とする樹脂と金属との接合装置。 - 前記加熱具は、前記樹脂と金属との接合界面を、
前記樹脂の分解温度以上かつ樹脂に気泡が発生する温度未満の範囲の温度に加熱する、
ことを特徴とする請求項7に記載の樹脂と金属との接合装置。
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CN200980132574.1A CN102131632B (zh) | 2008-08-19 | 2009-08-04 | 用于使树脂和金属接合的方法和装置 |
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Also Published As
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KR20110040928A (ko) | 2011-04-20 |
JP4626687B2 (ja) | 2011-02-09 |
US9789672B2 (en) | 2017-10-17 |
US20150210051A1 (en) | 2015-07-30 |
CN102131632A (zh) | 2011-07-20 |
EP2334485A1 (en) | 2011-06-22 |
WO2010020850A1 (en) | 2010-02-25 |
US20110139353A1 (en) | 2011-06-16 |
KR101311965B1 (ko) | 2013-09-26 |
EP2334485B1 (en) | 2019-01-16 |
US9005388B2 (en) | 2015-04-14 |
CN102131632B (zh) | 2014-07-16 |
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