JP2008162288A - レーザを用いた部材の接合方法 - Google Patents
レーザを用いた部材の接合方法 Download PDFInfo
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- JP2008162288A JP2008162288A JP2008016255A JP2008016255A JP2008162288A JP 2008162288 A JP2008162288 A JP 2008162288A JP 2008016255 A JP2008016255 A JP 2008016255A JP 2008016255 A JP2008016255 A JP 2008016255A JP 2008162288 A JP2008162288 A JP 2008162288A
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- 239000004065 semiconductor Substances 0.000 claims abstract description 54
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 11
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- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
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- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract
【解決手段】 互いに重ね合わされた第1部材11が半導体レーザ光を透過するアクリル材料で形成され、第2部材12がスズ製である。第2部材12の境界面がサンドペーパで荒された溝本数密度で0.03[/μm]以上である凹凸状の境界面12aにされ、境界面12aでのレーザ光吸収率が17%以上にされている。第1及び第2部材11,12の境界に半導体レーザ光を照射することにより、第2部材の境界面12aにおいて半導体レーザ光が吸収され、境界面12a付近のアクリル材料を局所的に溶融あるいは軟化させる。溶融あるいは軟化したアクリル樹脂が境界面12aに接着して凹凸に食い込むことによるアンカー効果によって、両部材間に強固な接合が形成される。
【選択図】 図1
Description
長谷川達也,他,「レーザによる熱可塑性プラスチックのラップ接合」,日本機械学会論文集(C編),日本機械学会発行,2001年9月,第67巻,第611号,pp.2997−3001 船山 強,他,「YAGレーザによるガラス基板のマイクロ接合法(第1報)−レーザ透過性を利用したガラス界面の接合法の提案とその可能性検証−」,精密工学会誌,精密工学会発行,2002年9月,第68巻,第9号,pp.1231−1235
実施例2においては、レーザとして半導体レーザに代えて、YAG(イットリウム・アルミニウム・ガーネット)レーザを用いて板材間の接合を行ったものである。照射するYAGレーザの条件としては、波長1060nm、出力10〜150W、連続発振、ビームモードTEM00(ガウス分布)であり、照射点スポット径10,20mmであり、レーザの走査は行われていない。第1板材と第2板材の組み合わせについては、表1に示すように、樹脂と金属の組合せがNo.1:透明アクリル−スズ(SB)、No.2:透明アクリル−アルミ(SB)の2種類であり、樹脂同士の組合せがNo.3:ポリカーボネート−黒色アクリル(SB)、No.4:アセタール樹脂−黒色アクリル(SB)、の2種類である。なお、表1において、SBはサンドブラスト処理を境界面に施したことを表す。
実施例3においては、金属とガラスあるいはフッ化樹脂、ガラス同士のような、境界面を凹凸状態にするのみではレーザによる接合が困難な板状の第1部材と第2部材に対して、両者の境界面にフェノール、エポキシ、ポリエステル等の熱硬化性樹脂製の接着剤を塗布した接合層を設けるようにしたものである。これにより、境界面で吸収された半導体レーザ光又はYAGレーザ光によって接合層を硬化させることにより、凹凸状態にされた境界面の状態と合わせて、接合形成の困難な材料同士である第1及び第2部材との間の接合を形成することができる。なお、照射するレーザとしては、半導体レーザでもYAGレーザでも照射条件の調整により接合の形成が可能である。
Claims (6)
- 互いに重ね合わされた一方が半導体レーザ光又はYAGレーザ光を透過する材質で形成された第1部材及び第2部材の境界面に半導体レーザ光又はYAGレーザ光を照射することにより該第1及び第2部材間を接合させる接合方法であって、
前記半導体レーザ光又はYAGレーザ光の照射前に、前記第1及び第2部材の少なくとも一方の境界面が、該半導体レーザ光又はYAGレーザ光を吸収可能なように凹凸状態にされており、凹凸状態が溝本数密度で0.03[/μm]以上であると共に、境界面におけるレーザ光吸収率が17%以上であり、該半導体レーザ光又はYAGレーザ光の吸収によって前記第1部材及び/又は第2部材を溶融あるいは軟化させることにより、該第1及び第2部材間を接合させることを特徴とするレーザを用いた部材の接合方法。 - 前記第1及び第2部材が共に樹脂材料製であることを特徴とする請求項1に記載のレーザを用いた部材の接合方法。
- 前記第1及び第2部材の境界面に、部分的に接合を形成することを特徴とする請求項1又は2に記載のレーザを用いた部材の接合方法。
- 前記境界面の凹凸状態が、前記樹脂材料による部材成形時に、成形型の型面に設けた凹凸により一体で形成されたことを特徴とする請求項1から3のいずれか1項に記載のレーザを用いた部材の接合方法。
- 前記第1及び第2部材のいずれか一方の部材が半導体レーザ光又はYAGレーザ光を透過する樹脂材料製であり、他方の部材が金属製又はセラミック製又はガラス製であり、該他方の部材の境界面が凹凸状態にされていることを特徴とする請求項1に記載のレーザを用いた部材の接合方法。
- 半導体レーザ光又はYAGレーザ光を透過する樹脂製又はガラス製の第1部材と、該第1部材に重ね合わされた樹脂製又は金属製又はセラミック製又はガラス製の第2部材との間に樹脂製の接合層が挟まれており、さらに前記半導体レーザ光又はYAGレーザ光の照射前に、前記第1及び第2部材の少なくとも一方の境界面が、該半導体レーザ光又はYAGレーザ光を吸収可能なように凹凸状態にされており、該半導体レーザ光又はYAGレーザ光の吸収によって少なくとも前記接合層を溶融、軟化あるいは硬化させることにより、該第1及び第2部材間を接合させることを特徴とするレーザを用いた部材の接合方法。
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