JP2009539325A5 - - Google Patents

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Publication number
JP2009539325A5
JP2009539325A5 JP2009513308A JP2009513308A JP2009539325A5 JP 2009539325 A5 JP2009539325 A5 JP 2009539325A5 JP 2009513308 A JP2009513308 A JP 2009513308A JP 2009513308 A JP2009513308 A JP 2009513308A JP 2009539325 A5 JP2009539325 A5 JP 2009539325A5
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JP
Japan
Prior art keywords
circuit board
camera module
housing
module according
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009513308A
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English (en)
Japanese (ja)
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JP2009539325A (ja
JP4981129B2 (ja
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Publication date
Priority claimed from US11/444,277 external-priority patent/US8092102B2/en
Application filed filed Critical
Publication of JP2009539325A publication Critical patent/JP2009539325A/ja
Publication of JP2009539325A5 publication Critical patent/JP2009539325A5/ja
Application granted granted Critical
Publication of JP4981129B2 publication Critical patent/JP4981129B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009513308A 2006-05-31 2007-05-31 事前に成形されたレンズハウジングを備えるカメラモジュール及びその製造方法 Expired - Fee Related JP4981129B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/444,277 US8092102B2 (en) 2006-05-31 2006-05-31 Camera module with premolded lens housing and method of manufacture
US11/444,277 2006-05-31
PCT/US2007/013014 WO2007143134A2 (en) 2006-05-31 2007-05-31 Camera module with premolded lens housing and method of manufacture

Publications (3)

Publication Number Publication Date
JP2009539325A JP2009539325A (ja) 2009-11-12
JP2009539325A5 true JP2009539325A5 (enExample) 2010-07-15
JP4981129B2 JP4981129B2 (ja) 2012-07-18

Family

ID=38789011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009513308A Expired - Fee Related JP4981129B2 (ja) 2006-05-31 2007-05-31 事前に成形されたレンズハウジングを備えるカメラモジュール及びその製造方法

Country Status (5)

Country Link
US (2) US8092102B2 (enExample)
JP (1) JP4981129B2 (enExample)
CN (1) CN101490786B (enExample)
CA (1) CA2654422C (enExample)
WO (1) WO2007143134A2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7872686B2 (en) * 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
US7796187B2 (en) 2004-02-20 2010-09-14 Flextronics Ap Llc Wafer based camera module and method of manufacture
US7531773B2 (en) 2005-09-08 2009-05-12 Flextronics Ap, Llc Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group
CN101730863B (zh) 2007-04-24 2011-12-28 弗莱克斯电子有限责任公司 相机模块及其制造方法
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US8488046B2 (en) * 2007-12-27 2013-07-16 Digitaloptics Corporation Configurable tele wide module
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
JP5554957B2 (ja) 2009-10-09 2014-07-23 オリンパス株式会社 撮像ユニット
US9178093B2 (en) 2011-07-06 2015-11-03 Flextronics Ap, Llc Solar cell module on molded lead-frame and method of manufacture
US9136289B2 (en) * 2011-08-23 2015-09-15 Flextronics Ap, Llc Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections
TWI573407B (zh) * 2013-01-14 2017-03-01 鴻海精密工業股份有限公司 光通訊模組
US9167161B1 (en) 2013-08-30 2015-10-20 Amazon Technologies, Inc. Camera module package with a folded substrate and laterally positioned components
US9241097B1 (en) 2013-09-27 2016-01-19 Amazon Technologies, Inc. Camera module including image sensor die in molded cavity substrate
US9885879B2 (en) 2014-12-29 2018-02-06 Lg Innotek Co., Ltd. Camera module
JP7005505B2 (ja) * 2016-02-18 2022-01-21 ニンボー サニー オプテック カンパニー,リミテッド アレイ撮像モジュールおよび成形感光アセンブリ、回路基板アセンブリ、およびそれらの電子デバイス向け製造方法
EP3419275A4 (en) * 2016-02-18 2019-12-18 Ningbo Sunny Opotech Co., Ltd. CAMERA MODULE BASED ON INTEGRAL PACKING METHOD, INTEGRAL BASE COMPONENT THEREOF AND PRODUCTION METHOD THEREFOR
US10925160B1 (en) 2016-06-28 2021-02-16 Amazon Technologies, Inc. Electronic device with a display assembly and silicon circuit board substrate
US10459189B2 (en) 2016-10-05 2019-10-29 Omnivision Technologies, Inc. Lens barrel, lens-barrel wafer, and associated method
US10767164B2 (en) 2017-03-30 2020-09-08 The Research Foundation For The State University Of New York Microenvironments for self-assembly of islet organoids from stem cells differentiation
JP2020150207A (ja) 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
EP1213755A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
KR20040004472A (ko) * 1995-05-31 2004-01-13 소니 가부시끼 가이샤 촬상장치 및 그 제조방법, 촬상어댑터장치, 신호처리장치및 신호처리방법, 및 정보처리장치 및 정보처리방법
NL1003315C2 (nl) 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.
JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
DE19756292C2 (de) * 1997-12-10 1999-10-28 Mannesmann Ag Katalysator zur Umwandlung paraffinischer Kohlenwasserstoffe in korrespondierende Olefine
JP2000241696A (ja) 1999-02-17 2000-09-08 Canon Inc 光学センサーパッケージの保持・取付け方法
JP2001188155A (ja) * 1999-12-28 2001-07-10 Kuurii Components Kk 撮像素子の固定手段
US6515269B1 (en) * 2000-01-25 2003-02-04 Amkor Technology, Inc. Integrally connected image sensor packages having a window support in contact with a window and the active area
JP3651580B2 (ja) 2000-04-07 2005-05-25 三菱電機株式会社 撮像装置及びその製造方法
US6471417B1 (en) * 2000-04-27 2002-10-29 Nexfon Corporation High power optical adapter
US6384397B1 (en) 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
JP3954332B2 (ja) * 2000-07-17 2007-08-08 株式会社東芝 光学レンズユニット及びカメラモジュール
EP1180718A1 (fr) * 2000-08-11 2002-02-20 EM Microelectronic-Marin SA Appareil de prise d'images de petites dimensions, notamment appareil photographique ou caméra
JP3725012B2 (ja) * 2000-08-17 2005-12-07 シャープ株式会社 レンズ一体型固体撮像装置の製造方法
JP3887162B2 (ja) 2000-10-19 2007-02-28 富士通株式会社 撮像用半導体装置
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
JP3821652B2 (ja) * 2001-02-26 2006-09-13 三菱電機株式会社 撮像装置
US6798031B2 (en) * 2001-02-28 2004-09-28 Fujitsu Limited Semiconductor device and method for making the same
US20040012698A1 (en) * 2001-03-05 2004-01-22 Yasuo Suda Image pickup model and image pickup device
JP2003032525A (ja) * 2001-05-09 2003-01-31 Seiko Precision Inc 固体撮像装置
JP2003060948A (ja) 2001-06-05 2003-02-28 Seiko Precision Inc 固体撮像装置
US6734419B1 (en) 2001-06-28 2004-05-11 Amkor Technology, Inc. Method for forming an image sensor package with vision die in lens housing
CN1249991C (zh) 2001-08-07 2006-04-05 日立麦克赛尔株式会社 照相机组件
JP4647851B2 (ja) * 2001-08-07 2011-03-09 日立マクセル株式会社 カメラモジュール
KR100431260B1 (ko) * 2001-08-29 2004-05-12 삼성전기주식회사 이미지 모듈
JP2003078077A (ja) 2001-09-05 2003-03-14 Sanyo Electric Co Ltd カメラモジュール
JP3887208B2 (ja) 2001-10-29 2007-02-28 富士通株式会社 カメラモジュール及びその製造方法
JP4143304B2 (ja) 2002-01-24 2008-09-03 富士通株式会社 カメラモジュールの製造方法
JP2003333437A (ja) * 2002-05-13 2003-11-21 Rohm Co Ltd イメージセンサモジュールおよびその製造方法
US7304362B2 (en) * 2002-05-20 2007-12-04 Stmicroelectronics, Inc. Molded integrated circuit package with exposed active area
US7583309B2 (en) * 2002-06-28 2009-09-01 Kyocera Coproration Imaging device package camera module and camera module producing method
US20040027687A1 (en) * 2002-07-03 2004-02-12 Wilfried Bittner Compact zoom lens barrel and system
KR20070096020A (ko) 2002-09-17 2007-10-01 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
JP2004194223A (ja) 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
JP2004200965A (ja) 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
US20040150740A1 (en) * 2003-01-30 2004-08-05 Hsin Chung Hsien Miniaturized image sensor module
JP2004296453A (ja) 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
US6741405B1 (en) 2003-03-27 2004-05-25 Exquisite Optical Technology Co., Ltd Hood for a digital image collecting lens
JP4223851B2 (ja) * 2003-03-31 2009-02-12 ミツミ電機株式会社 小型カメラモジュール
US7122787B2 (en) * 2003-05-09 2006-10-17 Matsushita Electric Industrial Co., Ltd. Imaging apparatus with three dimensional circuit board
SG140461A1 (en) * 2003-07-11 2008-03-28 Konica Minolta Opto Inc Image pick-up lens, image pick-up unit, and mobile terminal provided with this image pick-up unit
US7619683B2 (en) 2003-08-29 2009-11-17 Aptina Imaging Corporation Apparatus including a dual camera module and method of using the same
US7199438B2 (en) 2003-09-23 2007-04-03 Advanced Semiconductor Engineering, Inc. Overmolded optical package
KR100541654B1 (ko) * 2003-12-02 2006-01-12 삼성전자주식회사 배선기판 및 이를 이용한 고체 촬상용 반도체 장치
US7091571B1 (en) * 2003-12-11 2006-08-15 Amkor Technology, Inc. Image sensor package and method for manufacture thereof
JP2005210628A (ja) * 2004-01-26 2005-08-04 Mitsui Chemicals Inc 撮像装置用半導体搭載用基板と撮像装置
US7796187B2 (en) * 2004-02-20 2010-09-14 Flextronics Ap Llc Wafer based camera module and method of manufacture
US7872686B2 (en) * 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
JP4446773B2 (ja) 2004-03-26 2010-04-07 富士フイルム株式会社 撮影装置
US7061106B2 (en) 2004-04-28 2006-06-13 Advanced Chip Engineering Technology Inc. Structure of image sensor module and a method for manufacturing of wafer level package
US7863702B2 (en) * 2004-06-10 2011-01-04 Samsung Electronics Co., Ltd. Image sensor package and method of manufacturing the same
KR100712509B1 (ko) * 2004-06-10 2007-04-30 삼성전자주식회사 이미지 센서 패키지 조립 방법 및 이에 의해 조립된 패키지구조
JP2005352314A (ja) 2004-06-11 2005-12-22 Canon Inc 撮像装置および電子機器
KR100652375B1 (ko) 2004-06-29 2006-12-01 삼성전자주식회사 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법
KR100674911B1 (ko) 2004-08-06 2007-01-26 삼성전자주식회사 이미지 센서 카메라 모듈 및 그 제조방법
US7329856B2 (en) * 2004-08-24 2008-02-12 Micron Technology, Inc. Image sensor having integrated infrared-filtering optical device and related method
US20060043513A1 (en) * 2004-09-02 2006-03-02 Deok-Hoon Kim Method of making camera module in wafer level
KR101107265B1 (ko) * 2004-12-31 2012-01-19 엘지디스플레이 주식회사 수평 전계 박막 트랜지스터 기판 및 그 제조 방법과, 그를이용한 액정 패널 및 그 제조 방법
TW200637017A (en) * 2005-04-14 2006-10-16 Chipmos Technologies Inc Image sensor module package
CN1892402A (zh) * 2005-07-09 2007-01-10 鸿富锦精密工业(深圳)有限公司 数码相机模块
US20070040932A1 (en) * 2005-08-19 2007-02-22 Wen-Ching Chen Image sensor module
US20070058069A1 (en) * 2005-09-14 2007-03-15 Po-Hung Chen Packaging structure of a light sensation module
KR100770684B1 (ko) 2006-05-18 2007-10-29 삼성전기주식회사 카메라 모듈 패키지
CN101086546A (zh) * 2006-06-09 2007-12-12 鸿富锦精密工业(深圳)有限公司 镜头模组及相机模组

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