CN101490786B - 具有预先模制好的透镜壳体的相机模块及制造方法 - Google Patents

具有预先模制好的透镜壳体的相机模块及制造方法 Download PDF

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Publication number
CN101490786B
CN101490786B CN2007800265424A CN200780026542A CN101490786B CN 101490786 B CN101490786 B CN 101490786B CN 2007800265424 A CN2007800265424 A CN 2007800265424A CN 200780026542 A CN200780026542 A CN 200780026542A CN 101490786 B CN101490786 B CN 101490786B
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CN
China
Prior art keywords
circuit substrate
image capture
capture device
housing
camera model
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Expired - Fee Related
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CN2007800265424A
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English (en)
Chinese (zh)
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CN101490786A (zh
Inventor
上官东恺
塞缪尔·W·塔姆
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Flextronics AP LLC
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Flextronics AP LLC
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Publication of CN101490786A publication Critical patent/CN101490786A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN2007800265424A 2006-05-31 2007-05-31 具有预先模制好的透镜壳体的相机模块及制造方法 Expired - Fee Related CN101490786B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/444,277 US8092102B2 (en) 2006-05-31 2006-05-31 Camera module with premolded lens housing and method of manufacture
US11/444,277 2006-05-31
PCT/US2007/013014 WO2007143134A2 (en) 2006-05-31 2007-05-31 Camera module with premolded lens housing and method of manufacture

Publications (2)

Publication Number Publication Date
CN101490786A CN101490786A (zh) 2009-07-22
CN101490786B true CN101490786B (zh) 2013-05-08

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Family Applications (1)

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CN2007800265424A Expired - Fee Related CN101490786B (zh) 2006-05-31 2007-05-31 具有预先模制好的透镜壳体的相机模块及制造方法

Country Status (5)

Country Link
US (2) US8092102B2 (enExample)
JP (1) JP4981129B2 (enExample)
CN (1) CN101490786B (enExample)
CA (1) CA2654422C (enExample)
WO (1) WO2007143134A2 (enExample)

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JP6829259B2 (ja) 2016-02-18 2021-02-10 ニンボー サニー オプテック カンパニー，リミテッド 一体パッケージングプロセスベースのカメラモジュール、その一体ベース部品、およびその製造方法
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US10459189B2 (en) 2016-10-05 2019-10-29 Omnivision Technologies, Inc. Lens barrel, lens-barrel wafer, and associated method
US10767164B2 (en) 2017-03-30 2020-09-08 The Research Foundation For The State University Of New York Microenvironments for self-assembly of islet organoids from stem cells differentiation
JP2020150207A (ja) 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器

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Also Published As

Publication number Publication date
CN101490786A (zh) 2009-07-22
JP2009539325A (ja) 2009-11-12
CA2654422C (en) 2015-08-11
US8092102B2 (en) 2012-01-10
WO2007143134A2 (en) 2007-12-13
JP4981129B2 (ja) 2012-07-18
US20110299848A1 (en) 2011-12-08
WO2007143134A3 (en) 2008-10-30
US20070278394A1 (en) 2007-12-06
CA2654422A1 (en) 2007-12-13

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