JP2009512346A5 - - Google Patents

Download PDF

Info

Publication number
JP2009512346A5
JP2009512346A5 JP2008535619A JP2008535619A JP2009512346A5 JP 2009512346 A5 JP2009512346 A5 JP 2009512346A5 JP 2008535619 A JP2008535619 A JP 2008535619A JP 2008535619 A JP2008535619 A JP 2008535619A JP 2009512346 A5 JP2009512346 A5 JP 2009512346A5
Authority
JP
Japan
Prior art keywords
lens
image pickup
manufacturing
camera module
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008535619A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009512346A (ja
Filing date
Publication date
Priority claimed from US11/247,993 external-priority patent/US7796187B2/en
Application filed filed Critical
Publication of JP2009512346A publication Critical patent/JP2009512346A/ja
Publication of JP2009512346A5 publication Critical patent/JP2009512346A5/ja
Pending legal-status Critical Current

Links

JP2008535619A 2005-10-11 2006-10-10 ウェハー基板付カメラモジュール及び製造方法 Pending JP2009512346A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/247,993 US7796187B2 (en) 2004-02-20 2005-10-11 Wafer based camera module and method of manufacture
PCT/US2006/039521 WO2007047254A2 (en) 2005-10-11 2006-10-10 Wafer based camera module and method of manufacture

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013057363A Division JP2013214964A (ja) 2005-10-11 2013-03-19 ウェハー基板付カメラモジュール及び製造方法

Publications (2)

Publication Number Publication Date
JP2009512346A JP2009512346A (ja) 2009-03-19
JP2009512346A5 true JP2009512346A5 (enExample) 2009-11-26

Family

ID=37963050

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008535619A Pending JP2009512346A (ja) 2005-10-11 2006-10-10 ウェハー基板付カメラモジュール及び製造方法
JP2013057363A Pending JP2013214964A (ja) 2005-10-11 2013-03-19 ウェハー基板付カメラモジュール及び製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013057363A Pending JP2013214964A (ja) 2005-10-11 2013-03-19 ウェハー基板付カメラモジュール及び製造方法

Country Status (7)

Country Link
US (1) US7796187B2 (enExample)
EP (1) EP1943833B1 (enExample)
JP (2) JP2009512346A (enExample)
CN (2) CN102761697B (enExample)
CA (1) CA2625587A1 (enExample)
TW (1) TWI392337B (enExample)
WO (1) WO2007047254A2 (enExample)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7872686B2 (en) * 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
US7531773B2 (en) 2005-09-08 2009-05-12 Flextronics Ap, Llc Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group
JP2007253502A (ja) * 2006-03-24 2007-10-04 Seiko Epson Corp 電気光学装置、画像形成装置および電気光学装置の製造方法
US20070236591A1 (en) * 2006-04-11 2007-10-11 Tam Samuel W Method for mounting protective covers over image capture devices and devices manufactured thereby
US8092102B2 (en) * 2006-05-31 2012-01-10 Flextronics Ap Llc Camera module with premolded lens housing and method of manufacture
US8456560B2 (en) * 2007-01-26 2013-06-04 Digitaloptics Corporation Wafer level camera module and method of manufacture
US8546739B2 (en) * 2007-03-30 2013-10-01 Min-Chih Hsuan Manufacturing method of wafer level chip scale package of image-sensing module
CA2685080A1 (en) * 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
KR20090033070A (ko) * 2007-09-27 2009-04-01 엘지이노텍 주식회사 카메라 모듈
CN101447474B (zh) * 2007-11-27 2011-03-30 鸿富锦精密工业（深圳）有限公司 影像感测晶片封装结构及其应用的成像模组
US8488046B2 (en) * 2007-12-27 2013-07-16 Digitaloptics Corporation Configurable tele wide module
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
EP2094000A3 (de) 2008-02-22 2013-06-05 Silicon Micro Sensors GmbH Bilderfassungsvorrichtung einer Kamera
US8004602B2 (en) * 2008-05-16 2011-08-23 Kingpak Technology Inc. Image sensor structure and integrated lens module thereof
KR100959857B1 (ko) * 2008-05-21 2010-05-28 삼성전기주식회사 카메라 모듈
US8023261B2 (en) 2008-09-05 2011-09-20 Apple Inc. Electronic device assembly
TW201033641A (en) 2008-09-18 2010-09-16 Tessera North America Inc Recessed optical surfaces
US8063975B2 (en) * 2008-10-29 2011-11-22 Jabil Circuit, Inc. Positioning wafer lenses on electronic imagers
WO2010129039A1 (en) * 2009-05-05 2010-11-11 Tessera Technologies Hungary Kft. Folded optic, camera system including the same, and associated methods
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
JP4886016B2 (ja) * 2009-10-08 2012-02-29 シャープ株式会社 撮像レンズ、撮像モジュール、撮像レンズの製造方法、および、撮像モジュールの製造方法
EP2524264A4 (en) 2010-01-11 2014-02-19 Flextronics Ap Llc CAMERA MODULE WITH A HOLDER FOR A MOLDED BAND FLIP CHIP IMAGER AND METHOD OF MANUFACTURING THEREOF
US8797721B2 (en) 2010-02-02 2014-08-05 Apple Inc. Portable electronic device housing with outer glass surfaces
US8607444B2 (en) * 2010-03-06 2013-12-17 Apple Inc. Method for forming a housing of an electronic device
WO2011120481A1 (de) * 2010-04-01 2011-10-06 Conti Temic Microelectronic Gmbh Vorrichtung mit optischem modul und objektivhalter
US8982269B2 (en) * 2010-09-27 2015-03-17 Omnivision Technologies, Inc. Mechanical assembly for fine focus of a wafer-level camera module, and associated methods
US9235240B2 (en) 2010-11-11 2016-01-12 Apple Inc. Insert molding around glass members for portable electronic devices
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US9182789B2 (en) 2011-03-01 2015-11-10 Apple Inc. Transparent electronic device components with opaque edge coverings
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
US20120242814A1 (en) 2011-03-25 2012-09-27 Kenneth Kubala Miniature Wafer-Level Camera Modules
WO2013006811A1 (en) 2011-07-06 2013-01-10 Flextronics Ap, Llc Camera module with magnetic shielding and method of manufacture
US9178093B2 (en) 2011-07-06 2015-11-03 Flextronics Ap, Llc Solar cell module on molded lead-frame and method of manufacture
TW201307980A (zh) * 2011-08-10 2013-02-16 Hon Hai Prec Ind Co Ltd 相機模組
US9136289B2 (en) 2011-08-23 2015-09-15 Flextronics Ap, Llc Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections
US8810721B2 (en) * 2011-09-02 2014-08-19 Himax Technologies Limited Camera module
CN103051831B (zh) * 2011-10-14 2016-05-04 奇景光电股份有限公司 摄像装置
US20130258182A1 (en) * 2012-03-30 2013-10-03 Omnivision Technologies, Inc. Wafer level camera module with protective tube
US8804032B2 (en) * 2012-03-30 2014-08-12 Omnivision Technologies, Inc. Wafer level camera module with snap-in latch
TWI707483B (zh) * 2012-07-17 2020-10-11 新加坡商新加坡恒立私人有限公司 發射可變強度分布的光線的光電模組
EP2712173B1 (en) * 2012-09-19 2017-04-05 LG Innotek Co., Ltd. Camera module
CN103780803A (zh) * 2012-10-23 2014-05-07 鸿富锦精密工业（深圳）有限公司 取像模组
US9871898B2 (en) 2013-05-08 2018-01-16 Apple Inc. Ceramic cover for electronic device housing
US9231124B2 (en) * 2013-09-25 2016-01-05 Delphi Technologies, Inc. Ball grid array packaged camera device soldered to a substrate
US9965856B2 (en) 2013-10-22 2018-05-08 Seegrid Corporation Ranging cameras using a common substrate
US9467606B2 (en) * 2014-06-10 2016-10-11 Omnivision Technologies, Inc. Wafer level stepped sensor holder
US10437025B2 (en) 2015-01-26 2019-10-08 Omnivision Technologies, Inc. Wafer-level lens packaging methods, and associated lens assemblies and camera modules
US10455131B2 (en) * 2015-01-26 2019-10-22 Omnivision Technologies, Inc. Wafer-level methods for packing camera modules, and associated camera modules
US9431442B2 (en) 2015-02-02 2016-08-30 Apple Inc. Overmolded reconstructed camera module
US9955054B2 (en) 2015-02-05 2018-04-24 Robert Bosch Gmbh Camera and method for assembling with fixed final alignment
US10194071B2 (en) 2015-04-03 2019-01-29 Red.Com, Llc Modular motion camera
CN107439003B (zh) 2015-04-03 2019-03-22 Red.Com有限责任公司 模块化运动相机
CN106303144B (zh) * 2015-06-02 2019-10-29 菱光科技股份有限公司 接触式影像感测模块的晶圆级透镜结构
US10523854B2 (en) 2015-06-25 2019-12-31 Intel Corporation Array imaging system having discrete camera modules and method for manufacturing the same
US9780133B2 (en) * 2015-08-04 2017-10-03 Creative Sensor Inc. Wafer-level lens structure for contact image sensor module
US9973669B2 (en) * 2015-08-28 2018-05-15 Apple Inc. Dual overmolded reconstructed camera module
CN109547680A (zh) * 2016-02-18 2019-03-29 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
EP3429181B1 (en) 2016-03-12 2024-10-16 Ningbo Sunny Opotech Co., Ltd. Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
CN107544195A (zh) * 2016-06-23 2018-01-05 宁波舜宇光电信息有限公司 定焦摄像模组及其调焦装置和调焦方法
EP3477352B1 (en) 2016-06-23 2023-07-26 Ningbo Sunny Opotech Co., Ltd. Fixed-focus camera module
US10122903B2 (en) * 2016-06-25 2018-11-06 Omnivision Technologies, Inc. Bezels for die level packaging of camera modules, and associated camera modules and methods
CN107995386B (zh) * 2016-10-26 2021-01-26 光宝电子(广州)有限公司 相机模块
JP6427691B2 (ja) * 2016-11-30 2018-11-21 株式会社ダイセル 撮像装置用レンズモジュール及びその製造方法
EP3582484A4 (en) * 2017-02-08 2020-11-04 Ningbo Sunny Opotech Co., Ltd. PHOTOGRAPHIC CAMERA MODULE, ASSOCIATED MOLDED PHOTOSENSITIVE ASSEMBLY, ASSOCIATED MANUFACTURING PROCESS AND ELECTRONIC DEVICE
WO2019090037A1 (en) * 2017-11-03 2019-05-09 Trw Automotive U.S. Llc A driver assist system
US11474254B2 (en) 2017-11-07 2022-10-18 Piaggio Fast Forward Inc. Multi-axes scanning system from single-axis scanner
US10804305B2 (en) * 2018-04-23 2020-10-13 Sunny Opotech North America Inc. Manufacture of semiconductor module with dual molding
CN108469663B (zh) * 2018-05-17 2024-01-19 深圳市锐伺科技有限公司 一种镜头组件与芯片组件的组装工艺和对位装置
EP3809685B1 (en) * 2018-06-12 2025-11-26 Ningbo Sunny Opotech Co., Ltd. Camera unit with light deflection mechanism, and application thereof
US10694010B2 (en) * 2018-07-06 2020-06-23 Apple Inc. Cover sheet and incorporated lens for a camera of an electronic device
CN112563155A (zh) 2019-09-26 2021-03-26 伟创力有限公司 在模制电子装置中形成暴露腔的方法
JP2021140000A (ja) * 2020-03-04 2021-09-16 Ｎｅｃエンベデッドプロダクツ株式会社 電子部品及び電子部品の製造方法
US20210314468A1 (en) * 2020-04-03 2021-10-07 Facebook Technologies, Llc Small Camera with Molding Compound
DE102021113714A1 (de) * 2021-05-27 2022-12-01 Connaught Electronics Ltd. Kamera für ein Kraftfahrzeug mit spezifischer Linsenheizung, sowie Kraftfahrzeug
US12153279B2 (en) 2021-09-16 2024-11-26 Banner Engineering Corp. Lens alignment system with multiple degrees of freedom

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
EP0773673A4 (en) * 1995-05-31 2001-05-23 Sony Corp IMAGE RECORDING DEVICE, METHOD FOR THE PRODUCTION THEREOF, IMAGE RECORDING ADAPTER, DEVICE AND METHOD FOR THE SIGNAL AND INFORMATION PROCESSING
NL1003315C2 (nl) 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.
JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
JP3651580B2 (ja) 2000-04-07 2005-05-25 三菱電機株式会社 撮像装置及びその製造方法
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
EP1180718A1 (fr) * 2000-08-11 2002-02-20 EM Microelectronic-Marin SA Appareil de prise d'images de petites dimensions, notamment appareil photographique ou caméra
JP3887162B2 (ja) * 2000-10-19 2007-02-28 富士通株式会社 撮像用半導体装置
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
JP3821652B2 (ja) * 2001-02-26 2006-09-13 三菱電機株式会社 撮像装置
US6798031B2 (en) * 2001-02-28 2004-09-28 Fujitsu Limited Semiconductor device and method for making the same
US20040012698A1 (en) * 2001-03-05 2004-01-22 Yasuo Suda Image pickup model and image pickup device
JP3898071B2 (ja) * 2001-05-01 2007-03-28 セイコープレシジョン株式会社 固体撮像装置
JP2003060948A (ja) * 2001-06-05 2003-02-28 Seiko Precision Inc 固体撮像装置
US6734419B1 (en) * 2001-06-28 2004-05-11 Amkor Technology, Inc. Method for forming an image sensor package with vision die in lens housing
WO2003015400A1 (fr) * 2001-08-07 2003-02-20 Hitachi Maxell, Ltd Module de camera
JP2003078077A (ja) 2001-09-05 2003-03-14 Sanyo Electric Co Ltd カメラモジュール
JP3887208B2 (ja) 2001-10-29 2007-02-28 富士通株式会社 カメラモジュール及びその製造方法
JP2003333437A (ja) * 2002-05-13 2003-11-21 Rohm Co Ltd イメージセンサモジュールおよびその製造方法
US20040027687A1 (en) * 2002-07-03 2004-02-12 Wilfried Bittner Compact zoom lens barrel and system
CN100440544C (zh) 2002-09-17 2008-12-03 安特约恩股份有限公司 照相装置、制造照相装置的方法以及晶片尺度的封装
JP2004194223A (ja) 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
JP2004200965A (ja) * 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
JP4131673B2 (ja) * 2003-02-07 2008-08-13 日立マクセル株式会社 カメラモジュールとその製造方法
US6741405B1 (en) * 2003-03-27 2004-05-25 Exquisite Optical Technology Co., Ltd Hood for a digital image collecting lens
US7122787B2 (en) * 2003-05-09 2006-10-17 Matsushita Electric Industrial Co., Ltd. Imaging apparatus with three dimensional circuit board
US7619683B2 (en) * 2003-08-29 2009-11-17 Aptina Imaging Corporation Apparatus including a dual camera module and method of using the same
US7199438B2 (en) * 2003-09-23 2007-04-03 Advanced Semiconductor Engineering, Inc. Overmolded optical package
US7091571B1 (en) * 2003-12-11 2006-08-15 Amkor Technology, Inc. Image sensor package and method for manufacture thereof
US7872686B2 (en) * 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
JP4446773B2 (ja) * 2004-03-26 2010-04-07 富士フイルム株式会社 撮影装置
US7061106B2 (en) * 2004-04-28 2006-06-13 Advanced Chip Engineering Technology Inc. Structure of image sensor module and a method for manufacturing of wafer level package
JP5252770B2 (ja) 2004-06-10 2013-07-31 三星電子株式会社 イメージセンサーパッケージの組立方法
JP2005352314A (ja) 2004-06-11 2005-12-22 Canon Inc 撮像装置および電子機器
KR100652375B1 (ko) * 2004-06-29 2006-12-01 삼성전자주식회사 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법
KR100674911B1 (ko) * 2004-08-06 2007-01-26 삼성전자주식회사 이미지 센서 카메라 모듈 및 그 제조방법
US20070058069A1 (en) 2005-09-14 2007-03-15 Po-Hung Chen Packaging structure of a light sensation module
US8092102B2 (en) 2006-05-31 2012-01-10 Flextronics Ap Llc Camera module with premolded lens housing and method of manufacture

Similar Documents

Publication Publication Date Title
JP2009512346A5 (enExample)
CN108243298B (zh) 摄像模组及其模塑电路板组件和制造方法以及带有摄像模组的电子设备
KR101390299B1 (ko) 몰딩된 하우징을 구비한 웨이퍼 수준 카메라 및 그 제조방법
JP7061130B2 (ja) 撮像モジュールおよびそのモールド感光アセンブリと製造方法、ならびに電子機器
CN101490786B (zh) 具有预先模制好的透镜壳体的相机模块及制造方法
CN102761697B (zh) 基于晶片的照相模块及其制造方法
US8199250B2 (en) Camera module package
JP2007523568A5 (enExample)
KR100824812B1 (ko) 초소형 카메라 모듈 및 그 제조 방법
US7539412B2 (en) Camera module with first and second image sensor chips, holders and lens
JP2014194585A (ja) ウエハーレベル光学部品を用いた自動焦点／ズームモジュール
KR101455124B1 (ko) 촬상 센서 패키지를 구비한 촬상장치
KR20110127913A (ko) 카메라 모듈
JP2011035458A5 (enExample)
TWI698009B (zh) 感光晶片封裝模組及其形成方法
CN110649048A (zh) 感光芯片封装模组及其形成方法
CN111866323A (zh) 摄像模组及其感光组件、电子设备和制备方法
CN108401089B (zh) 摄像模组和摄像模组的模制电路板组件及其制造方法以及带有摄像模组的电子设备
US8951858B2 (en) Imager device with electric connections to electrical device
JP2005210628A (ja) 撮像装置用半導体搭載用基板と撮像装置
CN103685881A (zh) 照相机模块
CN110290293B (zh) 感光模块
CN103081105B (zh) 图像拾取装置、图像拾取模块和照相机
JP4017908B2 (ja) カメラ
CN108965649A (zh) 阵列摄像模组及其模塑电路板组件以及制造方法和电子设备