JP2009512346A5 - - Google Patents
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- Publication number
- JP2009512346A5 JP2009512346A5 JP2008535619A JP2008535619A JP2009512346A5 JP 2009512346 A5 JP2009512346 A5 JP 2009512346A5 JP 2008535619 A JP2008535619 A JP 2008535619A JP 2008535619 A JP2008535619 A JP 2008535619A JP 2009512346 A5 JP2009512346 A5 JP 2009512346A5
- Authority
- JP
- Japan
- Prior art keywords
- lens
- image pickup
- manufacturing
- camera module
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims 21
- 239000000758 substrate Substances 0.000 claims 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 15
- 229910052710 silicon Inorganic materials 0.000 claims 15
- 239000010703 silicon Substances 0.000 claims 15
- 230000001681 protective effect Effects 0.000 claims 9
- 238000004891 communication Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 238000000465 moulding Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 2
- 238000003384 imaging method Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 125000006850 spacer group Chemical group 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/247,993 US7796187B2 (en) | 2004-02-20 | 2005-10-11 | Wafer based camera module and method of manufacture |
| PCT/US2006/039521 WO2007047254A2 (en) | 2005-10-11 | 2006-10-10 | Wafer based camera module and method of manufacture |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013057363A Division JP2013214964A (ja) | 2005-10-11 | 2013-03-19 | ウェハー基板付カメラモジュール及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009512346A JP2009512346A (ja) | 2009-03-19 |
| JP2009512346A5 true JP2009512346A5 (enExample) | 2009-11-26 |
Family
ID=37963050
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008535619A Pending JP2009512346A (ja) | 2005-10-11 | 2006-10-10 | ウェハー基板付カメラモジュール及び製造方法 |
| JP2013057363A Pending JP2013214964A (ja) | 2005-10-11 | 2013-03-19 | ウェハー基板付カメラモジュール及び製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013057363A Pending JP2013214964A (ja) | 2005-10-11 | 2013-03-19 | ウェハー基板付カメラモジュール及び製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7796187B2 (enExample) |
| EP (1) | EP1943833B1 (enExample) |
| JP (2) | JP2009512346A (enExample) |
| CN (2) | CN102761697B (enExample) |
| CA (1) | CA2625587A1 (enExample) |
| TW (1) | TWI392337B (enExample) |
| WO (1) | WO2007047254A2 (enExample) |
Families Citing this family (76)
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| US8546739B2 (en) * | 2007-03-30 | 2013-10-01 | Min-Chih Hsuan | Manufacturing method of wafer level chip scale package of image-sensing module |
| WO2008133943A1 (en) * | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Small form factor modules using wafer level optics with bottom cavity and flip chip assembly |
| US7825985B2 (en) | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
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| EP2094000A3 (de) | 2008-02-22 | 2013-06-05 | Silicon Micro Sensors GmbH | Bilderfassungsvorrichtung einer Kamera |
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| US10009528B2 (en) | 2011-02-24 | 2018-06-26 | Nan Chang O-Film Optoelectronics Technology Ltd | Autofocus camera module packaging with circuitry-integrated actuator system |
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| WO2013006811A1 (en) | 2011-07-06 | 2013-01-10 | Flextronics Ap, Llc | Camera module with magnetic shielding and method of manufacture |
| US9178093B2 (en) | 2011-07-06 | 2015-11-03 | Flextronics Ap, Llc | Solar cell module on molded lead-frame and method of manufacture |
| TW201307980A (zh) * | 2011-08-10 | 2013-02-16 | Hon Hai Prec Ind Co Ltd | 相機模組 |
| US9136289B2 (en) * | 2011-08-23 | 2015-09-15 | Flextronics Ap, Llc | Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections |
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| TWI707483B (zh) * | 2012-07-17 | 2020-10-11 | 新加坡商新加坡恒立私人有限公司 | 發射可變強度分布的光線的光電模組 |
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| US10437025B2 (en) | 2015-01-26 | 2019-10-08 | Omnivision Technologies, Inc. | Wafer-level lens packaging methods, and associated lens assemblies and camera modules |
| US10455131B2 (en) * | 2015-01-26 | 2019-10-22 | Omnivision Technologies, Inc. | Wafer-level methods for packing camera modules, and associated camera modules |
| US9431442B2 (en) | 2015-02-02 | 2016-08-30 | Apple Inc. | Overmolded reconstructed camera module |
| US9955054B2 (en) | 2015-02-05 | 2018-04-24 | Robert Bosch Gmbh | Camera and method for assembling with fixed final alignment |
| CA3029573A1 (en) | 2015-04-03 | 2016-10-06 | Red.Com, Llc | Modular motion camera |
| US10194071B2 (en) | 2015-04-03 | 2019-01-29 | Red.Com, Llc | Modular motion camera |
| CN106303144B (zh) * | 2015-06-02 | 2019-10-29 | 菱光科技股份有限公司 | 接触式影像感测模块的晶圆级透镜结构 |
| US10523854B2 (en) | 2015-06-25 | 2019-12-31 | Intel Corporation | Array imaging system having discrete camera modules and method for manufacturing the same |
| US9780133B2 (en) * | 2015-08-04 | 2017-10-03 | Creative Sensor Inc. | Wafer-level lens structure for contact image sensor module |
| US9973669B2 (en) | 2015-08-28 | 2018-05-15 | Apple Inc. | Dual overmolded reconstructed camera module |
| CN109547680A (zh) * | 2016-02-18 | 2019-03-29 | 宁波舜宇光电信息有限公司 | 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法 |
| KR102335306B1 (ko) | 2016-03-12 | 2021-12-03 | 닝보 써니 오포테크 코., 엘티디. | 어레이 이미징 모듈, 성형 감광성 어셈블리 및 그 제조 방법, 및 전자 장치 |
| TWM559423U (zh) | 2016-06-23 | 2018-05-01 | Ningbo Sunny Opotech Co Ltd | 定焦攝像模組 |
| CN107544195A (zh) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | 定焦摄像模组及其调焦装置和调焦方法 |
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| CN107995386B (zh) * | 2016-10-26 | 2021-01-26 | 光宝电子(广州)有限公司 | 相机模块 |
| US11099347B2 (en) * | 2016-11-30 | 2021-08-24 | Daicel Corporation | Lens module for imaging device, and method for producing lens module |
| US10979610B2 (en) | 2017-02-08 | 2021-04-13 | Ningbo Sunny Opotech Co., Ltd. | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device |
| DE112018005175T5 (de) * | 2017-11-03 | 2020-07-02 | ZF Active Safety and Electronices U.S. LLC | Fahrunterstützungssystem |
| US11474254B2 (en) | 2017-11-07 | 2022-10-18 | Piaggio Fast Forward Inc. | Multi-axes scanning system from single-axis scanner |
| US10804305B2 (en) * | 2018-04-23 | 2020-10-13 | Sunny Opotech North America Inc. | Manufacture of semiconductor module with dual molding |
| CN108469663B (zh) * | 2018-05-17 | 2024-01-19 | 深圳市锐伺科技有限公司 | 一种镜头组件与芯片组件的组装工艺和对位装置 |
| EP3809685B1 (en) * | 2018-06-12 | 2025-11-26 | Ningbo Sunny Opotech Co., Ltd. | Camera unit with light deflection mechanism, and application thereof |
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| CN112563155A (zh) * | 2019-09-26 | 2021-03-26 | 伟创力有限公司 | 在模制电子装置中形成暴露腔的方法 |
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| US20070058069A1 (en) | 2005-09-14 | 2007-03-15 | Po-Hung Chen | Packaging structure of a light sensation module |
| US8092102B2 (en) | 2006-05-31 | 2012-01-10 | Flextronics Ap Llc | Camera module with premolded lens housing and method of manufacture |
-
2005
- 2005-10-11 US US11/247,993 patent/US7796187B2/en active Active
-
2006
- 2006-09-26 TW TW095135550A patent/TWI392337B/zh active
- 2006-10-10 CN CN201210238583.2A patent/CN102761697B/zh not_active Expired - Fee Related
- 2006-10-10 WO PCT/US2006/039521 patent/WO2007047254A2/en not_active Ceased
- 2006-10-10 CN CNA2006800465252A patent/CN101326811A/zh active Pending
- 2006-10-10 JP JP2008535619A patent/JP2009512346A/ja active Pending
- 2006-10-10 CA CA002625587A patent/CA2625587A1/en not_active Abandoned
- 2006-10-10 EP EP06816608A patent/EP1943833B1/en not_active Not-in-force
-
2013
- 2013-03-19 JP JP2013057363A patent/JP2013214964A/ja active Pending
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